WO2008120606A1 - 半導体発光装置 - Google Patents

半導体発光装置 Download PDF

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Publication number
WO2008120606A1
WO2008120606A1 PCT/JP2008/055500 JP2008055500W WO2008120606A1 WO 2008120606 A1 WO2008120606 A1 WO 2008120606A1 JP 2008055500 W JP2008055500 W JP 2008055500W WO 2008120606 A1 WO2008120606 A1 WO 2008120606A1
Authority
WO
WIPO (PCT)
Prior art keywords
die bonding
light emitting
emitting device
semiconductor light
bonding pad
Prior art date
Application number
PCT/JP2008/055500
Other languages
English (en)
French (fr)
Inventor
Yasushi Tanaka
Original Assignee
Rohm Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co., Ltd. filed Critical Rohm Co., Ltd.
Priority to KR1020097020998A priority Critical patent/KR101148433B1/ko
Priority to US12/593,826 priority patent/US8089092B2/en
Priority to CN200880014272XA priority patent/CN101675537B/zh
Publication of WO2008120606A1 publication Critical patent/WO2008120606A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

　半導体発光装置（Ａ１）は、基板（１）と、基板（１）に形成された２つの電極（２Ａ，２Ｂ）を含む。電極（２Ａ）には、ダイボンディングパッド（２Ａａ）が形成されており、これに銀ペースト（６）を介してＬＥＤチップ（３）がダイボンディングされる。ダイボンディングパッド（２Ａａ）は、基板（１）の厚さ方向視において、その外縁がＬＥＤチップ（３）の外縁よりも内方に位置している。電極（２Ａ）は、ダイボンディングパッド（２Ａａ）からＬＥＤチップ（３）の外方に延びる延出部（２１）を備えている。
PCT/JP2008/055500 2007-03-30 2008-03-25 半導体発光装置 WO2008120606A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097020998A KR101148433B1 (ko) 2007-03-30 2008-03-25 반도체 발광 장치
US12/593,826 US8089092B2 (en) 2007-03-30 2008-03-25 Semiconductor light emitting device
CN200880014272XA CN101675537B (zh) 2007-03-30 2008-03-25 半导体发光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-092878 2007-03-30
JP2007092878A JP2008251936A (ja) 2007-03-30 2007-03-30 半導体発光装置

Publications (1)

Publication Number Publication Date
WO2008120606A1 true WO2008120606A1 (ja) 2008-10-09

Family

ID=39808188

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055500 WO2008120606A1 (ja) 2007-03-30 2008-03-25 半導体発光装置

Country Status (6)

Country Link
US (1) US8089092B2 (ja)
JP (1) JP2008251936A (ja)
KR (1) KR101148433B1 (ja)
CN (1) CN101675537B (ja)
TW (1) TWI392120B (ja)
WO (1) WO2008120606A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015122487A (ja) * 2013-11-19 2015-07-02 デクセリアルズ株式会社 発光装置、発光装置製造方法
US10068821B2 (en) 2012-07-18 2018-09-04 Nichia Corporation Semiconductor component support and semiconductor device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4951090B2 (ja) * 2010-01-29 2012-06-13 株式会社東芝 Ｌｅｄパッケージ
WO2011126135A1 (ja) 2010-04-09 2011-10-13 ローム株式会社 Ｌｅｄモジュール
TWM416736U (en) * 2011-06-03 2011-11-21 Lustrous Technology Ltd Light guide structure and lamp structure
JP6079223B2 (ja) * 2011-12-28 2017-02-15 日亜化学工業株式会社 発光装置用パッケージ成形体
US9093621B2 (en) * 2011-12-28 2015-07-28 Nichia Corporation Molded package for light emitting device
JP6553143B2 (ja) * 2012-05-09 2019-07-31 ローム株式会社 半導体発光装置
KR101443870B1 (ko) * 2014-03-05 2014-09-23 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
JP6487626B2 (ja) * 2014-03-24 2019-03-20 スタンレー電気株式会社 半導体装置
USD737784S1 (en) * 2014-07-30 2015-09-01 Kingbright Electronics Co., Ltd. LED component
JP2016115881A (ja) * 2014-12-17 2016-06-23 京セラ株式会社 発光素子搭載用基板および発光装置
USD774475S1 (en) * 2016-02-19 2016-12-20 Kingbright Electronics Co. Ltd. LED component
JP6842246B2 (ja) * 2016-05-26 2021-03-17 ローム株式会社 Ｌｅｄモジュール
JP6519549B2 (ja) * 2016-08-02 2019-05-29 日亜化学工業株式会社 発光装置
JP6881874B2 (ja) * 2018-03-29 2021-06-02 Hoya株式会社 光照射モジュール、及びｌｅｄ素子用配線基板
JP6822455B2 (ja) * 2018-09-19 2021-01-27 日亜化学工業株式会社 発光装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050734A (ja) * 1996-07-31 1998-02-20 Shichizun Denshi:Kk チップ型半導体
JPH11168235A (ja) * 1997-12-05 1999-06-22 Toyoda Gosei Co Ltd 発光ダイオード
JP2002158390A (ja) * 2000-11-21 2002-05-31 Sharp Corp 半導体レーザ装置の製造方法および半導体レーザ装置
JP2004146609A (ja) * 2002-10-24 2004-05-20 Kyocera Corp 光半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204239A (ja) * 1995-01-31 1996-08-09 Rohm Co Ltd 樹脂封止型発光装置
JP3895086B2 (ja) * 1999-12-08 2007-03-22 ローム株式会社 チップ型半導体発光装置
JP2001196641A (ja) 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd 表面実装型の半導体装置
JP3877642B2 (ja) 2002-05-21 2007-02-07 ローム株式会社 半導体チップを使用した半導体装置
CN1521862A (zh) * 2003-01-30 2004-08-18 银河光电股份有限公司 发光二极管封装结构及其方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050734A (ja) * 1996-07-31 1998-02-20 Shichizun Denshi:Kk チップ型半導体
JPH11168235A (ja) * 1997-12-05 1999-06-22 Toyoda Gosei Co Ltd 発光ダイオード
JP2002158390A (ja) * 2000-11-21 2002-05-31 Sharp Corp 半導体レーザ装置の製造方法および半導体レーザ装置
JP2004146609A (ja) * 2002-10-24 2004-05-20 Kyocera Corp 光半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10068821B2 (en) 2012-07-18 2018-09-04 Nichia Corporation Semiconductor component support and semiconductor device
JP2015122487A (ja) * 2013-11-19 2015-07-02 デクセリアルズ株式会社 発光装置、発光装置製造方法

Also Published As

Publication number Publication date
JP2008251936A (ja) 2008-10-16
US20100044747A1 (en) 2010-02-25
CN101675537B (zh) 2013-07-10
TW200849675A (en) 2008-12-16
TWI392120B (zh) 2013-04-01
KR101148433B1 (ko) 2012-05-25
US8089092B2 (en) 2012-01-03
KR20090119782A (ko) 2009-11-19
CN101675537A (zh) 2010-03-17

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