JP5076749B2 - シート印刷システム - Google Patents
シート印刷システム Download PDFInfo
- Publication number
- JP5076749B2 JP5076749B2 JP2007227842A JP2007227842A JP5076749B2 JP 5076749 B2 JP5076749 B2 JP 5076749B2 JP 2007227842 A JP2007227842 A JP 2007227842A JP 2007227842 A JP2007227842 A JP 2007227842A JP 5076749 B2 JP5076749 B2 JP 5076749B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- solder paste
- sheet
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims (1)
- 半田ペーストを塗布する基板面上にフィルムを貼り付ける貼り付け装置と、前記フィルムに半田ペーストを塗布するための開口パターンを形成するパターン作成装置と、パターンを形成された基板上の残渣を洗浄する洗浄装置と、前記洗浄された基板に半田ペーストを印刷するため、印刷対象の基板形状と同じか多少小さな開口を備えたマスクを備え、前記マスク面からフィルム面を移動するスキージ先端部に半田ペーストを供給した後、スキージをマスク面及びシート状部材面に押付け力を作用させながら移動することで、フィルムに設けた開口パターンに半田ペーストを供給する印刷装置と、半田ペーストが印刷された基板を加熱して、半田ペーストを基板面に固着させるリフロー装置と、半田ペーストが固着された基板面からフィルムを除去する剥離装置とからなるシート印刷システムであって、前記剥離装置は、2〜8%の水酸化ナトリウムを含む水溶液からなる剥離液を40〜70℃の温度で保持して貯留した剥離液タンクと、前記剥離液タンクに浸漬した後の基板に、前記剥離液を、温度40〜70℃に保持し、吹き付け圧力0.1〜0.3MPaで吹き付けて除去するスプレー機構を有することを特徴とするシート印刷システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007227842A JP5076749B2 (ja) | 2007-09-03 | 2007-09-03 | シート印刷システム |
CN2008102110373A CN101384135B (zh) | 2007-09-03 | 2008-08-20 | 片材剥离装置及采用该装置的片材印刷系统 |
KR1020080081829A KR100998689B1 (ko) | 2007-09-03 | 2008-08-21 | 시트 박리장치와 그것을 이용한 시트 인쇄 시스템 |
TW097132547A TW200930192A (en) | 2007-09-03 | 2008-08-26 | Sheet releasing device and sheet printing system using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007227842A JP5076749B2 (ja) | 2007-09-03 | 2007-09-03 | シート印刷システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009060023A JP2009060023A (ja) | 2009-03-19 |
JP5076749B2 true JP5076749B2 (ja) | 2012-11-21 |
Family
ID=40463685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007227842A Expired - Fee Related JP5076749B2 (ja) | 2007-09-03 | 2007-09-03 | シート印刷システム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5076749B2 (ja) |
KR (1) | KR100998689B1 (ja) |
CN (1) | CN101384135B (ja) |
TW (1) | TW200930192A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011081837B4 (de) * | 2011-08-30 | 2021-08-05 | Christian Koenen Gmbh | Druckschablone für den technischen Druck |
CN112423487A (zh) * | 2020-09-21 | 2021-02-26 | 深圳市欣中大自动化技术有限公司 | 小型在线式全自动贴胶机 |
CN112317902A (zh) * | 2020-10-15 | 2021-02-05 | 南京朝至海商贸有限公司 | 一种智能制造用避免损伤的自动焊锡电话配件装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4022004B2 (ja) * | 1998-10-12 | 2007-12-12 | 互応化学工業株式会社 | 感光性樹脂組成物及びプリント配線板製造用フォトレジストインク |
JP2001160684A (ja) * | 1999-12-01 | 2001-06-12 | Matsushita Electric Ind Co Ltd | 多層配線基板の製造方法及び製造装置 |
JP4707273B2 (ja) * | 2000-12-26 | 2011-06-22 | イビデン株式会社 | 多層プリント配線板の製造方法 |
US20040173463A1 (en) | 2001-07-13 | 2004-09-09 | Itoh Jin-Ichi | Method for production of printed wiring board |
JP4398262B2 (ja) * | 2004-01-08 | 2010-01-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4855667B2 (ja) * | 2004-10-15 | 2012-01-18 | ハリマ化成株式会社 | 樹脂マスク層の除去方法およびはんだバンプ付き基板の製造方法 |
JP2006317542A (ja) * | 2005-05-10 | 2006-11-24 | Hitachi Chem Co Ltd | 感光性フィルム、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法 |
JP4453919B2 (ja) * | 2005-11-02 | 2010-04-21 | 富士通株式会社 | バンプ電極付き電子部品の製造方法 |
JP5012514B2 (ja) * | 2006-02-09 | 2012-08-29 | 日立化成工業株式会社 | 多層配線板の製造法 |
-
2007
- 2007-09-03 JP JP2007227842A patent/JP5076749B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-20 CN CN2008102110373A patent/CN101384135B/zh not_active Expired - Fee Related
- 2008-08-21 KR KR1020080081829A patent/KR100998689B1/ko not_active IP Right Cessation
- 2008-08-26 TW TW097132547A patent/TW200930192A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR100998689B1 (ko) | 2010-12-07 |
CN101384135A (zh) | 2009-03-11 |
JP2009060023A (ja) | 2009-03-19 |
CN101384135B (zh) | 2011-01-12 |
KR20090024069A (ko) | 2009-03-06 |
TW200930192A (en) | 2009-07-01 |
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