JP2017195687A - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
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- JP2017195687A JP2017195687A JP2016083936A JP2016083936A JP2017195687A JP 2017195687 A JP2017195687 A JP 2017195687A JP 2016083936 A JP2016083936 A JP 2016083936A JP 2016083936 A JP2016083936 A JP 2016083936A JP 2017195687 A JP2017195687 A JP 2017195687A
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- 229910002601 GaN Inorganic materials 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
Description
電力変換を行う電力変換装置(1,2)であって、
互いに並列接続されたIGBT(14)及びMOSFET(15)が同一のリードフレーム(16,17)に設けられた半導体モジュール(11,111)と、
上記半導体モジュールの上記リードフレームに対向して延びる冷媒流路(24)を有する冷却器(20)と、
を備え、
上記半導体モジュールは、上記冷却器の上記冷媒流路における冷媒の流れに対して上記MOSFETが上記IGBTよりも下流側に配置されないように構成されている、電力変換装置(1,2)にある。
なお、特許請求の範囲及び課題を解決する手段に記載した括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示すものであり、本発明の技術的範囲を限定するものではない。
図1及び図2に示されるように、実施形態1の電力変換装置1は、半導体積層ユニット10及び制御回路基板30を含む複数の要素を備えている。これら複数の要素はケース1aによって区画された空間に収容されている。ケース1aは、軽量且つ高度な寸法精度が要求される自動車部品であり、アルミニウムを使用したアルミダイカスト製法によって作製されている。
また、MOSFET15の導通損失の増大を抑えることによって、MOSFET15の素子サイズを小さくできる。
また、冷却器20が冷媒流路24における冷媒の流れ方向と交差する方向に延在する放熱フィン25を備えるため、半導体モジュール11の冷却効果を更に高めることができる。この場合、半導体モジュール11において冷却管23の下流側に配置されたIGBT14を冷却するための冷媒の温度上昇が抑えられる。その結果、IGBT14の素子サイズを小さくできる。
実施形態2の電力変換装置2は、実施形態1の電力変換装置1に対して、IGBT14及びMOSFET15からなる半導体素子対の数が異なる。即ち、電力変換装置2の半導体モジュール111は、IGBT14及びMOSFET15からなる半導体素子対を2つ備えている。この半導体モジュール111は、IGBT14及びMOSFET15が互いに並列接続された2つの半導体素子対を備えており、これら2つの半導体素子対が電源Bの高電位側ラインLpと低電位側ラインLnとの間に直列に接続されている。この半導体モジュール111は、「2in1モジュール」と称呼される。この半導体モジュール111は、図7中の1つ上アームモジュール11Hと1つの下アームモジュール11Lとを組み合わせた構成を有する。
なお、必要に応じて、3つ以上の半導体素子対を備えた半導体モジュールを採用することもできる。
その他の構成は、実施形態1と同様である。
その他、実施形態1と同様の作用効果を奏する。
11,111 半導体モジュール
11a 外表面
14 IGBT
15 MOSFET
16,17 リードフレーム
20 冷却器
24 冷媒流路
25,26 放熱フィン
F,Fa,Fb,Fc,Fd 冷媒の流れ
Claims (5)
- 電力変換を行う電力変換装置であって、
互いに並列接続されたIGBT及びMOSFETが同一のリードフレームに設けられた半導体モジュールと、
上記半導体モジュールの上記リードフレームに対向して延びる冷媒流路を有する冷却器と、
を備え、
上記半導体モジュールは、上記冷却器の上記冷媒流路における冷媒の流れに対して上記MOSFETが上記IGBTよりも下流側に配置されないように構成されている、電力変換装置。 - 上記半導体モジュールは、上記冷却器の上記冷媒流路における冷媒の流れに対して上記MOSFETが上記IGBTよりも上流側に配置されるように構成されている、請求項1に記載の電力変換装置。
- 上記冷却器は、上記冷媒流路における冷媒の流れ方向と交差する方向に延在する放熱フィンを備える、請求項1または2に記載の電力変換装置。
- 上記半導体モジュールは、互いに平行に延在する2つの外表面を有し、上記冷却器は、上記冷媒流路を形成する冷却管を備え、上記冷却管が上記半導体モジュールの上記2つの外表面のそれぞれに当接するように設けられている、請求項1〜3のうちのいずれか一項に記載の電力変換装置。
- 上記MOSFETは、ワイドギャップ半導体素子である、請求項1〜4のうちのいずれか一項に記載の電力変換装置。
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