JP2008020530A - 電気光学装置、及びこれを備えた電子機器 - Google Patents
電気光学装置、及びこれを備えた電子機器 Download PDFInfo
- Publication number
- JP2008020530A JP2008020530A JP2006190391A JP2006190391A JP2008020530A JP 2008020530 A JP2008020530 A JP 2008020530A JP 2006190391 A JP2006190391 A JP 2006190391A JP 2006190391 A JP2006190391 A JP 2006190391A JP 2008020530 A JP2008020530 A JP 2008020530A
- Authority
- JP
- Japan
- Prior art keywords
- contact hole
- scanning line
- semiconductor layer
- electro
- scanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 43
- 239000003990 capacitor Substances 0.000 claims description 40
- 238000003860 storage Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 abstract description 107
- 238000000034 method Methods 0.000 abstract description 26
- 230000008569 process Effects 0.000 abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 239000010409 thin film Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 97
- 239000004973 liquid crystal related substance Substances 0.000 description 50
- 239000011229 interlayer Substances 0.000 description 27
- 239000000872 buffer Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000012535 impurity Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005070 sampling Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 229910018594 Si-Cu Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910008465 Si—Cu Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3648—Control of matrices with row and column drivers using an active matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0404—Matrix technologies
- G09G2300/0408—Integration of the drivers onto the display substrate
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/08—Fault-tolerant or redundant circuits, or circuits in which repair of defects is prepared
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】電気光学装置は、ゲート電極3a及び3bを有するTFT30と、TFT30とコンタクトホール81を介して接続されたデータ線6aと、データ線6aと同一膜から形成され、下部容量電極71とコンタクトホール84を介して接続された中継層93と、データ線6aと同一膜から形成された出力線99とを備える。更に、出力線99とコンタクトホール811を介して接続された走査線11aと、開孔部812a及び812bが重なるように配置されることにより形成されたコンタクトホール812を介して出力線99と接続された走査線11bを備える。コンタクトホール81、コンタクトホール811及び開孔部812aは互いに同一工程によって開孔され、コンタクトホール84、開孔部812bは互いに同一工程によって開孔される。
【選択図】図12
Description
ここで、例えば、走査線、データ線及びトランジスタは、基板上で平面的に見て、画素電極に対応する各画素の開口領域(即ち、各画素において、表示に実際に寄与する光が透過又は反射される領域)を囲む非開口領域内に配置されている。即ち、これらの走査線、データ線及びトランジスタは、表示の妨げとならないように、各画素の開口領域ではなく、非開口領域内に配置されている。
<第1実施形態>
第1実施形態に係る液晶装置について、図1から図13を参照して説明する。
<電子機器>
次に、上述した電気光学装置である液晶装置を各種の電子機器に適用する場合について説明する。ここに図14は、プロジェクタの構成例を示す平面図である。以下では、この液晶装置をライトバルブとして用いたプロジェクタについて説明する。
Claims (6)
- 基板上に、
画素電極と、
該画素電極と電気的に接続されており、(i)チャネル領域を有する半導体層と、(ii)前記半導体層よりも上層側に前記チャネル領域と重なるように形成された第1ゲート電極と、(iii)前記半導体層よりも下層側に前記チャネル領域と重なるように形成された第2ゲート電極とを有するトランジスタと、
前記第1ゲート電極よりも上層側に形成されており、前記半導体層と第1コンタクトホールを介して接続されたデータ線と、
前記半導体層及び前記画素電極と電気的に接続されており、蓄積容量を構成する画素電位側容量電極と、
前記データ線と同一膜から形成されており、前記画素電位側容量電極と第2コンタクトホールを介して接続されると共に前記画素電極と電気的に接続された中継層と、
前記第1及び第2ゲート電極に走査信号を供給するための走査線駆動回路と、
前記データ線と同一膜から形成されており、前記走査線駆動回路から前記走査信号が出力される出力線と、
前記第1ゲート電極と同一膜から形成されており、前記第1コンタクトホールを開孔する工程と同一工程によって開孔される第3コンタクトホールを介して前記出力線と接続された第1走査線と、
前記第2ゲート電極と同一膜から形成されており、前記出力線と、前記第1コンタクトホールを開孔する工程と同一工程によって開孔される第1開孔部と前記第2コンタクトホールを開孔する工程と同一工程によって開孔される第2開孔部とが互いに重なるように配置されることにより形成された第4コンタクトホールを介して接続された第2走査線と
を備えたことを特徴とする電気光学装置。 - 前記第2走査線は、遮光性の導電材料を含んでなることを特徴とする請求項1に記載の電気光学装置。
- 前記半導体層は、前記チャネル領域の両側の各々に設けられたLDD領域を有し、
前記第2走査線は、前記LDD領域に少なくとも部分的に重なる
ことを特徴とする請求項1又は2に記載の電気光学装置。 - 前記第2走査線は、前記半導体層のソース領域及びドレイン領域と少なくとも部分的に重なることを特徴とする請求項3に記載の電気光学装置。
- 前記第1開孔部は、前記第2開孔部が形成された後に、前記基板上で平面的に見て、前記第2開孔部の内側に形成されることを特徴とする請求項1から4のいずれか一項に記載の電気光学装置。
