JP2007500443A5 - - Google Patents

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Publication number
JP2007500443A5
JP2007500443A5 JP2006521869A JP2006521869A JP2007500443A5 JP 2007500443 A5 JP2007500443 A5 JP 2007500443A5 JP 2006521869 A JP2006521869 A JP 2006521869A JP 2006521869 A JP2006521869 A JP 2006521869A JP 2007500443 A5 JP2007500443 A5 JP 2007500443A5
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JP
Japan
Prior art keywords
layer
forming
arc
organic
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006521869A
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English (en)
Japanese (ja)
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JP2007500443A (ja
JP4677407B2 (ja
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Publication date
Priority claimed from US10/628,668 external-priority patent/US6972255B2/en
Application filed filed Critical
Publication of JP2007500443A publication Critical patent/JP2007500443A/ja
Publication of JP2007500443A5 publication Critical patent/JP2007500443A5/ja
Application granted granted Critical
Publication of JP4677407B2 publication Critical patent/JP4677407B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2006521869A 2003-07-28 2004-07-13 有機反射防止膜（ａｒｃ）を有する半導体装置の製造方法 Expired - Lifetime JP4677407B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/628,668 US6972255B2 (en) 2003-07-28 2003-07-28 Semiconductor device having an organic anti-reflective coating (ARC) and method therefor
PCT/US2004/022434 WO2005013320A2 (en) 2003-07-28 2004-07-13 A semiconductor device having an organic anti-reflective coating (arc) and method therefor

Publications (3)

Publication Number Publication Date
JP2007500443A JP2007500443A (ja) 2007-01-11
JP2007500443A5 true JP2007500443A5 (enExample) 2007-08-23
JP4677407B2 JP4677407B2 (ja) 2011-04-27

Family

ID=34103421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006521869A Expired - Lifetime JP4677407B2 (ja) 2003-07-28 2004-07-13 有機反射防止膜（ａｒｃ）を有する半導体装置の製造方法

Country Status (7)

Country Link
US (3) US6972255B2 (enExample)
EP (1) EP1652225A4 (enExample)
JP (1) JP4677407B2 (enExample)
KR (1) KR101164690B1 (enExample)
CN (1) CN100461350C (enExample)
TW (1) TWI348777B (enExample)
WO (1) WO2005013320A2 (enExample)

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US20090197086A1 (en) * 2008-02-04 2009-08-06 Sudha Rathi Elimination of photoresist material collapse and poisoning in 45-nm feature size using dry or immersion lithography
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US10510582B2 (en) 2016-06-14 2019-12-17 QROMIS, Inc. Engineered substrate structure
CN114256068B (zh) * 2016-06-14 2025-08-01 克罗米斯有限公司 用于功率应用和射频应用的工程化衬底结构
US10297445B2 (en) 2016-06-14 2019-05-21 QROMIS, Inc. Engineered substrate structure for power and RF applications
CN110660839B (zh) * 2019-11-13 2022-04-29 京东方科技集团股份有限公司 一种显示面板及其制备方法

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