JP2006216944A5 - - Google Patents

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Publication number
JP2006216944A5
JP2006216944A5 JP2006016582A JP2006016582A JP2006216944A5 JP 2006216944 A5 JP2006216944 A5 JP 2006216944A5 JP 2006016582 A JP2006016582 A JP 2006016582A JP 2006016582 A JP2006016582 A JP 2006016582A JP 2006216944 A5 JP2006216944 A5 JP 2006216944A5
Authority
JP
Japan
Prior art keywords
assembly
circuit board
series
grid array
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006016582A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006216944A (ja
Filing date
Publication date
Priority claimed from US11/049,474 external-priority patent/US7170165B2/en
Application filed filed Critical
Publication of JP2006216944A publication Critical patent/JP2006216944A/ja
Publication of JP2006216944A5 publication Critical patent/JP2006216944A5/ja
Pending legal-status Critical Current

Links

JP2006016582A 2005-02-02 2006-01-25 ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ Pending JP2006216944A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/049,474 US7170165B2 (en) 2005-02-02 2005-02-02 Circuit board assembly with a brace surrounding a ball-grid array device

Publications (2)

Publication Number Publication Date
JP2006216944A JP2006216944A (ja) 2006-08-17
JP2006216944A5 true JP2006216944A5 (enExample) 2009-02-26

Family

ID=36756308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006016582A Pending JP2006216944A (ja) 2005-02-02 2006-01-25 ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ

Country Status (3)

Country Link
US (1) US7170165B2 (enExample)
JP (1) JP2006216944A (enExample)
CN (1) CN1816248A (enExample)

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US20090080126A1 (en) * 2007-09-25 2009-03-26 Ise Corporation Energy Storage Device Coupler and Method
US7432591B1 (en) 2008-02-28 2008-10-07 International Business Machines Corporation Thermal enhanced plastic ball grid array with heat sink attachment option
JP5185048B2 (ja) * 2008-09-29 2013-04-17 株式会社東芝 電子機器、および半導体パッケージ
CN201312048Y (zh) * 2008-10-28 2009-09-16 番禺得意精密电子工业有限公司 插座连接器
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JP2015038897A (ja) 2009-03-30 2015-02-26 株式会社東芝 電子機器
EP2251903B1 (en) * 2009-05-14 2017-03-29 Thompson Licensing Heat sink mounting method
JP4801758B2 (ja) * 2009-06-02 2011-10-26 富士通株式会社 電子機器および補強部品
CN102845143B (zh) * 2009-08-18 2015-05-20 惠普发展公司，有限责任合伙企业 装置安装系统和方法
JP2011082345A (ja) * 2009-10-07 2011-04-21 Panasonic Corp 半導体装置
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JP5017473B1 (ja) 2011-03-16 2012-09-05 株式会社東芝 テレビジョン受像機および電子機器
JP5132801B1 (ja) * 2011-07-14 2013-01-30 株式会社東芝 テレビジョン受像機、及び電子機器
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US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
CN104216477A (zh) * 2013-05-29 2014-12-17 英业达科技有限公司 固定组件
US9338885B2 (en) 2014-07-07 2016-05-10 International Business Machines Corporation Ball grid array rework
US11382223B2 (en) * 2015-06-30 2022-07-05 Lear Corporation Spring and damper system and method for producing same
US11026356B2 (en) 2016-07-15 2021-06-01 Hewlett-Packard Development Company, L.P. Electrical device and shielding method
US20180082868A1 (en) * 2016-09-20 2018-03-22 Alcatel-Lucent Canada Inc. Gravity force compensation plate for upside down ball grid array
CN107613715A (zh) * 2017-10-20 2018-01-19 上海兴源东安电气设备制造有限公司 一种机柜或开关柜的框架
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
DE102019009344B4 (de) * 2018-12-26 2025-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Integriertes schaltungs-package und verfahren
DE102019121149A1 (de) 2018-12-26 2020-07-02 Taiwan Semiconductor Manufacturing Co., Ltd. Integriertes schaltungs-package und verfahren
US11538735B2 (en) 2018-12-26 2022-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming integrated circuit packages with mechanical braces
US11183487B2 (en) 2018-12-26 2021-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
US10764990B1 (en) * 2019-04-23 2020-09-01 Adlink Technology Inc. Heat-dissipating module having an elastic mounting structure
CN110662354B (zh) * 2019-09-16 2024-11-08 苏州华智诚精工科技有限公司 Pcb板正反加工定位载具
US11337338B2 (en) 2020-03-17 2022-05-17 Hamilton Sundstrand Corporation Conductive thermal management architecture employing a stiffener of a printed wiring board assembly
CN112954973A (zh) * 2021-02-09 2021-06-11 陆兵 一种多点热颤动式高散热性电源
US11910566B1 (en) * 2021-03-18 2024-02-20 Amazon Technologies, Inc. Processor heat exchanger with separate mounting structure
US12069794B2 (en) * 2022-07-06 2024-08-20 Cisco Technology, Inc. Dynamic control of heat sink pressure
US12207446B2 (en) * 2022-08-02 2025-01-21 International Business Machines Corporation Adjustable retention device for heat sink assembly
US12471221B2 (en) * 2022-10-21 2025-11-11 Raytheon Company Clamping device with pivoting retainer

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US7119433B2 (en) * 2004-06-16 2006-10-10 International Business Machines Corporation Packaging for enhanced thermal and structural performance of electronic chip modules

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