JP2008153376A - ペースト印刷装置およびペースト印刷方法 - Google Patents
ペースト印刷装置およびペースト印刷方法 Download PDFInfo
- Publication number
- JP2008153376A JP2008153376A JP2006338793A JP2006338793A JP2008153376A JP 2008153376 A JP2008153376 A JP 2008153376A JP 2006338793 A JP2006338793 A JP 2006338793A JP 2006338793 A JP2006338793 A JP 2006338793A JP 2008153376 A JP2008153376 A JP 2008153376A
- Authority
- JP
- Japan
- Prior art keywords
- conductive pad
- opening
- mask member
- paste
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】ペースト印刷装置11では、基板21上の導電パッド22はマスク部材13の開口14内で露出する。除去機構18は開口14内で導電パッド22の表面に作用する。こうして導電パッド22の表面から腐食膜23aは除去される。導電パッド22上は清浄化される。マスク部材13の開口14は導電パッド22を露出させることから、除去機構18は導電パッド22にのみ作用する。導電パッド22以外の領域で基板21の破損は回避される。しかも、スキージ17はマスク部材13の開口14から導電パッド22の表面に導電ペースト24を供給する。その結果、清浄化された導電パッド22の表面は導電ペースト24で覆われる。導電パッド22の表面は大気中の酸素から隔絶される。導電パッド22の表面の酸化は確実に回避される。
【選択図】図3
Description
Claims (10)
- 裏面で基板に重ね合わせられて、基板上の導電パッドを露出させる開口を区画するマスク部材と、マスク部材の開口内で導電パッドの表面に作用して、導電パッドの表面の腐食膜を除去する除去機構と、マスク部材の表面に沿って移動して、マスク部材の開口から導電パッドの表面に導電ペーストを供給するスキージとを備えることを特徴とするペースト印刷装置。
- 請求項1に記載のペースト印刷装置において、前記除去機構は、前記導電パッド上の導電ペーストに超音波振動を加える超音波振動子を備えることを特徴とするペースト印刷装置。
- 請求項1に記載のペースト印刷装置において、前記除去機構は、所定の回転軸回りで回転するゴムローラと、ゴムローラに支持されて、ゴムローラの外周面から突き出る複数の金属ワイヤとを備えることを特徴とするペースト印刷装置。
- 請求項1に記載のペースト印刷装置において、前記除去機構は、複数の金属ワイヤで構成されるブラシを備えることを特徴とするペースト印刷装置。
- 請求項1に記載のペースト印刷装置において、前記除去機構は、前記導電パターンの表面に向かってプラズマ粒子を放出するプラズマ照射機を備えることを特徴とするペースト印刷装置。
- 裏面で基板に重ね合わせられて、基板上の導電パッドを露出させる開口を区画するマスク部材と、マスク部材の開口内で導電パッドの表面に作用して、導電パッドの表面の腐食膜を除去する除去機構とを備えることを特徴とする腐食膜除去装置。
- 基板に重ね合わせられるマスク部材の開口内に基板上の導電パッドを露出させる工程と、マスク部材の開口内で導電パッドの表面から腐食膜を除去する工程と、マスク部材の開口から導電パッドの表面に導電ペーストを供給する工程とを備えることを特徴とするペースト印刷方法。
- 基板に重ね合わせられるマスク部材の開口内に基板上の導電パッドを露出させる工程と、マスク部材の表面に沿ってスキージを移動させて、マスク部材の開口から導電パッドの表面に導電ペーストを供給する工程と、導電パッド上の導電ペーストに超音波振動を加えて導電パッドの表面の腐食膜を除去する工程とを備えることを特徴とするペースト印刷方法。
- 基板に重ね合わせられるマスク部材の開口内に基板上の導電パッドを露出させる工程と、マスク部材の開口内で導電パッドの表面に、所定の回転軸回りで回転するゴムローラの外周面から突き出す複数の金属ワイヤを突き当てて導電パッドの表面の腐食膜を突き破る工程と、マスク部材の表面に沿ってスキージを移動させて、マスク部材の開口から導電パッドの表面に導電ペーストを供給する工程とを備えることを特徴とするペースト印刷方法。
- 基板に重ね合わせられるマスク部材の開口内に基板上の導電パッドを露出させる工程と、マスク部材の開口内で導電パッドの表面に、複数の金属ワイヤで構成されるブラシを接触させて導電パッドの表面の腐食膜を除去する工程と、マスク部材の表面に沿ってスキージを移動させて、マスク部材の開口から導電パッドの表面に導電ペーストを供給する工程とを備えることを特徴とするペースト印刷方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006338793A JP4804324B2 (ja) | 2006-12-15 | 2006-12-15 | ペースト印刷装置およびペースト印刷方法 |
TW96135122A TWI472281B (zh) | 2006-12-15 | 2007-09-20 | 糊膏印刷機及以糊膏印刷的方法 |
US11/860,889 US20080145972A1 (en) | 2006-12-15 | 2007-09-25 | Paste printer and method of printing with paste |
CN2007101636300A CN101207976B (zh) | 2006-12-15 | 2007-10-15 | 焊膏印刷机以及用焊膏印刷的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006338793A JP4804324B2 (ja) | 2006-12-15 | 2006-12-15 | ペースト印刷装置およびペースト印刷方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008153376A true JP2008153376A (ja) | 2008-07-03 |
JP4804324B2 JP4804324B2 (ja) | 2011-11-02 |
Family
ID=39527822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006338793A Expired - Fee Related JP4804324B2 (ja) | 2006-12-15 | 2006-12-15 | ペースト印刷装置およびペースト印刷方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080145972A1 (ja) |
JP (1) | JP4804324B2 (ja) |
