JP2007227708A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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Abstract
【解決手段】絶縁性材質からなるボードコアと、ボードコアの第1の面に形成される金属からなる配線と、配線を覆うソルダーレジスト膜と、ソルダーレジスト膜に設けた細長溝からなる開口とを有し、開口の底には細長い配線が並列に複数本配置される四角形の配線基板と、配線基板の開口の底に並ぶ配線にフリップ・チップ接続される半導体チップと、配線基板と半導体チップとの間の隙間を埋めるアンダーフィル樹脂とを少なくとも有する半導体装置であって、開口は配線基板の4辺に沿って延在し、配線は開口幅員方向に沿って延在し、開口の一対の長辺からなる縁は開口の幅員が長短と繰り返して現れるようなジグザグ縁となり、ジグザグ縁によって形成される開口の幅員外側に向かって窪む窪み縁部分は配線上に対応し、ジグザグ縁によって形成される開口の幅員内側に向かって突出する突出縁部分は隣接する配線間のボードコア上に対応している。
【選択図】図3
Description
本発明の前記ならびにそのほかの目的と新規な特徴は、本明細書の記述および添付図面からあきらかになるであろう。
絶縁性材質からなるボードコアと、前記ボードコアの第1の面に形成される金属からなる配線と、前記配線を覆うように前記第1の面に形成されるソルダーレジスト膜と、前記ソルダーレジスト膜を部分的に開口して形成される開口とを有し、前記開口の底には細長い前記配線が並列に複数本配置される四角形の配線基板と、
前記配線基板の前記開口の底に並ぶ前記配線に導電性の接合材を介して電極がフリップ・チップ接続される半導体チップと、
前記配線基板と前記半導体チップとの間の隙間を埋める絶縁性の樹脂とを少なくとも有する半導体装置であって、
前記開口は前記配線基板の前記四角形の少なくとも対面する2辺に沿って延在する細長溝からなり、
前記配線は前記開口の長手方向に直交する幅員方向に沿って延在し、
前記開口の一対の対面する長手方向に沿う縁は前記開口の前記幅員が長短と繰り返して現れるようなジグザグ縁となり、
前記ジグザグ縁によって形成される前記開口の前記幅員外側に向かって窪む窪み縁部分は前記配線上に対応し、前記ジグザグ縁によって形成される前記開口の前記幅員内側に向かって突出する突出縁部分は隣接する前記配線間の前記ボードコア上に対応していることを特徴とする。また、前記ジグザグ縁は直線的に折れ曲がる縁になっている。また、前記開口内の前記配線はその表面に金属からなるメッキ膜が形成されている。
(a)絶縁性材質からなるボードコアと、前記ボードコアの第1の面に形成される金属からなる配線と、前記配線を覆うように前記第1の面に形成されるソルダーレジスト膜と、前記ソルダーレジスト膜を部分的に開口して形成される複数の開口とを有し、前記開口の底には細長い前記配線が並列に複数本配置される四角形の配線基板を準備する工程、
(b)前記配線基板の前記第1の面であり、前記複数の開口に囲まれる領域内に絶縁性の樹脂を塗布する工程、
(c)前記配線基板の前記第1の面に電極が対面する状態で半導体チップを押し付け、前記各電極を前記開口内の前記配線にフリップ・チップ接続させるとともに、前記絶縁性の樹脂を前記半導体チップで押し広げて前記配線基板と前記半導体チップの間の隙間を埋める工程とを有する半導体装置の製造方法であって、
前記工程(a)においては、前記ソルダーレジスト膜で前記開口を形成する際、前記開口を四角形となる前記配線基板の少なくとも対面する2辺に沿って延在する細長溝として形成するとともに、前記配線は前記開口の長手方向に直交する幅員方向に沿って延在するように形成し、
前記開口の一対の対面する長手方向に沿う縁は前記開口の前記幅員が長短と繰り返して現れるようにジグザグ縁に形成し、