- 請求項1から5のいずれか一項に記載の電気光学装置を具備してなる電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006190391A JP4155317B2 (ja) | 2006-07-11 | 2006-07-11 | 電気光学装置、及びこれを備えた電子機器 |
US11/753,978 US7952551B2 (en) | 2006-07-11 | 2007-05-25 | Electro-optical device and electronic apparatus including same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006190391A JP4155317B2 (ja) | 2006-07-11 | 2006-07-11 | 電気光学装置、及びこれを備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008020530A true JP2008020530A (ja) | 2008-01-31 |
JP4155317B2 JP4155317B2 (ja) | 2008-09-24 |
Family
ID=38948762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006190391A Active JP4155317B2 (ja) | 2006-07-11 | 2006-07-11 | 電気光学装置、及びこれを備えた電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7952551B2 (ja) |
JP (1) | JP4155317B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016170443A1 (ja) * | 2015-04-20 | 2016-10-27 | 株式会社半導体エネルギー研究所 | 半導体装置および電子機器 |
WO2019240344A1 (ko) * | 2018-06-15 | 2019-12-19 | 삼성디스플레이 주식회사 | 표시 장치 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4561647B2 (ja) * | 2006-02-02 | 2010-10-13 | セイコーエプソン株式会社 | 電気光学装置用基板、電気光学装置および検査方法 |
KR101802845B1 (ko) * | 2011-02-23 | 2017-11-30 | 삼성디스플레이 주식회사 | 어레이 기판, 이를 갖는 표시 장치 및 이의 제조 방법 |
CN104538399B (zh) * | 2014-10-31 | 2017-10-03 | 厦门天马微电子有限公司 | 一种ltps阵列基板及其制造方法 |
KR102504129B1 (ko) * | 2016-03-31 | 2023-02-28 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102621005B1 (ko) * | 2018-12-26 | 2024-01-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR20210013488A (ko) * | 2019-07-26 | 2021-02-04 | 삼성디스플레이 주식회사 | 표시장치 및 표시장치의 구동 방법 |
KR20210086474A (ko) * | 2019-12-31 | 2021-07-08 | 엘지디스플레이 주식회사 | 표시 장치 |
CN112255852A (zh) * | 2020-10-23 | 2021-01-22 | 深圳市华星光电半导体显示技术有限公司 | 显示装置及发光面板 |
KR20240087306A (ko) * | 2022-12-12 | 2024-06-19 | 엘지디스플레이 주식회사 | 표시패널과 이를 포함한 표시장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0194670A (ja) * | 1987-10-06 | 1989-04-13 | Fujitsu Ltd | アクティブマトリクス型表示装置 |
JPH1062810A (ja) * | 1996-08-19 | 1998-03-06 | Sanyo Electric Co Ltd | 半導体装置 |
JP2001309239A (ja) * | 2000-04-24 | 2001-11-02 | Casio Comput Co Ltd | フォトセンサアレイおよび2次元画像の読取装置 |
JP2002006773A (ja) * | 2000-06-19 | 2002-01-11 | Advanced Display Inc | アレイ基板およびそれを用いた表示装置ならびにアレイ基板の製造方法 |
JP2006049928A (ja) * | 2005-09-29 | 2006-02-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP2006048086A (ja) * | 2002-11-26 | 2006-02-16 | Seiko Epson Corp | 電気光学装置及び電子機器 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5591659A (en) * | 1992-04-16 | 1997-01-07 | Fujitsu Limited | Process of producing a semiconductor device in which a height difference between a memory cell area and a peripheral area is eliminated |
US6492190B2 (en) * | 1998-10-05 | 2002-12-10 | Sony Corporation | Method of producing electrooptical device and method of producing driving substrate for driving electrooptical device |
US6630977B1 (en) * | 1999-05-20 | 2003-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with capacitor formed around contact hole |
KR100341663B1 (ko) * | 1999-09-27 | 2002-06-24 | 윤종용 | 사진공정이 감소된 반도체 장치의 비트라인 콘택홀을 형성하는 방법 |
JP2002176114A (ja) * | 2000-09-26 | 2002-06-21 | Toshiba Corp | 半導体装置及びその製造方法 |
JP4662647B2 (ja) * | 2001-03-30 | 2011-03-30 | シャープ株式会社 | 表示装置及びその製造方法 |
JP4731718B2 (ja) | 2001-04-27 | 2011-07-27 | 株式会社半導体エネルギー研究所 | 表示装置 |
KR100796795B1 (ko) * | 2001-10-22 | 2008-01-22 | 삼성전자주식회사 | 반도체 소자의 접촉부 및 그 제조 방법과 이를 포함하는표시 장치용 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
JP3821067B2 (ja) * | 2002-07-11 | 2006-09-13 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
JP3870941B2 (ja) * | 2002-10-31 | 2007-01-24 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