CN (1) | CN101207976B (ja) |
TW (1) | TWI472281B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011071153A (ja) * | 2009-09-24 | 2011-04-07 | Tanaka Kikinzoku Kogyo Kk | 回路基板の貫通電極の形成方法 |
KR20190013551A (ko) * | 2017-07-28 | 2019-02-11 | 아스리트 에프에이 가부시키가이샤 | 주상 부재 탑재 장치 및 주상 부재 탑재 방법 |
JP2019102523A (ja) * | 2017-11-29 | 2019-06-24 | Fdk株式会社 | 回路基板およびその製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0919580D0 (en) * | 2009-11-09 | 2009-12-23 | Dtg Int Gmbh | Screen printing |
TWI404477B (zh) * | 2010-06-29 | 2013-08-01 | Univ Nat Pingtung Sci & Tech | 基板表面形成電路方法 |
US20120042795A1 (en) * | 2010-08-23 | 2012-02-23 | Preco, Inc. | Method and apparatus for printing on a substrate |
US8955530B2 (en) * | 2011-01-18 | 2015-02-17 | Taiwan Semiconductor Manufaturing Company, Ltd. | System and method for cleaning a wafer chuck |
WO2013006814A2 (en) * | 2011-07-06 | 2013-01-10 | Flextronics Ap, Llc | Solder desposition system and method for metal bumps |
KR101175909B1 (ko) * | 2011-07-27 | 2012-08-22 | 삼성전기주식회사 | 인쇄회로기판의 표면처리 방법 및 인쇄회로기판 |
DE102013201167A1 (de) * | 2013-01-24 | 2014-08-07 | Elringklinger Ag | Verfahren zum Herstellen einer elektrisch leitenden Verbindung zwischen einer elektrischen Leitung und einem elektrisch leitenden Bauteil und nach dem Verfahren hergestellte Baugruppe |
CN103769710A (zh) * | 2014-01-23 | 2014-05-07 | 无锡江南计算技术研究所 | 一种助焊剂手工分配方法 |
DE102017115548B4 (de) * | 2017-07-11 | 2019-09-05 | Ersa Gmbh | Lötvorrichtung und Lötanlage |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6279695A (ja) * | 1985-10-03 | 1987-04-13 | 有限会社 白金工業所 | プリント基板研磨装置 |
JPH0435090A (ja) * | 1990-05-31 | 1992-02-05 | Toshiba Corp | クリームはんだ印刷装置 |
JP2001353662A (ja) * | 2000-06-09 | 2001-12-25 | Xebec Technology Co Ltd | 研磨材及びこの研磨材を用いた多層配線基板表面の研磨方法 |
JP2002118351A (ja) * | 2000-10-06 | 2002-04-19 | Matsushita Electric Ind Co Ltd | 導電ペーストの塗布方法 |
JP2003234370A (ja) * | 2002-02-07 | 2003-08-22 | Fujitsu Ltd | 電子部品の接続方法及びそれにより得られた接続構造体 |
JP2006128386A (ja) * | 2004-10-28 | 2006-05-18 | Olympus Corp | プラズマ洗浄装置及び方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3503122A (en) * | 1965-03-29 | 1970-03-31 | Robin Machine Products Inc | Method of forming a tubular article |
US5522929A (en) * | 1994-08-29 | 1996-06-04 | Erdmann; Gunter | Apparatus for material deposition for circuit board manufacture |
JPH08330308A (ja) * | 1995-05-31 | 1996-12-13 | Matsushita Electric Ind Co Ltd | バンプの形成方法 |
US20030007885A1 (en) * | 1999-03-16 | 2003-01-09 | Shinjiro Domi | Lead-free solder |
JP2000326088A (ja) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
CN1140162C (zh) * | 2000-09-22 | 2004-02-25 | 哈尔滨工业大学 | 超声激光无钎剂软钎焊方法 |
EP1270166A1 (en) * | 2001-06-20 | 2003-01-02 | Nihon Plast Co., Ltd. | Deflashing apparatus |
CN100382266C (zh) * | 2005-05-17 | 2008-04-16 | 华为技术有限公司 | 球栅阵列封装基板植球方法及设备 |
-
2006
- 2006-12-15 JP JP2006338793A patent/JP4804324B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-20 TW TW96135122A patent/TWI472281B/zh not_active IP Right Cessation
- 2007-09-25 US US11/860,889 patent/US20080145972A1/en not_active Abandoned
