TWI491064B - Iii族氮化物半導體發光元件及該製造方法、以及燈 - Google Patents

Iii族氮化物半導體發光元件及該製造方法、以及燈 Download PDF

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TWI491064B
TWI491064B TW097124942A TW97124942A TWI491064B TW I491064 B TWI491064 B TW I491064B TW 097124942 A TW097124942 A TW 097124942A TW 97124942 A TW97124942 A TW 97124942A TW I491064 B TWI491064 B TW I491064B
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layer
group iii
intermediate layer
iii nitride
substrate
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TW097124942A
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Chinese (zh)
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TW200917529A (en
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加治亘章
三木久幸
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豐田合成股份有限公司
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    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
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TW097124942A 2007-07-04 2008-07-02 Iii族氮化物半導體發光元件及該製造方法、以及燈 TWI491064B (zh)

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Application Number Priority Date Filing Date Title
JP2007176099A JP4714712B2 (ja) 2007-07-04 2007-07-04 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ

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TW200917529A TW200917529A (en) 2009-04-16
TWI491064B true TWI491064B (zh) 2015-07-01

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US (1) US8674398B2 (enExample)
JP (1) JP4714712B2 (enExample)
KR (1) KR101042417B1 (enExample)
CN (1) CN101689592B (enExample)
TW (1) TWI491064B (enExample)
WO (1) WO2009005126A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5564331B2 (ja) 2009-05-29 2014-07-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN102034912B (zh) * 2009-12-29 2015-03-25 比亚迪股份有限公司 发光二极管外延片、其制作方法及芯片的制作方法
KR101484658B1 (ko) * 2010-04-30 2015-01-21 캐논 아네르바 가부시키가이샤 에피텍셜 박막형성방법, 진공처리장치, 반도체 발광소자 제조방법, 반도체 발광소자, 및 조명장치
JP2012243780A (ja) * 2011-05-13 2012-12-10 Toshiba Corp 半導体発光素子及びウェーハ
WO2014008162A1 (en) 2012-07-02 2014-01-09 Applied Materials, Inc. Aluminum-nitride buffer and active layers by physical vapor deposition
JP5734935B2 (ja) * 2012-09-20 2015-06-17 株式会社東芝 半導体装置及びその製造方法
US9368939B2 (en) 2013-10-18 2016-06-14 Soraa Laser Diode, Inc. Manufacturable laser diode formed on C-plane gallium and nitrogen material
US9362715B2 (en) 2014-02-10 2016-06-07 Soraa Laser Diode, Inc Method for manufacturing gallium and nitrogen bearing laser devices with improved usage of substrate material
US9520695B2 (en) * 2013-10-18 2016-12-13 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser device having confinement region
US9379525B2 (en) 2014-02-10 2016-06-28 Soraa Laser Diode, Inc. Manufacturable laser diode
US9520697B2 (en) 2014-02-10 2016-12-13 Soraa Laser Diode, Inc. Manufacturable multi-emitter laser diode
US9871350B2 (en) 2014-02-10 2018-01-16 Soraa Laser Diode, Inc. Manufacturable RGB laser diode source
JP2014241417A (ja) * 2014-07-15 2014-12-25 シャープ株式会社 アルミニウム含有窒化物中間層の製造方法、窒化物層の製造方法および窒化物半導体素子の製造方法
TWI553901B (zh) * 2015-09-07 2016-10-11 環球晶圓股份有限公司 紫外光發光二極體及其製造方法
