JP2008510966A5 - - Google Patents
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- Publication number
- JP2008510966A5 JP2008510966A5 JP2007528044A JP2007528044A JP2008510966A5 JP 2008510966 A5 JP2008510966 A5 JP 2008510966A5 JP 2007528044 A JP2007528044 A JP 2007528044A JP 2007528044 A JP2007528044 A JP 2007528044A JP 2008510966 A5 JP2008510966 A5 JP 2008510966A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- contact element
- support substrate
- spring contact
- additional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 51
- 239000000853 adhesive Substances 0.000 claims 9
- 230000001070 adhesive effect Effects 0.000 claims 9
- 229920002120 photoresistant polymer Polymers 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 230000035515 penetration Effects 0.000 claims 5
- 239000004593 Epoxy Substances 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 238000001459 lithography Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 239000011324 bead Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 239000000523 sample Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/922,486 US7459795B2 (en) | 2004-08-19 | 2004-08-19 | Method to build a wirebond probe card in a many at a time fashion |
| PCT/US2005/029581 WO2006023741A2 (en) | 2004-08-19 | 2005-08-19 | Method to build a wirebond probe card in a many at a time fashion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008510966A JP2008510966A (ja) | 2008-04-10 |
| JP2008510966A5 true JP2008510966A5 (enExample) | 2008-10-09 |
Family
ID=35910115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007528044A Pending JP2008510966A (ja) | 2004-08-19 | 2005-08-19 | 一度に多数方式でワイヤボンドプローブカードを作製する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7459795B2 (enExample) |
| EP (1) | EP1779128A2 (enExample) |
| JP (1) | JP2008510966A (enExample) |
| KR (2) | KR20070053743A (enExample) |
| CN (1) | CN101292337B (enExample) |
| TW (1) | TWI410648B (enExample) |
| WO (1) | WO2006023741A2 (enExample) |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
| USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
| US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
| US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
| US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
| US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
| US7459795B2 (en) | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
| JP4651359B2 (ja) * | 2004-10-29 | 2011-03-16 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US7898276B2 (en) * | 2005-03-01 | 2011-03-01 | Sv Probe Pte Ltd. | Probe card with stacked substrate |
| TWI273246B (en) * | 2005-05-25 | 2007-02-11 | Chipmos Technologies Inc | Elastic probe pins in row and method for fabricating the same |
| EA012455B1 (ru) * | 2005-06-17 | 2009-10-30 | Шелл Интернэшнл Рисерч Маатсхаппий Б.В. | Строительный материал, содержащий модифицированную серу в качестве связующего вещества |
| JP4711800B2 (ja) * | 2005-10-07 | 2011-06-29 | 日本電子材料株式会社 | プローブカードの製作方法 |
| US7649367B2 (en) | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
| JP4654897B2 (ja) | 2005-12-09 | 2011-03-23 | イビデン株式会社 | 部品実装用ピンを有するプリント配線板の製造方法 |
| JP2007165383A (ja) | 2005-12-09 | 2007-06-28 | Ibiden Co Ltd | 部品実装用ピンを形成したプリント基板 |
| JP4848752B2 (ja) * | 2005-12-09 | 2011-12-28 | イビデン株式会社 | 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器 |
| TWI271525B (en) * | 2006-01-17 | 2007-01-21 | Chipmos Technologies Inc | Probe head with vertical probes, method for manufacturing the probe head, and probe card using the probe head |