- 2007-10-15 CN CN2007101636300A patent/CN101207976B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6279695A (ja) * | 1985-10-03 | 1987-04-13 | 有限会社 白金工業所 | プリント基板研磨装置 |
JPH0435090A (ja) * | 1990-05-31 | 1992-02-05 | Toshiba Corp | クリームはんだ印刷装置 |
JP2001353662A (ja) * | 2000-06-09 | 2001-12-25 | Xebec Technology Co Ltd | 研磨材及びこの研磨材を用いた多層配線基板表面の研磨方法 |
JP2002118351A (ja) * | 2000-10-06 | 2002-04-19 | Matsushita Electric Ind Co Ltd | 導電ペーストの塗布方法 |
JP2003234370A (ja) * | 2002-02-07 | 2003-08-22 | Fujitsu Ltd | 電子部品の接続方法及びそれにより得られた接続構造体 |
JP2006128386A (ja) * | 2004-10-28 | 2006-05-18 | Olympus Corp | プラズマ洗浄装置及び方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011071153A (ja) * | 2009-09-24 | 2011-04-07 | Tanaka Kikinzoku Kogyo Kk | 回路基板の貫通電極の形成方法 |
KR20190013551A (ko) * | 2017-07-28 | 2019-02-11 | 아스리트 에프에이 가부시키가이샤 | 주상 부재 탑재 장치 및 주상 부재 탑재 방법 |
KR102150528B1 (ko) | 2017-07-28 | 2020-09-01 | 아스리트 에프에이 가부시키가이샤 | 주상 부재 탑재 장치 및 주상 부재 탑재 방법 |
JP2019102523A (ja) * | 2017-11-29 | 2019-06-24 | Fdk株式会社 | 回路基板およびその製造方法 |
JP7136552B2 (ja) | 2017-11-29 | 2022-09-13 | Fdk株式会社 | 回路基板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200830959A (en) | 2008-07-16 |
CN101207976A (zh) | 2008-06-25 |
JP4804324B2 (ja) | 2011-11-02 |
TWI472281B (zh) | 2015-02-01 |
US20080145972A1 (en) | 2008-06-19 |
CN101207976B (zh) | 2012-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4804324B2 (ja) | ペースト印刷装置およびペースト印刷方法 | |
TWI418436B (zh) | A solder ball printing apparatus and a solder ball printing method | |
JP3312377B2 (ja) | ろう材による接合方法及び装置 | |
WO2009144846A1 (ja) | 半田ボール搭載方法 | |
JP2007098241A (ja) | 吸着ノズル洗浄方法及び装置と電子部品実装装置 | |
JP4557821B2 (ja) | 微小粒子の配置装置および方法 | |
JP2006173195A (ja) | 微小粒子の配置方法および装置 | |
TWI604910B (zh) | A solder ball supplying method, a solder ball supplying device, and a solder bump forming method | |
JP2011218782A (ja) | ペースト印刷用スキージ、ペースト印刷装置、配線基板の製造方法 | |
WO2002035602A1 (fr) | Procede et dispositif de formation de bosses | |
JP2007142314A (ja) | はんだ接合用前処理装置、その前処理方法およびそれを適用した電子部品実装装置、電子部品 | |
KR20070010565A (ko) | 자동납땜기용 납땜장치 | |
JP6346981B2 (ja) | 結束線状部材、ボール振込ヘッド、ボール搭載装置およびボール搭載方法 | |
JP5076749B2 (ja) | シート印刷システム | |
JP4505783B2 (ja) | 半田バンプの製造方法及び製造装置 | |
JPS62234672A (ja) | 溶接ト−チのスパツタ除去方法 | |
JP4987350B2 (ja) | 微小ボールの除去方法及び除去装置 | |
JP2013153031A (ja) | はんだ付けノズルおよびそれを備えたはんだ付け装置 | |
JP2013207165A (ja) | 電極部品の自動搭載機 | |
JP2009188264A (ja) | バンプ形成方法 | |
JP2000312073A (ja) | プリント基板マスキング用部材 | |
JP2007152438A (ja) | 半導体製造装置及びその製造方法 | |
JP2006165092A (ja) | はんだ印刷方法 | |
JP3171015B2 (ja) | クリーニング方法及びクリーニング装置 | |
JP2007167792A (ja) | ディスペンサ装置およびそれを用いたペースト塗布方法並びにプリント配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090907 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110301 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110502 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110524 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110720 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110809 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110809 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140819 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |