JP2004096135A5 - - Google Patents

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Publication number
JP2004096135A5
JP2004096135A5 JP2003427683A JP2003427683A JP2004096135A5 JP 2004096135 A5 JP2004096135 A5 JP 2004096135A5 JP 2003427683 A JP2003427683 A JP 2003427683A JP 2003427683 A JP2003427683 A JP 2003427683A JP 2004096135 A5 JP2004096135 A5 JP 2004096135A5
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JP
Japan
Prior art keywords
metal
electrode
power module
power element
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003427683A
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English (en)
Japanese (ja)
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JP2004096135A (ja
JP4120581B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2003427683A priority Critical patent/JP4120581B2/ja
Priority claimed from JP2003427683A external-priority patent/JP4120581B2/ja
Publication of JP2004096135A publication Critical patent/JP2004096135A/ja
Publication of JP2004096135A5 publication Critical patent/JP2004096135A5/ja
Application granted granted Critical
Publication of JP4120581B2 publication Critical patent/JP4120581B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003427683A 2003-12-24 2003-12-24 パワーモジュール Expired - Fee Related JP4120581B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003427683A JP4120581B2 (ja) 2003-12-24 2003-12-24 パワーモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003427683A JP4120581B2 (ja) 2003-12-24 2003-12-24 パワーモジュール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP24008398A Division JP3525753B2 (ja) 1998-08-26 1998-08-26 パワーモジュール

Publications (3)

Publication Number Publication Date
JP2004096135A JP2004096135A (ja) 2004-03-25
JP2004096135A5 true JP2004096135A5 (enExample) 2005-05-26
JP4120581B2 JP4120581B2 (ja) 2008-07-16

Family

ID=32064828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003427683A Expired - Fee Related JP4120581B2 (ja) 2003-12-24 2003-12-24 パワーモジュール

Country Status (1)

Country Link
JP (1) JP4120581B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7619302B2 (en) * 2006-05-23 2009-11-17 International Rectifier Corporation Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
JP5103863B2 (ja) 2006-10-16 2012-12-19 富士電機株式会社 半導体装置
JP2015119072A (ja) 2013-12-19 2015-06-25 富士電機株式会社 レーザ溶接方法、レーザ溶接治具、半導体装置
WO2017017901A1 (ja) * 2015-07-29 2017-02-02 パナソニックＩｐマネジメント株式会社 半導体装置
KR101703724B1 (ko) * 2015-12-09 2017-02-07 현대오트론 주식회사 파워 모듈 패키지
US10319704B2 (en) * 2016-01-31 2019-06-11 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
DE102022207522A1 (de) * 2022-07-22 2024-01-25 Zf Friedrichshafen Ag Leistungsmodul

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118514B2 (ja) * 1989-04-24 1995-12-18 株式会社東芝 半田バンプ型半導体装置
DE4103486A1 (de) * 1991-02-06 1992-08-20 Abb Patent Gmbh Anordnung zur kuehlung waermeerzeugender bauelemente
JP3216305B2 (ja) * 1993-03-11 2001-10-09 株式会社日立製作所 半導体装置
JPH07273276A (ja) * 1994-03-28 1995-10-20 Nissan Motor Co Ltd パワー素子とスナバ素子の接続構造及びその実装構造
JP3433279B2 (ja) * 1995-11-09 2003-08-04 株式会社日立製作所 半導体装置
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
WO1998012748A1 (en) * 1996-09-18 1998-03-26 Hitachi, Ltd. Junction semiconductor module

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