前記ジグザグ縁によって形成される前記開口の前記幅員外側に向かって窪む窪み縁部分は前記配線上に対応するように形成し、
前記ジグザグ縁によって形成される前記開口の前記幅員内側に向かって突出する突出縁部分は隣接する前記配線間の前記ボードコア上に対応するように形成することによって製造される。
前記(1)の手段によれば、(a)配線基板にフリップ・チップ接続される半導体チップの電極は、配線基板の表面に部分的に塗布されたアンダーフィル樹脂を半導体チップで押し潰す操作に基づいて細長の配線に接続される。配線は細長く、配線基板の表面に設けられるソルダーレジスト膜を開口して形成した細長溝からなる開口の底に位置している。フリップ・チップ接続の際、押し潰されて流れるアンダーフィル樹脂はソルダーレジスト膜上から開口内に入り、流れ、開口から抜けて再びソルダーレジスト膜上に流れる。この際、アンダーフィル樹脂は開口内において細長の配線の延在方向に沿うように流れる。アンダーフィル樹脂の流れる(移動)速度は、ボードコアの表面を流れる場合に比較して金属からなる配線の表面の方が早い。また、ジグザグ縁によって形成される開口の幅員外側に向かって窪む窪み縁部分は配線上に対応し、開口の幅員内側に向かって突出する突出縁部分は隣接する配線間のボードコア上に対応するため、配線上の開口幅員はボードコア上の開口幅員よりも長い。また、ソルダーレジスト膜上を流れるアンダーフィル樹脂は、開口のジグザク縁全体に所定量到達したとき開口内に流入する。この結果、配線上を進むアンダーフィル樹脂の移動距離はボードコア上を進むアンダーフィル樹脂の移動距離に比較して長くなるため、流れるアンダーフィル樹脂の先頭部分は、配線上及びボードコア上でも大差なく進み、その進みの差は小さいことからアンダーフィル樹脂の先頭の乱れに伴う空気の巻き込みが発生し難くなる。従って、アンダーフィル樹脂層中に気泡(ボイド)を発生させることのない半導体装置を製造することができる。
b−c=α
(1)配線母基板30(切断されて配線基板2になる)にフリップ・チップ接続される半導体チップ15の電極(突起電極17)は、配線母基板30の各製品形成部30dの表面に部分的に塗布されたアンダーフィル樹脂20を半導体チップ15で押し潰す操作に基づいて細長の配線3(接続パッド11)に接続される。配線3は細長く、配線母基板30の表面に設けられるソルダーレジスト膜9を開口して形成した細長溝からなる開口10の底に位置している。フリップ・チップ接続の際、押し潰されて流れるアンダーフィル樹脂20はソルダーレジスト膜9上から開口10内に入り、開口10内を流れ、開口10から抜けて再びソルダーレジスト膜9上に流れる。この際、アンダーフィル樹脂20は開口10内において細長の配線3の延在方向に沿うように流れる。アンダーフィル樹脂20の流れる(移動)速度は、配線母基板30を構成するボードコア13の表面を流れる場合に比較して金属からなる配線3(ハンダ層12)の表面の方が早い。また、ジグザグ縁6によって形成される開口10の幅員外側に向かって窪む窪み縁部分6aは配線3上に対応し、開口10の幅員内側に向かって突出する突出縁部分6bは隣接する配線3間に露出するボードコア13上に対応(位置)するため、配線3上の開口幅員bはボードコア13上の開口幅員cよりも長い。また、ソルダーレジスト膜9上を流れるアンダーフィル樹脂20は、開口10のジグザグ縁6全体に所定量到達したとき開口10内に流入する。この結果、配線3上を進むアンダーフィル樹脂20の移動距離はボードコア13上を進むアンダーフィル樹脂20の移動距離に比較して長くなるため、流れるアンダーフィル樹脂20の先頭部分は、配線3上及びボードコア13上でも大差なく進み、アンダーフィル樹脂20の先頭の乱れに伴う空気の巻き込みが発生し難くなる。従って、アンダーフィル樹脂層中に気泡(ボイド)を発生させることのない半導体装置1を製造することができる。
