JP2009188375A5 - - Google Patents
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- Publication number
- JP2009188375A5 JP2009188375A5 JP2008252605A JP2008252605A JP2009188375A5 JP 2009188375 A5 JP2009188375 A5 JP 2009188375A5 JP 2008252605 A JP2008252605 A JP 2008252605A JP 2008252605 A JP2008252605 A JP 2008252605A JP 2009188375 A5 JP2009188375 A5 JP 2009188375A5
- Authority
- JP
- Japan
- Prior art keywords
- package body
- bump
- bumps
- body according
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008252605A JP5277843B2 (ja) | 2008-01-07 | 2008-09-30 | パッケージ本体及び電子デバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008000368 | 2008-01-07 | ||
| JP2008000368 | 2008-01-07 | ||
| JP2008252605A JP5277843B2 (ja) | 2008-01-07 | 2008-09-30 | パッケージ本体及び電子デバイス |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012276590A Division JP2013062876A (ja) | 2008-01-07 | 2012-12-19 | パッケージ本体及び電子デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009188375A JP2009188375A (ja) | 2009-08-20 |
| JP2009188375A5 true JP2009188375A5 (enExample) | 2011-11-17 |
| JP5277843B2 JP5277843B2 (ja) | 2013-08-28 |
Family
ID=41071284
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008252605A Expired - Fee Related JP5277843B2 (ja) | 2008-01-07 | 2008-09-30 | パッケージ本体及び電子デバイス |
| JP2012276590A Withdrawn JP2013062876A (ja) | 2008-01-07 | 2012-12-19 | パッケージ本体及び電子デバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012276590A Withdrawn JP2013062876A (ja) | 2008-01-07 | 2012-12-19 | パッケージ本体及び電子デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP5277843B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5277843B2 (ja) * | 2008-01-07 | 2013-08-28 | セイコーエプソン株式会社 | パッケージ本体及び電子デバイス |
| CN102696173B (zh) | 2010-04-01 | 2016-03-16 | 株式会社大真空 | 表面安装型的电子部件用封装的基底、以及表面安装型的电子部件用封装 |
| US9795034B2 (en) | 2012-05-30 | 2017-10-17 | Kyocera Corporation | Wiring board and electronic device |
| JP6747101B2 (ja) * | 2016-06-29 | 2020-08-26 | 日本電気硝子株式会社 | 気密パッケージ及びその製造方法 |
| WO2025249054A1 (ja) * | 2024-05-31 | 2025-12-04 | 株式会社大真空 | 圧電振動デバイス |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3685683B2 (ja) * | 2000-04-19 | 2005-08-24 | 日本電波工業株式会社 | 表面実装用の水晶発振器 |
| JP3864417B2 (ja) * | 2003-09-29 | 2006-12-27 | 株式会社大真空 | 電子部品用パッケージ |
| JP2009141455A (ja) * | 2007-12-04 | 2009-06-25 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶デバイス |
| JP5277843B2 (ja) * | 2008-01-07 | 2013-08-28 | セイコーエプソン株式会社 | パッケージ本体及び電子デバイス |
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2008
- 2008-09-30 JP JP2008252605A patent/JP5277843B2/ja not_active Expired - Fee Related
-
2012
- 2012-12-19 JP JP2012276590A patent/JP2013062876A/ja not_active Withdrawn