JP2006296865A - 光検出ユニット、光検出装置、及びx線断層撮像装置 - Google Patents
光検出ユニット、光検出装置、及びx線断層撮像装置 Download PDFInfo
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- G01T1/20—Measuring radiation intensity with scintillation detectors
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- G—PHYSICS
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- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20186—Position of the photodiode with respect to the incoming radiation, e.g. in the front of, below or sideways the scintillator
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- G—PHYSICS
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- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
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- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4283—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by a detector unit being housed in a cassette
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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Abstract
【解決手段】 光検出ユニット1において、セラミックの焼成体により形成された支持基板20の裏面には、2つの取付用構造体30が固定されている。光検出ユニット1の製造工程において、各取付用構造体30は、グリーンシートの積層体を焼成してセラミックの焼成体を形成した後に、支持基板20の裏面に接合される。これにより、取付用構造体30を、支持基板20の裏面に精度良く配置して、光検出ユニット1の取付作業性を良くすることができる。
【選択図】 図2
Description
Claims (11)
- 複数のフォトダイオードが配列されてなるフォトダイオードアレイが形成された半導体基板と、
セラミックの焼成体により形成され、前記半導体基板が表面に配置された支持基板と、
前記支持基板の裏面に固定された取付用構造体と、
を備えたことを特徴とする光検出ユニット。 - 前記取付用構造体は、前記支持基板の裏面に、少なくとも2つ固定されていることを特徴とする請求項1に記載の光検出ユニット。
- 前記取付用構造体は、ボルトと螺合するように形成されていることを特徴とする請求項1又は2に記載の光検出ユニット。
- 前記取付用構造体は、ボルトにより貫通され、当該貫通部位で前記ボルトと螺合するように形成されていることを特徴とする請求項1又は2に記載の光検出ユニット。
- 前記取付用構造体は、ナットと螺合するように形成されていることを特徴とする請求項1又は2に記載の光検出ユニット。
- 前記取付用構造体は、嵌合部材が嵌合するように形成されていることを特徴とする請求項1又は2に記載の光検出ユニット。
- 前記取付用構造体は、鉄・ニッケル・コバルト合金からなり、前記支持基板の裏面に形成されたタングステン領域に銀ロウ付けにより接合されていることを特徴とする請求項1〜6のいずれか一項に記載の光検出ユニット。
- 請求項1〜7のいずれか一項に記載の光検出ユニットと、
前記取付用構造体を介して前記光検出ユニットが取り付けられた取付ベースと、
を備えたことを特徴とする光検出装置。 - 前記取付ベースには、複数の前記光検出ユニットが取り付けられていることを特徴とする請求項8に記載の光検出装置。
- 被検体の断層像を生成するX線断層撮像装置であって、
前記被検体に向けてX線を発生するX線発生装置と、
前記被検体を透過したX線がシンチレータに入射することにより生じた光を検出する光検出装置と、
を備え、
前記光検出装置は、
請求項1〜7のいずれか一項に記載の光検出ユニットと、
前記取付用構造体を介して前記光検出ユニットが取り付けられた取付ベースと、
を有することを特徴とするX線断層撮像装置。 - 複数の前記光検出ユニットが、チャンネル方向及びスライス方向に2次元配列されており、
前記光検出ユニットのそれぞれにおいて、前記半導体基板が前記支持基板の表面の全面に配置されている
ことを特徴とする請求項10に記載のX線断層撮像装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005125408A JP5128052B2 (ja) | 2005-04-22 | 2005-04-22 | 光検出ユニット、光検出装置、及びx線断層撮像装置 |
CN2011100349610A CN102157528B (zh) | 2005-04-22 | 2006-04-21 | 光检测单元、光检测装置以及x射线断层摄像装置 |
PCT/JP2006/308425 WO2006115204A1 (ja) | 2005-04-22 | 2006-04-21 | 光検出ユニット、光検出装置、及びx線断層撮像装置 |
US11/918,895 US7783000B2 (en) | 2005-04-22 | 2006-04-21 | Photodetection unit, photodetector, and x-ray computed tomography apparatus |
CN200680013217XA CN101163450B (zh) | 2005-04-22 | 2006-04-21 | 光检测单元、光检测装置以及x射线断层摄像装置 |
EP06745556.8A EP1872722B1 (en) | 2005-04-22 | 2006-04-21 | Photodetection unit, photodetector, and x-ray computed tomography apparatus |
IL186840A IL186840A0 (en) | 2005-04-22 | 2007-10-22 | Photodetection unit, photodetector, and x-ray computed tomography apparatus |
US12/821,263 US8000437B2 (en) | 2005-04-22 | 2010-06-23 | Photodetection unit, photodetector, and x-ray computed tomography apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005125408A JP5128052B2 (ja) | 2005-04-22 | 2005-04-22 | 光検出ユニット、光検出装置、及びx線断層撮像装置 |
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Publication Number | Publication Date |
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JP2006296865A true JP2006296865A (ja) | 2006-11-02 |
JP5128052B2 JP5128052B2 (ja) | 2013-01-23 |
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JP2005125408A Active JP5128052B2 (ja) | 2005-04-22 | 2005-04-22 | 光検出ユニット、光検出装置、及びx線断層撮像装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7783000B2 (ja) |
EP (1) | EP1872722B1 (ja) |
JP (1) | JP5128052B2 (ja) |
CN (2) | CN102157528B (ja) |
IL (1) | IL186840A0 (ja) |
WO (1) | WO2006115204A1 (ja) |
Cited By (1)
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JP2009162572A (ja) * | 2007-12-28 | 2009-07-23 | Hitachi Ltd | 放射線撮像装置、核医学診断装置及び位置調整装置 |
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US8384559B2 (en) * | 2010-04-13 | 2013-02-26 | Silicon Laboratories Inc. | Sensor device with flexible interface and updatable information store |
US9116022B2 (en) * | 2012-12-07 | 2015-08-25 | Analog Devices, Inc. | Compact sensor module |
US10791999B2 (en) * | 2014-02-04 | 2020-10-06 | General Electric Company | Interface for gantry and component |
EP2910189B1 (en) * | 2014-02-21 | 2016-09-14 | Samsung Electronics Co., Ltd | X-ray grid structure and x-ray apparatus including the same |
US9526468B2 (en) | 2014-09-09 | 2016-12-27 | General Electric Company | Multiple frame acquisition for exposure control in X-ray medical imagers |
JP2019060819A (ja) * | 2017-09-28 | 2019-04-18 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
JP7166833B2 (ja) * | 2018-08-03 | 2022-11-08 | キヤノンメディカルシステムズ株式会社 | 放射線検出器及び放射線検出器モジュール |
KR20210101238A (ko) | 2018-12-06 | 2021-08-18 | 아나로그 디바이시즈 인코포레이티드 | 패시브 디바이스 조립체가 포함된 통합 디바이스 패키지 |
US11664340B2 (en) | 2020-07-13 | 2023-05-30 | Analog Devices, Inc. | Negative fillet for mounting an integrated device die to a carrier |
CN112054095B (zh) * | 2020-09-15 | 2021-04-13 | 北京智创芯源科技有限公司 | 红外探测器贴装装置、贴装方法、制造系统和制造方法 |
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- 2006-04-21 US US11/918,895 patent/US7783000B2/en not_active Expired - Fee Related
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Also Published As
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CN101163450B (zh) | 2011-04-06 |
US20100260314A1 (en) | 2010-10-14 |
IL186840A0 (en) | 2008-02-09 |
US20090060126A1 (en) | 2009-03-05 |
JP5128052B2 (ja) | 2013-01-23 |
EP1872722A1 (en) | 2008-01-02 |
CN102157528B (zh) | 2013-01-30 |
CN102157528A (zh) | 2011-08-17 |
WO2006115204A1 (ja) | 2006-11-02 |
EP1872722A4 (en) | 2009-12-16 |
CN101163450A (zh) | 2008-04-16 |
US7783000B2 (en) | 2010-08-24 |
US8000437B2 (en) | 2011-08-16 |
EP1872722B1 (en) | 2017-05-17 |
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