| JP2007248064A (ja) * | 2006-03-13 | 2007-09-27 | Japan Electronic Materials Corp | 半導体素子検査装置 |
| US7312617B2 (en) * | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
| US20090273004A1 (en) * | 2006-07-24 | 2009-11-05 | Hung-Yi Lin | Chip package structure and method of making the same |
| US20090273005A1 (en) * | 2006-07-24 | 2009-11-05 | Hung-Yi Lin | Opto-electronic package structure having silicon-substrate and method of forming the same |
| TWI320237B (en) * | 2006-07-24 | 2010-02-01 | Si-substrate and structure of opto-electronic package having the same | |
| US7732233B2 (en) * | 2006-07-24 | 2010-06-08 | Touch Micro-System Technology Corp. | Method for making light emitting diode chip package |
| US20080044623A1 (en) * | 2006-08-21 | 2008-02-21 | John Caldwell | Probe card for testing imaging devices, and methods of fabricating same |
| US7836587B2 (en) * | 2006-09-21 | 2010-11-23 | Formfactor, Inc. | Method of repairing a contactor apparatus |
| US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
| US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
| KR100806736B1 (ko) * | 2007-05-11 | 2008-02-27 | 주식회사 에이엠에스티 | 프로브 카드 및 그 제조방법 |
| US20080286633A1 (en) * | 2007-05-17 | 2008-11-20 | Kathleen Ritter Olenick | Circuit testing device for solid oxide fuel cell |
| WO2009048255A2 (en) * | 2007-10-08 | 2009-04-16 | Amst Co., Ltd. | Method for wafer test and probe card for the same |
| US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
| MY144280A (en) * | 2007-11-20 | 2011-08-29 | Mimos Berhad | Mems based probe card and a method of testing semiconductor ion sensor using the same |
| US7692436B2 (en) * | 2008-03-20 | 2010-04-06 | Touchdown Technologies, Inc. | Probe card substrate with bonded via |
| US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
| US20100126764A1 (en) * | 2008-11-24 | 2010-05-27 | Seagate Technology, Llc | die ground lead |
| US8115504B2 (en) * | 2008-12-08 | 2012-02-14 | Formfactor, Inc. | Microspring array having reduced pitch contact elements |
| JP2011196934A (ja) * | 2010-03-23 | 2011-10-06 | Hitachi Ltd | 試験方法およびそれに用いられるインターポーザ |
| US8154119B2 (en) | 2010-03-31 | 2012-04-10 | Toyota Motor Engineering & Manufacturing North America, Inc. | Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing |
| JP2013545973A (ja) * | 2010-10-22 | 2013-12-26 | クリストフ ミートケ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | 測定値を遠隔送信して体内圧力を測定するための移植物 |
| US10675451B2 (en) | 2010-10-22 | 2020-06-09 | Christoph Miethke Gmbh & Co Kg | Hydrocephalus shunt arrangement and components thereof for draining cerebrospinal fluid in a patient having hydrocephalus |
| CN102586842A (zh) * | 2011-01-06 | 2012-07-18 | 刘江涛 | 复合强化弹簧的制造方法 |
| US20130265073A1 (en) * | 2011-01-16 | 2013-10-10 | Japan Electronic Materials Corporation | Probe Card And Manufacturing Method Therefor |
| JP5777997B2 (ja) * | 2011-03-07 | 2015-09-16 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板およびその製造方法 |
| JP5798435B2 (ja) | 2011-03-07 | 2015-10-21 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板およびその製造方法 |
| KR101241937B1 (ko) * | 2011-04-07 | 2013-03-13 | (주)미르시스템 | 프로브시트를 이용한 플랙서블 인쇄회로기판 검사방법 |
| JP5782824B2 (ja) * | 2011-05-18 | 2015-09-24 | 三菱電機株式会社 | 高周波特性測定装置 |
| US8803001B2 (en) | 2011-06-21 | 2014-08-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Bonding area design for transient liquid phase bonding process |
| WO2013006768A2 (en) * | 2011-07-06 | 2013-01-10 | Celadon Systems, Inc. | Test apparatus having a probe card and connector mechanism |
