US20080149321A1

US20080149321A1 - Thermal module mounted on carrier by using magnetic force

Info

Publication number: US20080149321A1
Application number: US11/853,030
Authority: US
Inventors: Chi-Wei Tien; Chang-Yuan Wu; Chang-Chiang Shih; Li-Kan Yeh; I-Feng Hsu
Original assignee: Compal Electronics Inc
Current assignee: Compal Electronics Inc
Priority date: 2006-12-20
Filing date: 2007-09-11
Publication date: 2008-06-26
Also published as: TWI311899B; TW200829127A

Abstract

A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan application serial no. 95147916, filed Dec. 20, 2006. All disclosure of the Taiwan application is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a thermal module, and more particularly, to a thermal module which is mounted on a carrier by using magnetic force.
2. Description of Related Art
With rapid advance of computer technology in recent years, computers are being made to operate at higher frequency, and the heat generation of electronic components inside the computer host are becoming greater and greater. To avoid temporary or permanent failure of the electronic components inside the computer host due to overheat thereof, the heat generated by the electronic components must be sufficiently dissipated. Therefore, thermal modules are necessarily attached to those electronic components having high heat generation such as CPUs, Graphics Chips, Northbridge Chips, Southbridge Chips, and random-access memory modules, or the like, for cooling these electronic components. Therefore, assembly of the thermal modules is critically important, so that the thermal modules can be truly in contact with the heat generating components to achieve a good heat dissipation result.
FIG. 1 is a cross-sectional view of a conventional thermal module mounted on a carrier. Referring to FIG. 1, the conventional thermal module 100 includes a thermal conductor 110, a bracket 120, and a plurality of mounting members 130. The thermal conductor 110 is positioned on a first side 50 a of a carrier 50, and includes a plurality of receiving portions 112, a bottom plate 114, and a heat pipe 116. The bottom plate 114 is in contact with a heat generating component 60 on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 114 to the heat pipe 116 and is then dissipated out. Besides, the receiving portions 112 are arranged at a peripheral portion of the thermal conductor 110. Each receiving portion 112 has an opening 112 a defined in a top thereof, and a through hole 112 b in a bottom thereof.
The bracket 120 is positioned on a second side 50 b of the carrier 50 opposite to the first side 50 a, and is positioned corresponding to the thermal conductor 110. Besides, the bracket 120 includes a plurality of metal posts 122 arranged at a peripheral portion thereof. The metal posts 122 extend through a plurality of through holes 54 of the carrier 50, and are aligned with the through holes 112 b of the receiving portions 112, respectively. In addition, each metal post 122 has a screw hole 122 a defined therein. The mounting members 130 are respectively disposed in the receiving portions 112, and each of the mounting members 130 includes a screw 132 and a spring 134.
When the mounting members 130 are respectively disposed in the receiving portions 112, shank portions 132 b of the screws 132 extend through the through holes 112 b of the receiving portion 112 and engage into the screw holes 122 a of the metal posts 122 respectively, while the springs 134 interfere with the receiving portions 112 around the through holes 112 respectively and are also compressed by head portions 132 a of the screws 132 and the receiving portions 112. Therefore, during assembly, spring force generated by the springs 134 under compression is applied on the peripheral portion of the thermal conductor 110, thereby retaining the location of the thermal conductor 110 with respect to the carrier 50, and making the thermal conductor in contact with the heat generating component 60.
When assembling the thermal module 100 on the carrier 50, an operator must take time to secure the mounting members 130 in order to secure the thermal module 100. Besides, when the heat generating component 60 needs repair because of damage, before repairing or replacing of the heat generating component 60, a considerable amount of time must likewise be taken to remove the mounting members 130 in order to remove the thermal module 100.
FIG. 2 is a cross-sectional view of another conventional thermal module mounted on a carrier. Referring to FIG. 2, the conventional thermal module 200 includes a thermal conductor 210, a bracket 220, a pressing member 230, and a plurality of screws 240. The thermal conductor 210 is positioned on a first side 50 a of a carrier 50, and includes a heat pipe 212 and a bottom plate 214. The bottom plate 214 is in contact with a heat generating component 60 on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 214 to the heat pipe 212 and is then dissipated out. The pressing member 230 is located at the first side 50 a of the carrier 50, for pressing the thermal conductor 210 against the heat generating component 60. In addition, the pressing member 230 has a plurality of first openings 232 a and a plurality of second openings 232 b, and each first opening 232 a and one corresponding second opening 232 b collectively form a through opening 232.
The bracket 220 is positioned on a second side 50 b of the carrier 50 opposite to the first side 50 a, and is positioned corresponding to the thermal conductor 210. Besides, the bracket 220 includes a plurality of metal posts 222 arranged at a peripheral portion thereof, and the metal posts 222 respectively extend through the second openings 232 b of the pressing member 230. In addition, each metal post 222 has a screw hole 222 a defined therein. The screws 240 fit in the through openings 232 of the pressing member 230, respectively.
