JP2005026683A - 回路パッケージの支持方法および電子部品システム - Google Patents
回路パッケージの支持方法および電子部品システム Download PDFInfo
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- JP2005026683A JP2005026683A JP2004189348A JP2004189348A JP2005026683A JP 2005026683 A JP2005026683 A JP 2005026683A JP 2004189348 A JP2004189348 A JP 2004189348A JP 2004189348 A JP2004189348 A JP 2004189348A JP 2005026683 A JP2005026683 A JP 2005026683A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】本発明の方法には、回路パッケージ(14)に、その基板(15)の縁(17)よりも外側に延在する蓋(16)を提供する段階と、回路パッケージのはんだカラム・アレイ(30)によって、回路パッケージをプリント回路基板(12)に電気的に接続する段階と、蓋と前記支持体(40)の間に隙間を残した状態で、前記回路パッケージの前記蓋の下の位置において、プリント回路基板に複数の支持体を固定する段階と、プリント回路基板に対して回路パッケージに静的圧縮力(F)を加えて維持し、隙間が閉じて圧縮力の大部分を支持体が負うまではんだカラム・アレイをクリープさせる段階とが含まれる。
【選択図】図1
Description
14 回路パッケージ
15 基板
16 (はみ出し)蓋
17 (基板の)縁
30 はんだカラム・アレイ
40,70 支持体
42,72 翼部分
44 本体
52 留め具
74 角部
80 バンド
104 移動止め
110 穴
Claims (10)
- プリント回路基板上に、はんだカラム・アレイを有する基板を備える回路パッケージを支持する方法であって、
前記回路パッケージに、前記基板の縁よりも外側まで延在するはみ出し蓋を提供する段階と、
前記はんだカラム・アレイによって、前記回路パッケージを前記プリント回路基板に電気的に接続する段階と、
前記はみ出し蓋と前記支持体の間に隙間を残した状態で、前記回路パッケージの前記はみ出し蓋の下の位置において、前記プリント回路基板に複数の支持体を固定する段階と、
前記プリント回路基板に対して前記回路パッケージに静的圧縮力を加えて維持し、それにより、前記隙間が閉じ、前記圧縮力の大部分を前記支持体が負うまで、前記はんだカラム・アレイをクリープさせる段階とを有する回路パッケージの支持方法。 - 前記複数の支持体を固定する段階が、前記支持体の少なくとも1つを、前記はみ出し蓋の下の前記回路パッケージの各角部に接着材なしで固定する段階を有することを特徴とする請求項1に記載の回路パッケージの支持方法。
- 前記複数の支持体を固定する段階が、前記支持体が前記回路パッケージの前記はみ出し蓋の下の位置にある状態で前記プリント回路基板と前記支持体に留め具を通す段階を有することを特徴とする請求項1に記載の回路パッケージの支持方法。
- 前記複数の支持体を固定する段階が、すべての前記支持体のまわりに単一のバンドを配置して、前記支持体が、前記回路パッケージの前記はみ出し蓋の下の位置から水平方向に動くのを防ぐ段階を有することを特徴とする請求項1に記載の回路パッケージの支持方法。
- 前記複数の支持体を固定する段階が、各支持体に、角部と、前記角部から互いにほぼ直交して外方に延在する1対の翼部分とを提供する段階を有することを特徴とする請求項4に記載の回路パッケージの支持方法。
- 前記複数の支持体を固定する段階が、各支持体に移動止めを設け、各支持体の前記移動止めを、前記回路パッケージの角部の近くに位置決めされた前記プリント回路基板の対応する穴に差し込む段階を有することを特徴とする請求項1に記載の回路パッケージの支持方法。
- 前記複数の支持体を固定する段階が、
各支持体に、本体と、前記本体から外方に延在し、互いにほぼ直交する1対の翼部分とを設ける段階と、
前記支持体の前記本体を通して前記プリント回路基板に留め具を固定し、前記回路パッケージの前記はみ出し蓋の下に、前記回路パッケージの前記縁と接触した状態で、前記支持体のそれぞれの前記翼部分を延在させる段階とを有することを特徴とする請求項1に記載の回路パッケージの支持方法。 - 前記複数の支持体を固定する段階が、
プラスチック材料、金属材料および複合材料のうちの少なくとも1つから材料で各支持体を作成する段階を有し、前記材料が、前記基板および前記はんだカラム・アレイの熱膨張率と実質的に同じ熱膨張率を有することを特徴とする請求項1に記載の回路パッケージの支持方法。 - 前記クリープさせる段階が、
前記支持体を前記はみ出し蓋の下に位置決めしている間、前記静的圧縮力の印加を保留する段階と、
前記支持体が前記はみ出し蓋の下の適所に固定された後で、前記静的圧縮力の印加を可能にする段階とを有することを特徴とする請求項1に記載の回路パッケージの支持方法。 - 前記回路基板、前記はんだカラム・アレイを有する前記回路パッケージ、および前記複数の支持体を備える請求項1〜請求項9のいずれか一項に記載の回路パッケージの支持方法を実施するための電子部品システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/612,663 US7372147B2 (en) | 2003-07-02 | 2003-07-02 | Supporting a circuit package including a substrate having a solder column array |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005026683A true JP2005026683A (ja) | 2005-01-27 |
Family
ID=32851213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004189348A Withdrawn JP2005026683A (ja) | 2003-07-02 | 2004-06-28 | 回路パッケージの支持方法および電子部品システム |
Country Status (3)
Country | Link |
---|---|
US (1) | US7372147B2 (ja) |
JP (1) | JP2005026683A (ja) |
GB (1) | GB2404085B (ja) |
Cited By (1)
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WO2008139563A1 (ja) * | 2007-05-07 | 2008-11-20 | Fujitsu Limited | 電子装置及びその製造方法、当該電子装置を有する電子機器 |
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2003
- 2003-07-02 US US10/612,663 patent/US7372147B2/en not_active Expired - Lifetime
-
2004
- 2004-06-28 JP JP2004189348A patent/JP2005026683A/ja not_active Withdrawn
- 2004-06-29 GB GB0414544A patent/GB2404085B/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008139563A1 (ja) * | 2007-05-07 | 2008-11-20 | Fujitsu Limited | 電子装置及びその製造方法、当該電子装置を有する電子機器 |
Also Published As
Publication number | Publication date |
---|---|
US20050001310A1 (en) | 2005-01-06 |
GB0414544D0 (en) | 2004-08-04 |
GB2404085B (en) | 2006-09-20 |
US7372147B2 (en) | 2008-05-13 |
GB2404085A (en) | 2005-01-19 |
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