JP2008041781A - 研磨用組成物及び研磨方法 - Google Patents

研磨用組成物及び研磨方法 Download PDF

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Publication number
JP2008041781A
JP2008041781A JP2006211453A JP2006211453A JP2008041781A JP 2008041781 A JP2008041781 A JP 2008041781A JP 2006211453 A JP2006211453 A JP 2006211453A JP 2006211453 A JP2006211453 A JP 2006211453A JP 2008041781 A JP2008041781 A JP 2008041781A
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JP
Japan
Prior art keywords
polishing
polishing composition
group
conductor layer
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006211453A
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English (en)
Japanese (ja)
Inventor
Atsuki Kawamura
篤紀 河村
Masayuki Hattori
雅幸 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Priority to JP2006211453A priority Critical patent/JP2008041781A/ja
Priority to SG200705542-9A priority patent/SG139699A1/en
Priority to DE602007012026T priority patent/DE602007012026D1/de
Priority to TW096128012A priority patent/TWI417371B/zh
Priority to AT07253000T priority patent/ATE496103T1/de
Priority to EP07253000A priority patent/EP1894978B1/en
Priority to KR1020070077363A priority patent/KR101477796B1/ko
Priority to US11/832,403 priority patent/US8080476B2/en
Priority to CN 200710143759 priority patent/CN101117548B/zh
Publication of JP2008041781A publication Critical patent/JP2008041781A/ja
Pending legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2006211453A 2006-08-02 2006-08-02 研磨用組成物及び研磨方法 Pending JP2008041781A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2006211453A JP2008041781A (ja) 2006-08-02 2006-08-02 研磨用組成物及び研磨方法
SG200705542-9A SG139699A1 (en) 2006-08-02 2007-07-30 Polishing composition and polishing process
DE602007012026T DE602007012026D1 (de) 2006-08-02 2007-07-31 Polierzusammensetzung und Polierverfahren
TW096128012A TWI417371B (zh) 2006-08-02 2007-07-31 Abrasive composition and a grinding method
AT07253000T ATE496103T1 (de) 2006-08-02 2007-07-31 Polierzusammensetzung und polierverfahren
EP07253000A EP1894978B1 (en) 2006-08-02 2007-07-31 Polishing composition and polishing process
KR1020070077363A KR101477796B1 (ko) 2006-08-02 2007-08-01 연마용 조성물 및 연마 방법
US11/832,403 US8080476B2 (en) 2006-08-02 2007-08-01 Polishing composition and polishing process
CN 200710143759 CN101117548B (zh) 2006-08-02 2007-08-02 抛光用组合物以及抛光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006211453A JP2008041781A (ja) 2006-08-02 2006-08-02 研磨用組成物及び研磨方法

Publications (1)

Publication Number Publication Date
JP2008041781A true JP2008041781A (ja) 2008-02-21

Family

ID=39053811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006211453A Pending JP2008041781A (ja) 2006-08-02 2006-08-02 研磨用組成物及び研磨方法

Country Status (2)

