JP2006216944A - ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ - Google Patents
ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ Download PDFInfo
- Publication number
- JP2006216944A JP2006216944A JP2006016582A JP2006016582A JP2006216944A JP 2006216944 A JP2006216944 A JP 2006216944A JP 2006016582 A JP2006016582 A JP 2006016582A JP 2006016582 A JP2006016582 A JP 2006016582A JP 2006216944 A JP2006216944 A JP 2006216944A
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- Prior art keywords
- pcb
- assembly
- grid array
- ball grid
- reinforcing material
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】回路基板320の第一の面にはボールグリッドアレイ・デバイス322が取り付けられ、ボールグリッドアレイ・デバイスを取り囲むように補強材310が回路基板320に固定される。補強材には、脚部332、334、336、338が形成されていて、各脚部の間に延在し、基板補強のための強度を担う補強材の構成要素が、基板上のボールグリッドアレイ・デバイス搭載面に対して離間するように設けられている。構成要素が離間していることにより、基板および補強材に対して作用する曲げモーメントに対する剛性が増し、ボールグリッドアレイ・デバイスと基板との接合部に生じるストレスが減じられて信頼性が高められる。また、上記構成要素の下部の位置に電子部品を実装することも可能で、基板上の実装面積を増すことが可能となる。
【選択図】 図3A
Description
110、112、114、116 コーナー部分
126、226 開口
202、204、206、208 取り付け穴
218、220、222、224 高架部分(構成要素)
320、702、802 回路基板
322、402、610、704、804 ボールグリッドアレイ・デバイス
352’ 第二の補強材
414、514、516 中間構成要素
616 補強材内側端部
630、632 側辺取り付け穴
634 側辺取り付け穴を設けた構成要素
724、824 ヒートシンク
708、710、712、714 ねじ
716、718、720、722、814、816、818 ばね
Claims (10)
- 回路基板と、
前記回路基板の第一の面に取り付けられたボールグリッドアレイ・デバイスと、
前記ボールグリッドアレイ・デバイスを取り囲むように設けられる補強材とを具備し、
前記補強材が、一連の取り付け穴と、前記取り付け穴の間に延在する一連の構成要素とを含み、前記補強材が前記取り付け穴において前記回路基板の前記第一の面へ取り外し可能な状態で固定される
ことを特徴とするアセンブリ。 - 前記構成要素のうちの少なくとも1つが、前記回路基板の上方約1.4mm以上の選択された高さに配置されることを特徴とする請求項1に記載のアセンブリ。
- 前記補強材は、コイニング加工されたシートメタルであって、前記コイニング加工されたシートメタルのコーナー部分を貫通して存在する取り付け穴を有するものであることを特徴とする請求項1に記載のアセンブリ。
- 前記ボールグリッドアレイ・デバイスは、前記補強材の内側端部から、約1mm〜約9mm離れる位置に設置されるように構成されることを特徴とする請求項1に記載のアセンブリ。
- 前記補強材により囲まれる第二のボールグリッドアレイ・デバイスを更に具備することを特徴とする請求項1に記載のアセンブリ。
- 前記補強材は、荷重が印加された場合に前記回路基板が最も大きい曲率を生じうる軸に対して直交する方向に沿って延在する構成要素中に形成される側辺取り付け穴を更に含むことを特徴とする請求項1に記載のアセンブリ。
- 前記回路基板の第二の面へ取り外し可能な状態で固定される第二の補強材を更に具備し、前記第二の補強材が前記補強材と対をなすように構成されることを特徴とする請求項1に記載のアセンブリ。
- 前記構成要素によって開口が画定され、
前記開口の部分に配置され、前記ボールグリッドアレイ・デバイスと熱的に結合されるヒートシンクを更に具備する
ことを特徴とする請求項1に記載のアセンブリ。 - 前記コーナー取り付け穴の各々を貫通して伸びる複数のねじと、前記ヒートシンクを前記ボールグリッドアレイ・デバイスに対して押し付けるように配置された複数のばねとを更に具備することを特徴とする請求項8に記載のアセンブリ。
- 前記補強材の一部である中間構成要素と、
前記回路基板の第一の面に取り付けられ、前記補強材に囲まれるように設置される第二のボールグリッドアレイ・デバイスとを更に具備し、
前記ボールグリッドアレイ・デバイスが、前記第二のボールグリッドアレイ・デバイスに対して前記中間構成要素で分離されるように構成される
ことを特徴とする請求項1に記載のアセンブリ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/049,474 US7170165B2 (en) | 2005-02-02 | 2005-02-02 | Circuit board assembly with a brace surrounding a ball-grid array device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006216944A true JP2006216944A (ja) | 2006-08-17 |
JP2006216944A5 JP2006216944A5 (ja) | 2009-02-26 |
Family
ID=36756308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006016582A Pending JP2006216944A (ja) | 2005-02-02 | 2006-01-25 | ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ |
Country Status (3)
Country | Link |
---|---|
US (1) | US7170165B2 (ja) |
JP (1) | JP2006216944A (ja) |
CN (1) | CN1816248A (ja) |
Cited By (10)
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JP2010086976A (ja) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | 電子機器、および半導体パッケージ |
JP2010093310A (ja) * | 2010-01-29 | 2010-04-22 | Toshiba Corp | 電子機器 |
JP2010177513A (ja) * | 2009-01-30 | 2010-08-12 | Toshiba Corp | 電子機器 |
JP2010283017A (ja) * | 2009-06-02 | 2010-12-16 | Fujitsu Ltd | 電子機器および補強部品 |
JP2012028810A (ja) * | 2011-10-07 | 2012-02-09 | Toshiba Corp | 電子機器 |
US8243450B2 (en) | 2010-04-09 | 2012-08-14 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US8254129B2 (en) | 2009-03-30 | 2012-08-28 | Kabushiki Kaisha Toshiba | Electronic apparatus |
JP5017473B1 (ja) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | テレビジョン受像機および電子機器 |
JP2013026633A (ja) * | 2011-07-14 | 2013-02-04 | Toshiba Corp | テレビジョン受像機、及び電子機器 |
KR20200081217A (ko) * | 2018-12-26 | 2020-07-07 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 집적 회로 패키지 및 방법 |
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US8957531B2 (en) | 2011-10-20 | 2015-02-17 | International Business Machines Corporation | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
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2006
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US20060171129A1 (en) | 2006-08-03 |
US7170165B2 (en) | 2007-01-30 |
CN1816248A (zh) | 2006-08-09 |
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