CN112005374A - 阵列基板及其制造方法、显示装置及其制造方法 - Google Patents

阵列基板及其制造方法、显示装置及其制造方法 Download PDF

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Publication number
CN112005374A
CN112005374A CN201980000387.1A CN201980000387A CN112005374A CN 112005374 A CN112005374 A CN 112005374A CN 201980000387 A CN201980000387 A CN 201980000387A CN 112005374 A CN112005374 A CN 112005374A
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China
Prior art keywords
substrate
thin film
film transistor
switching
forming
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CN201980000387.1A
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CN112005374B (zh
Inventor
顾仁权
姚琪
柳在一
梁志伟
刘英伟
黎午升
狄沐昕
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供了一种阵列基板及其制造方法、显示装置及其制造方法,属于显示技术领域。阵列基板包括:转接基板,位于转接基板一侧的薄膜晶体管,以及内嵌于转接基板另一侧的绑定连接线,绑定连接线用于连接驱动电路;转接基板上设置有转接过孔,转接过孔内设置有导电结构,薄膜晶体管通过导电结构与绑定连接线电连接。本公开提高了阵列基板的制备良率,降低了工艺难度。

Description

PCT国内申请,说明书已公开。

Claims (18)

  1. PCT国内申请,权利要求书已公开。
CN201980000387.1A 2019-03-26 2019-03-26 阵列基板及其制造方法、显示装置及其制造方法 Active CN112005374B (zh)

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CN112005374B CN112005374B (zh) 2024-06-18

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Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
US11558184B2 (en) 2020-08-09 2023-01-17 Perimeter 81 Ltd Unification of data flows over network links with different internet protocol (IP) addresses
CN112242414A (zh) * 2020-10-12 2021-01-19 华南理工大学 一种柔性显示屏及其制备方法、柔性显示装置
CN114664745B (zh) * 2022-05-24 2023-01-17 惠科股份有限公司 显示面板及其制作方法

Citations (2)

* Cited by examiner, † Cited by third party
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CN1582461A (zh) * 2001-09-07 2005-02-16 松下电器产业株式会社 显示装置及其制造方法
CN107256870A (zh) * 2017-06-09 2017-10-17 京东方科技集团股份有限公司 一种阵列基板及制作方法、柔性显示面板、显示装置

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JP3809733B2 (ja) * 1998-02-25 2006-08-16 セイコーエプソン株式会社 薄膜トランジスタの剥離方法
TW474023B (en) * 2001-02-27 2002-01-21 Hannstar Display Corp Thin film transistor process of liquid crystal display
US6814832B2 (en) * 2001-07-24 2004-11-09 Seiko Epson Corporation Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
JP2003255850A (ja) * 2002-03-05 2003-09-10 Pioneer Electronic Corp 表示パネル基板及び表示装置
JP2010243525A (ja) * 2009-04-01 2010-10-28 Sony Corp 液晶表示パネル及びその製造方法
KR102174336B1 (ko) * 2014-07-08 2020-11-04 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9478583B2 (en) * 2014-12-08 2016-10-25 Apple Inc. Wearable display having an array of LEDs on a conformable silicon substrate
CN105552085B (zh) * 2015-12-25 2019-04-30 昆山国显光电有限公司 一种像素驱动电路及其制备方法
CN107302011B (zh) * 2016-04-14 2020-11-20 群创光电股份有限公司 显示装置
CN106384740A (zh) 2016-09-20 2017-02-08 昆山工研院新型平板显示技术中心有限公司 无边框显示装置及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1582461A (zh) * 2001-09-07 2005-02-16 松下电器产业株式会社 显示装置及其制造方法
CN107256870A (zh) * 2017-06-09 2017-10-17 京东方科技集团股份有限公司 一种阵列基板及制作方法、柔性显示面板、显示装置

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US20210217837A1 (en) 2021-07-15
WO2020191607A1 (zh) 2020-10-01
CN112005374B (zh) 2024-06-18
US11502153B2 (en) 2022-11-15

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