| TWI572872B (zh) * | 2011-07-06 | 2017-03-01 | 色拉頓系統公司 | 具有一探針裝置之測試系統及轉位機構 |
| TWI428608B (zh) * | 2011-09-16 | 2014-03-01 | Mpi Corp | 探針測試裝置與其製造方法 |
| CN104254781B (zh) * | 2012-03-07 | 2021-10-15 | 爱德万测试公司 | 转移电子探针组件到空间变换器 |
| KR101378012B1 (ko) | 2012-03-14 | 2014-03-24 | 삼성전자주식회사 | 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법 |
| US9044822B2 (en) | 2012-04-17 | 2015-06-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | Transient liquid phase bonding process for double sided power modules |
| US10058951B2 (en) | 2012-04-17 | 2018-08-28 | Toyota Motor Engineering & Manufacturing North America, Inc. | Alloy formation control of transient liquid phase bonding |
| TWI454710B (zh) * | 2012-09-19 | 2014-10-01 | Mpi Corp | Probe card and its manufacturing method |
| CN103869109B (zh) * | 2012-12-12 | 2017-10-10 | 华邦电子股份有限公司 | 探针卡及其焊接方法 |
| TWI503554B (zh) * | 2013-06-04 | 2015-10-11 | Mpi Corp | 探針卡與其之製作方法 |
| TWI541959B (zh) * | 2013-10-22 | 2016-07-11 | And a space converter for a wafer carrier for a wafer having a long strip contact is used And its manufacturing method | |
| US9435855B2 (en) * | 2013-11-19 | 2016-09-06 | Teradyne, Inc. | Interconnect for transmitting signals between a device and a tester |
| US9372205B2 (en) * | 2014-01-15 | 2016-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Universal probe card PCB design |
| CN105390517B (zh) * | 2015-11-17 | 2023-10-27 | 格科微电子(上海)有限公司 | 摄像头模组的测试方法及测试装置 |
| US10120020B2 (en) | 2016-06-16 | 2018-11-06 | Formfactor Beaverton, Inc. | Probe head assemblies and probe systems for testing integrated circuit devices |
| WO2018035054A1 (en) * | 2016-08-16 | 2018-02-22 | Translarity, Inc. | Space transformers for probe cards, and associated systems and methods |
| IT201600124017A1 (it) * | 2016-12-06 | 2018-06-06 | Technoprobe Spa | Testa di misura di un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
| US20200072871A1 (en) * | 2017-03-31 | 2020-03-05 | Intel Corporation | Ultra low-cost, low leadtime, and high density space transformer for fine pitch applications |
| US11156640B2 (en) * | 2017-10-31 | 2021-10-26 | Formfactor, Inc. | MEMS probe card assembly having decoupled electrical and mechanical probe connections |
| KR102447833B1 (ko) * | 2018-02-09 | 2022-09-27 | 주성엔지니어링(주) | 전력 인터페이스 |
| TWI759594B (zh) * | 2018-10-12 | 2022-04-01 | 旺矽科技股份有限公司 | 具有微機電探針之探針模組及其製造方法 |
| JP7302011B2 (ja) * | 2019-04-26 | 2023-07-03 | フォームファクター, インコーポレイテッド | 垂直プローブアレイ用のキャリア構造上のプローブ |
| KR102164020B1 (ko) * | 2019-11-27 | 2020-10-13 | 화인인스트루먼트 (주) | 프로브 카드의 프로브 헤드 제조 방법 |
| US11243230B2 (en) | 2019-12-30 | 2022-02-08 | Juniper Networks, Inc. | Compact opto-electric probe |
| CN111366839B (zh) * | 2020-03-28 | 2022-04-12 | 深圳中科系统集成技术有限公司 | 一种晶圆测试用探针转接板及其制作方法 |
| KR102228317B1 (ko) * | 2020-10-26 | 2021-03-16 | 주식회사 프로이천 | 웨이퍼 테스트용 프로브 카드 |
| TWI755919B (zh) * | 2020-11-03 | 2022-02-21 | 中華精測科技股份有限公司 | 板狀連接器與其雙環式串接件、及晶圓測試組件 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| JPS62165944A (ja) | 1986-01-17 | 1987-07-22 | Fujitsu Ltd | ワイヤ接続方法 |
| JP2718785B2 (ja) * | 1988-10-25 | 1998-02-25 | 日立化成工業株式会社 | ナフタロシアニン誘導体及びその製造法並びにそれを用いた光学記録媒体及びその光学記録媒体の製造法 |
| JPH06140484A (ja) * | 1992-10-28 | 1994-05-20 | Nippon Telegr & Teleph Corp <Ntt> | プローブカード |
| US5974662A (en) | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
| US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
| US7064566B2 (en) | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
