JP2009054969A5 - - Google Patents

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Publication number
JP2009054969A5
JP2009054969A5 JP2007222917A JP2007222917A JP2009054969A5 JP 2009054969 A5 JP2009054969 A5 JP 2009054969A5 JP 2007222917 A JP2007222917 A JP 2007222917A JP 2007222917 A JP2007222917 A JP 2007222917A JP 2009054969 A5 JP2009054969 A5 JP 2009054969A5
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JP
Japan
Prior art keywords
wiring board
resist
terminal
forming
support
Prior art date
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Application number
JP2007222917A
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English (en)
Japanese (ja)
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JP2009054969A (ja
JP5043563B2 (ja
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Priority to JP2007222917A priority Critical patent/JP5043563B2/ja
Priority claimed from JP2007222917A external-priority patent/JP5043563B2/ja
Publication of JP2009054969A publication Critical patent/JP2009054969A/ja
Publication of JP2009054969A5 publication Critical patent/JP2009054969A5/ja
Application granted granted Critical
Publication of JP5043563B2 publication Critical patent/JP5043563B2/ja
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JP2007222917A 2007-08-29 2007-08-29 配線基板及びその製造方法 Active JP5043563B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007222917A JP5043563B2 (ja) 2007-08-29 2007-08-29 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007222917A JP5043563B2 (ja) 2007-08-29 2007-08-29 配線基板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012155863A Division JP5399539B2 (ja) 2012-07-11 2012-07-11 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009054969A JP2009054969A (ja) 2009-03-12
JP2009054969A5 true JP2009054969A5 (enExample) 2010-07-29
JP5043563B2 JP5043563B2 (ja) 2012-10-10

Family

ID=40505745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007222917A Active JP5043563B2 (ja) 2007-08-29 2007-08-29 配線基板及びその製造方法

Country Status (1)

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JP (1) JP5043563B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5342422B2 (ja) * 2009-12-10 2013-11-13 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN102378484B (zh) * 2010-08-13 2017-02-08 雅达电子有限公司 提高焊点可靠性方法、印刷电路板、封装器件及封装模块
CN105357900A (zh) * 2015-12-03 2016-02-24 北京浩瀚深度信息技术股份有限公司 消除异形smd元器件回流焊接位移的pad设计方法
KR102519736B1 (ko) * 2018-01-17 2023-04-11 주식회사 루멘스 Led 디스플레이 모듈
US20210035898A1 (en) * 2019-07-30 2021-02-04 Powertech Technology Inc. Package structure and manufacturing method thereof
CN111863759B (zh) 2020-03-26 2025-08-19 北京小米移动软件有限公司 芯片、电路板、电路板组件及电子设备
CN113921491A (zh) * 2020-07-08 2022-01-11 北京小米移动软件有限公司 芯片、电路板及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846079A (ja) * 1994-07-28 1996-02-16 Matsushita Electric Ind Co Ltd 半導体装置
JPH11204570A (ja) * 1998-01-08 1999-07-30 Sumitomo Metal Smi Electron Devices Inc 外部入出力端子
JP4366777B2 (ja) * 1999-09-01 2009-11-18 パナソニック株式会社 電子部品
JP2004200187A (ja) * 2002-12-16 2004-07-15 Nikon Corp プリント配線板
JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法
JP2005244149A (ja) * 2004-01-26 2005-09-08 Kyocera Corp 配線基板

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