US7532187B2 (en) * | 2004-09-28 | 2009-05-12 | Sharp Laboratories Of America, Inc. | Dual-gate transistor display |
US20060068532A1 (en) * | 2004-09-28 | 2006-03-30 | Sharp Laboratories Of America, Inc. | Dual-gate thin-film transistor |
JP5152448B2 (ja) * | 2004-09-21 | 2013-02-27 | カシオ計算機株式会社 | 画素駆動回路及び画像表示装置 |
KR101085450B1 (ko) * | 2005-02-07 | 2011-11-21 | 삼성전자주식회사 | 박막트랜지스터 기판과 그 제조방법 |
KR20060111267A (ko) * | 2005-04-22 | 2006-10-26 | 삼성전자주식회사 | 어레이 기판 및 이의 제조 방법 |
KR101122235B1 (ko) * | 2005-04-22 | 2012-03-19 | 삼성전자주식회사 | 반투과형 액정 표시 장치 및 그 제조 방법 |
KR20070000025A (ko) * | 2005-06-24 | 2007-01-02 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
JP4301227B2 (ja) * | 2005-09-15 | 2009-07-22 | セイコーエプソン株式会社 | 電気光学装置及びその製造方法、電子機器並びにコンデンサー |
-
2006
- 2006-07-11 JP JP2006190391A patent/JP4155317B2/ja active Active
-
2007
- 2007-05-25 US US11/753,978 patent/US7952551B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0194670A (ja) * | 1987-10-06 | 1989-04-13 | Fujitsu Ltd | アクティブマトリクス型表示装置 |
JPH1062810A (ja) * | 1996-08-19 | 1998-03-06 | Sanyo Electric Co Ltd | 半導体装置 |
JP2001309239A (ja) * | 2000-04-24 | 2001-11-02 | Casio Comput Co Ltd | フォトセンサアレイおよび2次元画像の読取装置 |
JP2002006773A (ja) * | 2000-06-19 | 2002-01-11 | Advanced Display Inc | アレイ基板およびそれを用いた表示装置ならびにアレイ基板の製造方法 |
JP2006048086A (ja) * | 2002-11-26 | 2006-02-16 | Seiko Epson Corp | 電気光学装置及び電子機器 |
JP2006049928A (ja) * | 2005-09-29 | 2006-02-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016170443A1 (ja) * | 2015-04-20 | 2016-10-27 | 株式会社半導体エネルギー研究所 | 半導体装置および電子機器 |
JPWO2016170443A1 (ja) * | 2015-04-20 | 2018-03-29 | 株式会社半導体エネルギー研究所 | 半導体装置および電子機器 |
US10591791B2 (en) | 2015-04-20 | 2020-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
WO2019240344A1 (ko) * | 2018-06-15 | 2019-12-19 | 삼성디스플레이 주식회사 | 표시 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP4155317B2 (ja) | 2008-09-24 |
US20080012812A1 (en) | 2008-01-17 |
US7952551B2 (en) | 2011-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4155317B2 (ja) | 電気光学装置、及びこれを備えた電子機器 | |
JP6152880B2 (ja) | 電気光学装置及び電子機器 | |
JP5782676B2 (ja) | 電気光学装置及び電子機器、並びに電気光学装置の製造方法 | |
JP4225347B2 (ja) | 電気光学装置及び電子機器 | |
JP2005018031A (ja) | 電気光学装置及びこれを備えた電子機器 | |
JP5724531B2 (ja) | 電気光学装置及び電子機器 | |
JP4241777B2 (ja) | 電気光学装置及び電子機器 | |
JP4640026B2 (ja) | 電気光学装置及び電子機器 | |
JP2009047967A (ja) | 電気光学装置及び電子機器 | |
JP2008151901A (ja) | 電気光学装置及び電子機器 | |
JP2008134272A (ja) | 電気光学装置、及びこれを備えた電子機器 | |
JP5223418B2 (ja) | 電気光学装置及び電子機器 | |
JP5909919B2 (ja) | 電気光学装置及び電子機器 | |
JP4973024B2 (ja) | 電気光学装置及び電子機器 | |
JP2008191518A (ja) | 電気光学装置用基板及び電気光学装置、並びに電子機器 | |
JP5050530B2 (ja) | 電気光学装置及びその駆動方法並びに電子機器 | |
JP2007304353A (ja) | 電気光学装置用基板及び電気光学装置、並びに電子機器 | |
JP4984911B2 (ja) | 電気光学装置及び電子機器 | |
JP2008033177A (ja) | 電気光学装置用基板及び電気光学装置、並びに電子機器 | |
JP5278584B2 (ja) | 電気光学装置及び電子機器 | |
JP2011180550A (ja) | 電気光学装置及び電子機器 | |
JP2008026766A (ja) | 電気光学装置、及びこれを備えた電子機器 | |
JP2011191476A (ja) | 電気光学装置及び電子機器 | |
JP2008039794A (ja) | 電気光学装置用基板及び電気光学装置、並びに電子機器 | |
JP2009265357A (ja) | 電気光学装置及び電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080611 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080617 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080630 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110718 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4155317 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110718 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120718 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120718 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130718 Year of fee payment: 5 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |