JP2006229180A - 半導体モジュールおよび半導体装置 - Google Patents

半導体モジュールおよび半導体装置 Download PDF

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Publication number
JP2006229180A
JP2006229180A JP2005189526A JP2005189526A JP2006229180A JP 2006229180 A JP2006229180 A JP 2006229180A JP 2005189526 A JP2005189526 A JP 2005189526A JP 2005189526 A JP2005189526 A JP 2005189526A JP 2006229180 A JP2006229180 A JP 2006229180A
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JP
Japan
Prior art keywords
semiconductor element
facing
cooling
semiconductor
portion facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005189526A
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English (en)
Japanese (ja)
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JP2006229180A5 (enExample
Inventor
Noribumi Furuta
紀文 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP2005189526A priority Critical patent/JP2006229180A/ja
Priority to PCT/JP2006/301271 priority patent/WO2006078070A2/en
Priority to US11/795,132 priority patent/US7687901B2/en
Priority to CN2006800030852A priority patent/CN101120446B/zh
Publication of JP2006229180A publication Critical patent/JP2006229180A/ja
Publication of JP2006229180A5 publication Critical patent/JP2006229180A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2005189526A 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置 Pending JP2006229180A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005189526A JP2006229180A (ja) 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置
PCT/JP2006/301271 WO2006078070A2 (en) 2005-01-24 2006-01-20 Semiconductor module and semiconductor device
US11/795,132 US7687901B2 (en) 2005-01-24 2006-01-20 Heat dissipating fins opposite semiconductor elements
CN2006800030852A CN101120446B (zh) 2005-01-24 2006-01-20 半导体模组及半导体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005015744 2005-01-24
JP2005189526A JP2006229180A (ja) 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置

Publications (2)

Publication Number Publication Date
JP2006229180A true JP2006229180A (ja) 2006-08-31
JP2006229180A5 JP2006229180A5 (enExample) 2008-05-01

Family

ID=36597602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005189526A Pending JP2006229180A (ja) 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置

Country Status (4)

Country Link
US (1) US7687901B2 (enExample)
JP (1) JP2006229180A (enExample)
CN (1) CN101120446B (enExample)
WO (1) WO2006078070A2 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062490A (ja) * 2008-09-08 2010-03-18 Denso Corp 半導体装置
JP2010287600A (ja) * 2009-06-09 2010-12-24 Mitsubishi Electric Corp ヒートシンク
JP2011520281A (ja) * 2008-05-07 2011-07-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光材料を含む自己支持型格子を有するｌｅｄを備えた照明装置及び自己支持型格子を作製する方法
JP2012227367A (ja) * 2011-04-20 2012-11-15 Nippon Soken Inc 冷却フィン構造
JP2013062282A (ja) * 2011-09-12 2013-04-04 Toyota Motor Corp 半導体装置
JP2013187334A (ja) * 2012-03-07 2013-09-19 Toyota Motor Corp パワーモジュール装置
CN103737160A (zh) * 2014-01-29 2014-04-23 蚌埠金威滤清器有限公司 氩弧焊环型焊缝定位冷却器
JP2014127538A (ja) * 2012-12-26 2014-07-07 Meidensha Corp 半導体モジュール
JP2020534699A (ja) * 2017-09-20 2020-11-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ ヒートシンクセグメント、ヒートシンクならびにコンポーネントを冷却する方法
JP2021034508A (ja) * 2019-08-22 2021-03-01 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
WO2022202248A1 (ja) * 2021-03-25 2022-09-29 株式会社日立製作所 電力変換装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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WO2008120358A1 (ja) * 2007-03-29 2008-10-09 Fujitsu Limited ヒートシンク
TWI413254B (zh) * 2007-05-23 2013-10-21 Fairchild Semiconductor 用於積體電路應用的低導通電阻金氧半導體電晶體
US8064198B2 (en) * 2009-06-29 2011-11-22 Honda Motor Co., Ltd. Cooling device for semiconductor element module and magnetic part
EP2328172B1 (en) * 2009-10-02 2019-06-26 Abb Research Ltd. A power-electronic arrangement
WO2011086705A1 (ja) * 2010-01-18 2011-07-21 三菱電機株式会社 パワー半導体モジュール、電力変換装置および鉄道車両
EP2485256A3 (en) * 2011-02-08 2018-01-03 ABB Research Ltd. A semiconductor device
US8804340B2 (en) * 2011-06-08 2014-08-12 International Rectifier Corporation Power semiconductor package with double-sided cooling
JP5655873B2 (ja) * 2012-05-09 2015-01-21 株式会社安川電機 インバータ装置
CN103426840B (zh) * 2012-05-18 2016-12-14 上海拜骋电器有限公司 具有续流二极管的开关装置
US9786584B2 (en) * 2012-09-04 2017-10-10 Infineon Technologies Ag Lateral element isolation device
CN104247012B (zh) * 2012-10-01 2017-08-25 富士电机株式会社 半导体装置及其制造方法
JP5726215B2 (ja) * 2013-01-11 2015-05-27 株式会社豊田中央研究所 冷却型スイッチング素子モジュール
US10378835B2 (en) * 2016-03-25 2019-08-13 Unison Industries, Llc Heat exchanger with non-orthogonal perforations
JP6588154B2 (ja) 2016-04-07 2019-10-09 日立オートモティブシステムズ株式会社 ケース、半導体装置、ケースの製造方法
US10615100B2 (en) * 2016-12-08 2020-04-07 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies and cooling structures having metalized exterior surface
TW202024553A (zh) * 2018-12-27 2020-07-01 圓剛科技股份有限公司 散熱裝置
DE102019209082B3 (de) 2019-06-24 2020-06-04 Siemens Aktiengesellschaft Befestigung von Leistungshalbleiterbauelementen auf gekrümmten Oberflächen
US11690195B2 (en) 2020-09-11 2023-06-27 Abb Schweiz Ag Power semiconductor cooling system

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JPH05259323A (ja) * 1992-03-16 1993-10-08 Mitsubishi Electric Corp 放熱用ヒートシンク
JPH08153835A (ja) * 1994-11-28 1996-06-11 Fujitsu Ltd 冷却構造
JPH08321569A (ja) * 1995-05-25 1996-12-03 Sumitomo Metal Ind Ltd ヒートシンク装置
JPH10322062A (ja) * 1997-05-21 1998-12-04 Matsushita Electric Works Ltd 放熱器
JP2001024125A (ja) * 1999-07-09 2001-01-26 Fuji Electric Co Ltd 平形半導体素子
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置
JP2003282799A (ja) * 2002-03-22 2003-10-03 Mitsubishi Electric Corp 半導体モジュール用ケース
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置

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JPH07189684A (ja) 1993-12-28 1995-07-28 Hitachi Constr Mach Co Ltd 熱交換装置
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EP1742265B1 (en) 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
JP2002026251A (ja) 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
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Publication number Priority date Publication date Assignee Title
JPH05259323A (ja) * 1992-03-16 1993-10-08 Mitsubishi Electric Corp 放熱用ヒートシンク
JPH08153835A (ja) * 1994-11-28 1996-06-11 Fujitsu Ltd 冷却構造
JPH08321569A (ja) * 1995-05-25 1996-12-03 Sumitomo Metal Ind Ltd ヒートシンク装置
JPH10322062A (ja) * 1997-05-21 1998-12-04 Matsushita Electric Works Ltd 放熱器
JP2001024125A (ja) * 1999-07-09 2001-01-26 Fuji Electric Co Ltd 平形半導体素子
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置
JP2003282799A (ja) * 2002-03-22 2003-10-03 Mitsubishi Electric Corp 半導体モジュール用ケース
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011520281A (ja) * 2008-05-07 2011-07-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光材料を含む自己支持型格子を有するｌｅｄを備えた照明装置及び自己支持型格子を作製する方法
JP2010062490A (ja) * 2008-09-08 2010-03-18 Denso Corp 半導体装置
JP2010287600A (ja) * 2009-06-09 2010-12-24 Mitsubishi Electric Corp ヒートシンク
US9523541B2 (en) 2011-04-20 2016-12-20 Toyota Jidosha Kabushiki Kaisha Cooling fin structure
JP2012227367A (ja) * 2011-04-20 2012-11-15 Nippon Soken Inc 冷却フィン構造
JP2013062282A (ja) * 2011-09-12 2013-04-04 Toyota Motor Corp 半導体装置
JP2013187334A (ja) * 2012-03-07 2013-09-19 Toyota Motor Corp パワーモジュール装置
JP2014127538A (ja) * 2012-12-26 2014-07-07 Meidensha Corp 半導体モジュール
CN103737160A (zh) * 2014-01-29 2014-04-23 蚌埠金威滤清器有限公司 氩弧焊环型焊缝定位冷却器
JP2020534699A (ja) * 2017-09-20 2020-11-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ ヒートシンクセグメント、ヒートシンクならびにコンポーネントを冷却する方法
JP2021034508A (ja) * 2019-08-22 2021-03-01 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
JP7254661B2 (ja) 2019-08-22 2023-04-10 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
WO2022202248A1 (ja) * 2021-03-25 2022-09-29 株式会社日立製作所 電力変換装置
JP2022149879A (ja) * 2021-03-25 2022-10-07 株式会社日立製作所 電力変換装置
JP7558866B2 (ja) 2021-03-25 2024-10-01 株式会社日立製作所 電力変換装置

Also Published As

Publication number Publication date
US20080093730A1 (en) 2008-04-24
WO2006078070A3 (en) 2006-10-19
CN101120446A (zh) 2008-02-06
CN101120446B (zh) 2010-05-19
WO2006078070A2 (en) 2006-07-27
US7687901B2 (en) 2010-03-30

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