JP2008251936A - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP2008251936A JP2008251936A JP2007092878A JP2007092878A JP2008251936A JP 2008251936 A JP2008251936 A JP 2008251936A JP 2007092878 A JP2007092878 A JP 2007092878A JP 2007092878 A JP2007092878 A JP 2007092878A JP 2008251936 A JP2008251936 A JP 2008251936A
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- semiconductor light
- light emitting
- emitting device
- led chip
- bonding pad
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052709 silver Inorganic materials 0.000 abstract description 24
- 239000004332 silver Substances 0.000 abstract description 24
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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Abstract
【解決手段】基板1と、基板1に形成された電極2A,2Bと、電極2Aに形成されたダイボンディングパッド2Aaに銀ペースト6を用いてダイボンディングされたLEDチップ3と、を備える、半導体発光装置A1であって、ダイボンディングパッド2Aaは、基板1の厚さ方向視においてその外縁がLEDチップ3の外縁よりも内方に位置しており、電極2Aは、ダイボンディングパッド2AaからLEDチップ3の外方に延びる延出部21をさらに備えている。
【選択図】 図1
Description
1 基板
2A,2B 1対の電極
2Aa ダイボンディングパッド
2Ba ボンディングパッド
3 LEDチップ(半導体発光素子)
4 ボンディングワイヤ
5 樹脂パッケージ
6 銀ペースト
21 延出部
21a 帯状部
21b 広幅部
Claims (3)
- 基板と、
上記基板に形成された電極と、
上記電極に形成されたダイボンディングパッドに導電性ペーストを用いてダイボンディングされた半導体発光素子と、
を備える、半導体発光装置であって、
上記ダイボンディングパッドは、上記基板の厚さ方向視においてその外縁が上記半導体発光素子の外縁よりも内方に位置しており、
上記電極は、上記ダイボンディングパッドから上記半導体発光素子の外方に延出する延出部をさらに備えていることを特徴とする、半導体発光装置。 - 上記半導体発光素子は、矩形状であり、
上記延出部は、上記半導体発光素子の対角線方向に延びており、かつ、上記ダイボンディングパッドに繋がる帯状部と、この帯状部よりも先端側に位置し、上記帯状部よりも広幅とされた広幅部とを有している、請求項1に記載の半導体発光装置。 - 上記導電性ペーストの厚さと、上記半導体発光素子の厚さとの比が、1:5〜1:15とされている、請求項1または2に記載の半導体発光装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092878A JP2008251936A (ja) | 2007-03-30 | 2007-03-30 | 半導体発光装置 |
KR1020097020998A KR101148433B1 (ko) | 2007-03-30 | 2008-03-25 | 반도체 발광 장치 |
PCT/JP2008/055500 WO2008120606A1 (ja) | 2007-03-30 | 2008-03-25 | 半導体発光装置 |
US12/593,826 US8089092B2 (en) | 2007-03-30 | 2008-03-25 | Semiconductor light emitting device |
CN200880014272XA CN101675537B (zh) | 2007-03-30 | 2008-03-25 | 半导体发光装置 |
TW097111190A TWI392120B (zh) | 2007-03-30 | 2008-03-28 | Semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092878A JP2008251936A (ja) | 2007-03-30 | 2007-03-30 | 半導体発光装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013137889A Division JP2013225690A (ja) | 2013-07-01 | 2013-07-01 | 半導体発光装置 |
Publications (1)
Publication Number | Publication Date |
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JP2008251936A true JP2008251936A (ja) | 2008-10-16 |
Family
ID=39808188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007092878A Pending JP2008251936A (ja) | 2007-03-30 | 2007-03-30 | 半導体発光装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8089092B2 (ja) |
JP (1) | JP2008251936A (ja) |
KR (1) | KR101148433B1 (ja) |
CN (1) | CN101675537B (ja) |
TW (1) | TWI392120B (ja) |
WO (1) | WO2008120606A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130076785A (ko) * | 2011-12-28 | 2013-07-08 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치용 패키지 성형체 |
JP2013153157A (ja) * | 2011-12-28 | 2013-08-08 | Nichia Chem Ind Ltd | 発光装置用パッケージ成形体 |
WO2015076281A1 (ja) * | 2013-11-19 | 2015-05-28 | デクセリアルズ株式会社 | 発光装置、発光装置製造方法 |
JP2015185661A (ja) * | 2014-03-24 | 2015-10-22 | スタンレー電気株式会社 | 半導体装置 |
JP2016115881A (ja) * | 2014-12-17 | 2016-06-23 | 京セラ株式会社 | 発光素子搭載用基板および発光装置 |
JP2017212354A (ja) * | 2016-05-26 | 2017-11-30 | ローム株式会社 | Ledモジュール |
JP2018022742A (ja) * | 2016-08-02 | 2018-02-08 | 日亜化学工業株式会社 | 発光装置 |
JP2019054248A (ja) * | 2018-09-19 | 2019-04-04 | 日亜化学工業株式会社 | 発光装置 |
JP2019176134A (ja) * | 2018-03-29 | 2019-10-10 | Hoya Candeo Optronics株式会社 | 光照射モジュール、及びled素子用配線基板 |
JP2020080427A (ja) * | 2012-05-09 | 2020-05-28 | ローム株式会社 | 半導体発光装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4951090B2 (ja) * | 2010-01-29 | 2012-06-13 | 株式会社東芝 | Ledパッケージ |
CN105720180B (zh) | 2010-04-09 | 2018-05-29 | 罗姆股份有限公司 | Led模块 |
TWM416736U (en) * | 2011-06-03 | 2011-11-21 | Lustrous Technology Ltd | Light guide structure and lamp structure |