Country Link
JP (1) JP2008041781A (zh)
CN (1) CN101117548B (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041782A (ja) * 2006-08-02 2008-02-21 Fujimi Inc 研磨用組成物及び研磨方法
US7621799B2 (en) 2006-08-08 2009-11-24 Sony Corporation Polishing method and polishing device
EP2348080A1 (en) 2010-01-25 2011-07-27 Fujimi Incorporated Polishing composition and polishing method using the same
EP2374852A1 (en) 2010-04-08 2011-10-12 Fujimi Incorporated Polishing composition and polishing method
WO2012020672A1 (ja) 2010-08-09 2012-02-16 株式会社 フジミインコーポレーテッド 研磨用組成物および研磨方法
JP2016194004A (ja) * 2015-03-31 2016-11-17 株式会社フジミインコーポレーテッド 研磨用組成物および研磨物の製造方法
JP2016193955A (ja) * 2013-09-13 2016-11-17 株式会社フジミインコーポレーテッド 研磨用組成物
CN115160934A (zh) * 2022-07-29 2022-10-11 江苏山水半导体科技有限公司 超亲水性大尺寸硅精抛液及其制备和使用方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102533118B (zh) * 2010-12-10 2015-05-27 安集微电子（上海）有限公司 一种化学机械抛光浆料
TWI456013B (zh) * 2012-04-10 2014-10-11 Uwiz Technology Co Ltd 研磨液組成物
CN103865401A (zh) * 2012-12-10 2014-06-18 安集微电子（上海）有限公司 一种化学机械抛光液的应用
CN103865400A (zh) * 2012-12-10 2014-06-18 安集微电子（上海）有限公司 一种磷酸酯表面活性剂在自停止抛光中的应用
JP6354084B2 (ja) * 2013-04-16 2018-07-11 メック株式会社 エッチング液、補給液、及び配線形成方法
CN103937414B (zh) * 2014-04-29 2018-03-02 杰明纳微电子股份有限公司 一种计算机硬盘盘基片的精抛光液
CN108250978A (zh) * 2016-12-28 2018-07-06 安集微电子科技（上海）股份有限公司 一种化学机械抛光液及其应用
CN109972145B (zh) * 2017-12-27 2023-11-17 安集微电子（上海）有限公司 一种化学机械抛光液
CN109971353B (zh) * 2017-12-27 2021-12-07 安集微电子（上海）有限公司 一种化学机械抛光液
CN114958206B (zh) * 2021-02-22 2024-02-02 万华化学集团电子材料有限公司 一种铜化学机械抛光液及其应用和化学机械抛光方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002161267A (ja) * 2000-11-27 2002-06-04 Hitachi Chem Co Ltd 白金族金属用研磨液及びそれを用いた研磨方法
JP2004123921A (ja) * 2002-10-02 2004-04-22 Fujimi Inc 研磨用組成物
JP2004297035A (ja) * 2003-03-13 2004-10-21 Hitachi Chem Co Ltd 研磨剤、研磨方法及び電子部品の製造方法
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005123482A (ja) * 2003-10-17 2005-05-12 Fujimi Inc 研磨方法
JP2005158970A (ja) * 2003-11-25 2005-06-16 Fujimi Inc 研磨用組成物
JP2005159166A (ja) * 2003-11-27 2005-06-16 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
JP2005333160A (ja) * 2005-08-04 2005-12-02 Hitachi Chem Co Ltd 素子分離形成方法
JP2006049709A (ja) * 2004-08-06 2006-02-16 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
JP2006191134A (ja) * 2006-02-13 2006-07-20 Hitachi Chem Co Ltd 研磨剤及び基板の研磨法
JP2006196887A (ja) * 2004-12-22 2006-07-27 Rohm & Haas Electronic Materials Cmp Holdings Inc ケミカルメカニカルポリッシングのための選択的スラリー

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5026665B2 (ja) * 2004-10-15 2012-09-12 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002161267A (ja) * 2000-11-27 2002-06-04 Hitachi Chem Co Ltd 白金族金属用研磨液及びそれを用いた研磨方法
JP2004123921A (ja) * 2002-10-02 2004-04-22 Fujimi Inc 研磨用組成物
JP2004297035A (ja) * 2003-03-13 2004-10-21 Hitachi Chem Co Ltd 研磨剤、研磨方法及び電子部品の製造方法
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005123482A (ja) * 2003-10-17 2005-05-12 Fujimi Inc 研磨方法
JP2005158970A (ja) * 2003-11-25 2005-06-16 Fujimi Inc 研磨用組成物
JP2005159166A (ja) * 2003-11-27 2005-06-16 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
JP2006049709A (ja) * 2004-08-06 2006-02-16 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
JP2006196887A (ja) * 2004-12-22 2006-07-27 Rohm & Haas Electronic Materials Cmp Holdings Inc ケミカルメカニカルポリッシングのための選択的スラリー
JP2005333160A (ja) * 2005-08-04 2005-12-02 Hitachi Chem Co Ltd 素子分離形成方法
JP2006191134A (ja) * 2006-02-13 2006-07-20 Hitachi Chem Co Ltd 研磨剤及び基板の研磨法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041782A (ja) * 2006-08-02 2008-02-21 Fujimi Inc 研磨用組成物及び研磨方法
US7621799B2 (en) 2006-08-08 2009-11-24 Sony Corporation Polishing method and polishing device
EP2348080A1 (en) 2010-01-25 2011-07-27 Fujimi Incorporated Polishing composition and polishing method using the same
US8703007B2 (en) 2010-01-25 2014-04-22 Fujimi Incorporated Polishing composition and polishing method using the same
EP2374852A1 (en) 2010-04-08 2011-10-12 Fujimi Incorporated Polishing composition and polishing method
WO2012020672A1 (ja) 2010-08-09 2012-02-16 株式会社 フジミインコーポレーテッド 研磨用組成物および研磨方法
US9117761B2 (en) 2010-08-09 2015-08-25 Fujimi Incorporated Polishing composition and polishing method
JP2016193955A (ja) * 2013-09-13 2016-11-17 株式会社フジミインコーポレーテッド 研磨用組成物
JP2016194004A (ja) * 2015-03-31 2016-11-17 株式会社フジミインコーポレーテッド 研磨用組成物および研磨物の製造方法
CN115160934A (zh) * 2022-07-29 2022-10-11 江苏山水半导体科技有限公司 超亲水性大尺寸硅精抛液及其制备和使用方法
CN115160934B (zh) * 2022-07-29 2023-08-25 江苏山水半导体科技有限公司 超亲水性大尺寸硅精抛液及其制备和使用方法

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CN101117548B (zh) 2012-06-13
CN101117548A (zh) 2008-02-06

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