以上本発明者によってなされた発明を実施例に基づき具体的に説明したが、本発明は上記実施例に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能であることはいうまでもない。実施例では、開口を四角形の配線基板の各辺に沿ってそれぞれ設けたが、対面する2辺に開口を設ける構造であっても、実施例同様に気泡(ボイド)発生を抑止することができる。対面する2辺に開口を設ける構造とは、半導体チップ15において、四角形の半導体チップ15の両側に沿ってそれぞれ電極が配列される構造である。
Claims (5)
- 絶縁性材質からなるボードコアと、前記ボードコアの第1の面に形成される金属からなる配線と、前記配線を覆うように前記第1の面に形成されるソルダーレジスト膜と、前記ソルダーレジスト膜を部分的に開口して形成される開口とを有し、前記開口の底には細長い前記配線が並列に複数本配置される四角形の配線基板と、
前記配線基板の前記開口の底に並ぶ前記配線に導電性の接合材を介して電極がフリップ・チップ接続される半導体チップと、
前記配線基板と前記半導体チップとの間の隙間を埋める絶縁性の樹脂とを少なくとも有する半導体装置であって、
前記開口は前記配線基板の前記四角形の少なくとも対面する2辺に沿って延在する細長溝からなり、
前記配線は前記開口の長手方向に直交する幅員方向に沿って延在し、
前記開口の一対の対面する長手方向に沿う縁は前記開口の前記幅員が長短と繰り返して現れるようなジグザグ縁となり、
前記ジグザグ縁によって形成される前記開口の前記幅員外側に向かって窪む窪み縁部分は前記配線上に対応し、前記ジグザグ縁によって形成される前記開口の前記幅員内側に向かって突出する突出縁部分は隣接する前記配線間の前記ボードコア上に対応していることを特徴とする半導体装置。 - 前記ジグザグ縁は直線的に折れ曲がる縁になっていることを特徴とする請求項1に記載の半導体装置。
- 前記ジグザグ縁は波状に曲線的に折れ曲がる縁になっていることを特徴とする請求項1に記載の半導体装置。
- 前記開口内の前記配線はその表面に金属からなるメッキ膜が形成されていることを特徴とする請求項1に記載の半導体装置。
- (a)絶縁性材質からなるボードコアと、前記ボードコアの第1の面に形成される金属からなる配線と、前記配線を覆うように前記第1の面に形成されるソルダーレジスト膜と、前記ソルダーレジスト膜を部分的に開口して形成される複数の開口とを有し、前記開口の底には細長い前記配線が並列に複数本配置される四角形の配線基板を準備する工程、
(b)前記配線基板の前記第1の面であり、前記複数の開口に囲まれる領域内に絶縁性の樹脂を塗布する工程、
(c)前記配線基板の前記第1の面に電極が対面する状態で半導体チップを押し付け、前記各電極を前記開口内の前記配線にフリップ・チップ接続させるとともに、前記絶縁性の樹脂を前記半導体チップで押し広げて前記配線基板と前記半導体チップの間の隙間を埋める工程とを有する半導体装置の製造方法であって、
前記工程(a)においては、前記ソルダーレジスト膜で前記開口を形成する際、前記開口を四角形となる前記配線基板の少なくとも対面する2辺に沿って延在する細長溝として形成するとともに、前記配線は前記開口の長手方向に直交する幅員方向に沿って延在するように形成し、
前記開口の一対の対面する長手方向に沿う縁は前記開口の前記幅員が長短と繰り返して現れるようにジグザグ縁に形成し、
前記ジグザグ縁によって形成される前記開口の前記幅員外側に向かって窪む窪み縁部分は前記配線上に対応するように形成し、
前記ジグザグ縁によって形成される前記開口の前記幅員内側に向かって突出する突出縁部分は隣接する前記配線間の前記ボードコア上に対応するように形成することを特徴とする半導体装置の製造方法。
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