JP5954013B2 (ja) | 2012-07-18 | 2016-07-20 | 日亜化学工業株式会社 | 半導体素子実装部材及び半導体装置 |
KR101443870B1 (ko) * | 2014-03-05 | 2014-09-23 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
USD737784S1 (en) * | 2014-07-30 | 2015-09-01 | Kingbright Electronics Co., Ltd. | LED component |
USD774475S1 (en) * | 2016-02-19 | 2016-12-20 | Kingbright Electronics Co. Ltd. | LED component |
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JPH08204239A (ja) * | 1995-01-31 | 1996-08-09 | Rohm Co Ltd | 樹脂封止型発光装置 |
JPH1050734A (ja) * | 1996-07-31 | 1998-02-20 | Shichizun Denshi:Kk | チップ型半導体 |
JPH11168235A (ja) * | 1997-12-05 | 1999-06-22 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP2002158390A (ja) * | 2000-11-21 | 2002-05-31 | Sharp Corp | 半導体レーザ装置の製造方法および半導体レーザ装置 |
JP2004146609A (ja) * | 2002-10-24 | 2004-05-20 | Kyocera Corp | 光半導体装置 |
Family Cites Families (4)
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JP3895086B2 (ja) * | 1999-12-08 | 2007-03-22 | ローム株式会社 | チップ型半導体発光装置 |
JP2001196641A (ja) | 2000-01-14 | 2001-07-19 | Matsushita Electric Ind Co Ltd | 表面実装型の半導体装置 |
JP3877642B2 (ja) | 2002-05-21 | 2007-02-07 | ローム株式会社 | 半導体チップを使用した半導体装置 |
CN1521862A (zh) * | 2003-01-30 | 2004-08-18 | 银河光电股份有限公司 | 发光二极管封装结构及其方法 |
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2007
- 2007-03-30 JP JP2007092878A patent/JP2008251936A/ja active Pending
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2008
- 2008-03-25 CN CN200880014272XA patent/CN101675537B/zh active Active
- 2008-03-25 WO PCT/JP2008/055500 patent/WO2008120606A1/ja active Application Filing
- 2008-03-25 US US12/593,826 patent/US8089092B2/en active Active
- 2008-03-25 KR KR1020097020998A patent/KR101148433B1/ko active IP Right Grant
- 2008-03-28 TW TW097111190A patent/TWI392120B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08204239A (ja) * | 1995-01-31 | 1996-08-09 | Rohm Co Ltd | 樹脂封止型発光装置 |
JPH1050734A (ja) * | 1996-07-31 | 1998-02-20 | Shichizun Denshi:Kk | チップ型半導体 |
JPH11168235A (ja) * | 1997-12-05 | 1999-06-22 | Toyoda Gosei Co Ltd | 発光ダイオード |
JP2002158390A (ja) * | 2000-11-21 | 2002-05-31 | Sharp Corp | 半導体レーザ装置の製造方法および半導体レーザ装置 |
JP2004146609A (ja) * | 2002-10-24 | 2004-05-20 | Kyocera Corp | 光半導体装置 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101962973B1 (ko) | 2011-12-28 | 2019-03-27 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치용 패키지 성형체 |
JP2013153157A (ja) * | 2011-12-28 | 2013-08-08 | Nichia Chem Ind Ltd | 発光装置用パッケージ成形体 |
KR20130076785A (ko) * | 2011-12-28 | 2013-07-08 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치용 패키지 성형체 |
US10297728B2 (en) | 2011-12-28 | 2019-05-21 | Nichia Corporation | Molded package for light emitting device |
JP2020080427A (ja) * | 2012-05-09 | 2020-05-28 | ローム株式会社 | 半導体発光装置 |
JP7079277B2 (ja) | 2012-05-09 | 2022-06-01 | ローム株式会社 | 半導体発光装置 |
WO2015076281A1 (ja) * | 2013-11-19 | 2015-05-28 | デクセリアルズ株式会社 | 発光装置、発光装置製造方法 |
JP2015185661A (ja) * | 2014-03-24 | 2015-10-22 | スタンレー電気株式会社 | 半導体装置 |
JP2016115881A (ja) * | 2014-12-17 | 2016-06-23 | 京セラ株式会社 | 発光素子搭載用基板および発光装置 |
JP2017212354A (ja) * | 2016-05-26 | 2017-11-30 | ローム株式会社 | Ledモジュール |
JP2018022742A (ja) * | 2016-08-02 | 2018-02-08 | 日亜化学工業株式会社 | 発光装置 |
US10243125B2 (en) | 2016-08-02 | 2019-03-26 | Nichia Corporation | Light emitting device |
JP2019176134A (ja) * | 2018-03-29 | 2019-10-10 | Hoya Candeo Optronics株式会社 | 光照射モジュール、及びled素子用配線基板 |
JP2021108404A (ja) * | 2018-03-29 | 2021-07-29 | Hoya株式会社 | 光照射モジュール、及びled素子用配線基板 |
JP7192029B2 (ja) | 2018-03-29 | 2022-12-19 | Hoya株式会社 | 光照射モジュール、及びled素子用配線基板 |
JP2019054248A (ja) * | 2018-09-19 | 2019-04-04 | 日亜化学工業株式会社 | 発光装置 |
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US20100044747A1 (en) | 2010-02-25 |
KR101148433B1 (ko) | 2012-05-25 |
CN101675537A (zh) | 2010-03-17 |
WO2008120606A1 (ja) | 2008-10-09 |
CN101675537B (zh) | 2013-07-10 |
TW200849675A (en) | 2008-12-16 |
KR20090119782A (ko) | 2009-11-19 |
TWI392120B (zh) | 2013-04-01 |
US8089092B2 (en) | 2012-01-03 |
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