| US6023103A (en) * | 1994-11-15 | 2000-02-08 | Formfactor, Inc. | Chip-scale carrier for semiconductor devices including mounted spring contacts |
| US5806181A (en) | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
| JP3825290B2 (ja) * | 1994-06-03 | 2006-09-27 | 株式会社ルネサステクノロジ | 半導体素子の製造方法 |
| US5613861A (en) * | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
| AU3127797A (en) * | 1996-05-17 | 1997-12-09 | Formfactor, Inc. | Microelectronic contact structure and method of making same |
| US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
| US6215196B1 (en) * | 1997-06-30 | 2001-04-10 | Formfactor, Inc. | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals |
| US5944537A (en) * | 1997-12-15 | 1999-08-31 | Xerox Corporation | Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices |
| JPH11233216A (ja) * | 1998-02-16 | 1999-08-27 | Nippon Denki Factory Engineering Kk | テスト用icソケット |
| US6268015B1 (en) * | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
| JP2000174078A (ja) * | 1998-12-08 | 2000-06-23 | Advantest Corp | プローブカード及びその製造方法 |
| US6535003B2 (en) * | 1999-01-29 | 2003-03-18 | Advantest, Corp. | Contact structure having silicon finger contactor |
| US6917525B2 (en) * | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| US7215131B1 (en) | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
| US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
| DE60115437T2 (de) * | 2000-06-20 | 2006-07-27 | Nanonexus, Inc., Fremont | Testsystem von integrierten schaltungen |
| US6432747B1 (en) | 2000-07-05 | 2002-08-13 | Trw Inc. | Repair method for broken or missing microcircuit package terminal lead |
| US6512183B2 (en) | 2000-10-10 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounted member and repair method thereof |
| JP4527267B2 (ja) * | 2000-11-13 | 2010-08-18 | 東京エレクトロン株式会社 | コンタクタの製造方法 |
| JP3584219B2 (ja) * | 2001-06-28 | 2004-11-04 | 財団法人工業技術研究院 | プローブカードの製造方法およびプローブカード |
| US6777319B2 (en) | 2001-12-19 | 2004-08-17 | Formfactor, Inc. | Microelectronic spring contact repair |
| JP2003202350A (ja) * | 2001-12-28 | 2003-07-18 | Tokyo Cathode Laboratory Co Ltd | プローブカード用探針、プローブカード用探針ユニット、プローブカード及びそれらの製造方法 |
| AU2002353582A1 (en) * | 2002-02-05 | 2003-09-02 | Oug-Ki Lee | Method for manufacturing electric contact element for testing electro device and electric contact element thereby |
| US7047638B2 (en) | 2002-07-24 | 2006-05-23 | Formfactor, Inc | Method of making microelectronic spring contact array |
| US7459795B2 (en) | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
| JP2006344653A (ja) * | 2005-06-07 | 2006-12-21 | Toshiba Corp | 磁気ランダムアクセスメモリ |
| US7836587B2 (en) | 2006-09-21 | 2010-11-23 | Formfactor, Inc. | Method of repairing a contactor apparatus |
-
2004
- 2004-08-19 US US10/922,486 patent/US7459795B2/en not_active Expired - Fee Related
-
2005
- 2005-08-19 TW TW094128418A patent/TWI410648B/zh not_active IP Right Cessation
- 2005-08-19 EP EP05789219A patent/EP1779128A2/en not_active Withdrawn
- 2005-08-19 KR KR1020077005488A patent/KR20070053743A/ko not_active Ceased
- 2005-08-19 JP JP2007528044A patent/JP2008510966A/ja active Pending
- 2005-08-19 KR KR1020127024506A patent/KR101293348B1/ko not_active Expired - Fee Related
- 2005-08-19 WO PCT/US2005/029581 patent/WO2006023741A2/en not_active Ceased
- 2005-08-19 CN CN2005800283762A patent/CN101292337B/zh not_active Expired - Fee Related
-
2008
- 2008-12-02 US US12/326,486 patent/US7884006B2/en not_active Expired - Fee Related
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