WO2017094028A1 (en) * 2015-12-02 2017-06-08 Indian Institute Of Technology Bombay Method and apparatus for forming silicon doped gallium nitride (gan) films by a co-sputtering technique
JP7055595B2 (ja) * 2017-03-29 2022-04-18 古河機械金属株式会社 Iii族窒化物半導体基板、及び、iii族窒化物半導体基板の製造方法
JP7112190B2 (ja) * 2017-09-29 2022-08-03 日機装株式会社 発光装置
FI129628B (en) * 2019-09-25 2022-05-31 Beneq Oy Method and apparatus for processing surface of a substrate
US12191626B1 (en) 2020-07-31 2025-01-07 Kyocera Sld Laser, Inc. Vertically emitting laser devices and chip-scale-package laser devices and laser-based, white light emitting devices
CN114910828B (zh) * 2022-05-16 2024-08-16 中国工程物理研究院激光聚变研究中心 一种判断量子级联激光器快速退火效果的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332234A (ja) * 2002-05-15 2003-11-21 Kyocera Corp 窒化層を有するサファイア基板およびその製造方法
US20070045654A1 (en) * 2005-08-30 2007-03-01 Samsung Electro-Mechanics Co., Ltd. Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD142966A1 (de) * 1979-05-07 1980-07-23 Reinhard Voigt Verfahren zur in situ-vorbehandlung und zur beschichtungvon substraten mit duennen schichten
JPS60173829A (ja) 1984-02-14 1985-09-07 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体薄膜の成長方法
JP3026087B2 (ja) 1989-03-01 2000-03-27 豊田合成株式会社 窒化ガリウム系化合物半導体の気相成長方法
JPH088217B2 (ja) 1991-01-31 1996-01-29 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
JPH06120163A (ja) 1992-09-30 1994-04-28 Victor Co Of Japan Ltd 半導体装置の電極形成方法
JP3773282B2 (ja) 1995-03-27 2006-05-10 豊田合成株式会社 窒化ガリウム系化合物半導体の電極形成方法
JPH0964477A (ja) * 1995-08-25 1997-03-07 Toshiba Corp 半導体発光素子及びその製造方法
JPH11102907A (ja) * 1997-09-26 1999-04-13 Sharp Corp 半導体装置の製造方法および絶縁膜形成装置
JP2000216249A (ja) * 1998-11-16 2000-08-04 Sony Corp 電子装置の製造方法及びその装置
JP3700492B2 (ja) 1999-09-21 2005-09-28 豊田合成株式会社 Iii族窒化物系化合物半導体素子
JP3440873B2 (ja) 1999-03-31 2003-08-25 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
JP2001168386A (ja) 1999-09-29 2001-06-22 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子
US6406931B1 (en) * 1999-10-12 2002-06-18 Sandia Corporation Structural tuning of residual conductivity in highly mismatched III-V layers
JP2001185493A (ja) * 1999-12-24 2001-07-06 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子
JP3994623B2 (ja) * 2000-04-21 2007-10-24 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
JP4963763B2 (ja) 2000-12-21 2012-06-27 日本碍子株式会社 半導体素子
JP2003119564A (ja) 2001-10-12 2003-04-23 Tokyo Electron Ltd 成膜方法及びプラズマcvd装置
JP2003183823A (ja) * 2001-12-17 2003-07-03 Sharp Corp スパッタ装置
JP4123828B2 (ja) 2002-05-27 2008-07-23 豊田合成株式会社 半導体発光素子
JP2005209925A (ja) 2004-01-23 2005-08-04 Nichia Chem Ind Ltd 積層半導体基板
JP2006114886A (ja) 2004-09-14 2006-04-27 Showa Denko Kk n型III族窒化物半導体積層構造体
JP5004432B2 (ja) * 2005-04-11 2012-08-22 東京エレクトロン株式会社 金属シリサイド膜を形成する方法、前処理方法、成膜システム、制御プログラムおよびコンピュータ記憶媒体
JP4912843B2 (ja) * 2006-11-22 2012-04-11 昭和電工株式会社 Iii族窒化物化合物半導体発光素子の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332234A (ja) * 2002-05-15 2003-11-21 Kyocera Corp 窒化層を有するサファイア基板およびその製造方法
US20070045654A1 (en) * 2005-08-30 2007-03-01 Samsung Electro-Mechanics Co., Ltd. Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device

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