When the screws 240 fit in the through openings 232 of the pressing member 230, shank portions 240 b of the screws 240 extend through the first openings 232 a, and engage into the screw holes 222 a of the metal posts 222 respectively. Besides, head portions 240 a of the screws 240 interfere with the pressing member 230 around the first openings 232 a respectively. Therefore, during assembly, the head portions 240 a of the screws 240 exert a force on the pressing member 230 toward the carrier 50, and the thermal conductor 210 is thereby made in contact with the heat generating component 60 under the pressing force of the pressing member 230.
Likewise, when assembling the thermal module 200, the operator must take time to fasten the screws 240 in order to secure the thermal module 200. Besides, when the heat generating component 60 needs repair because of damage, before repairing or replacing of the heat generating component 60, a considerable amount of time must likewise be taken to remove the screws 240 in order to remove the thermal module 200.
Thus, in both of the conventional thermal modules 100 and 200, there exists a problem that the assembly and disassembly can be time-consuming, which increases the cost for assembly and repair.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a thermal module which can be mounted to a carrier and be made in contact with a heat generating component by magnetic force.
In one aspect, a thermal module is provided. The thermal module includes a thermal conductor, a bracket, at least one magnetic element, and at least one magnetically susceptible element. The thermal conductor is located at a first side of a carrier, and has at least one receiving portion. The bracket is located at a second side of the carrier opposite to the first side. The magnetic element is disposed in the receiving portion. The magnetically susceptible element is fixedly mounted to the bracket, and extends through a through hole of the carrier to contact with the magnetic element. A magnetic attractive force produced between the magnetic element and the magnetically susceptible element retains the thermal conductor and the bracket with respect to the carrier.
According to one embodiment of the present invention, the receiving portion has an opening defined in a bottom thereof, and the magnetically susceptible element extends through the through hole and the opening to contact with the magnetic element.
According to one embodiment of the present invention, the magnetic element is adhered to the thermal conductor.
According to one embodiment of the present invention, the magnetic element is a permanent magnet.
According to one embodiment of the present invention, the material of the magnetically susceptible element is metal.
According to one embodiment of the present invention, the bracket and the magnetically susceptible element are integrally formed together.
In another aspect, a thermal module suitable for being detachably mounted between a carrier and a cover is provided, and a position of the carrier is fixed with respect to the cover. The thermal module includes a thermal conductor, at least one first magnetic element, and at least one second magnetic element. The thermal conductor is located at a side of the carrier, and includes at least one receiving portion. The first magnetic element is disposed in the receiving portion. The second magnetic element is fixedly mounted to the cover. The first magnetic element and the second magnetic element include same magnetic poles confronting with each other, and a magnetic repulsion force produced between the first magnetic element and the second magnetic element retains the thermal conductor with respect to the carrier.
According to one embodiment of the present invention, the first magnetic element is adhered to the thermal conductor.
According to one embodiment of the present invention, the first magnetic element and the second magnetic element are permanent magnets.
In another aspect, a thermal module is provided. The thermal module includes a thermal conductor, a pressing member, a bracket, at least one magnetic element, and at least one magnetically susceptible element. The thermal conductor is located at a first side of a carrier. The pressing member is located at the first side of the carrier, and has a first opening and a second opening collectively forming a through opening. The pressing member is connected with the thermal conductor. The bracket is located at a second side of the carrier opposite to the first side. The magnetic element is disposed in the through opening. The magnetically susceptible element is fixedly mounted to the bracket. The magnetically susceptible element extends through a through hole of the carrier to contact with the magnetic element. A magnetic attractive force produced between the magnetic element and the magnetically susceptible element enables the pressing member to retain the thermal conductor with respect to the carrier.
According to one embodiment of the present invention, the pressing member includes at least one resilient arm, and the magnetic element is connected to the resilient arm.
According to one embodiment of the present invention, the magnetic element includes a head portion and a shank portion connected with the head portion, the first opening fits the shank portion in a non-interference manner, the shank portion of the magnetic element contacts with the magnetically susceptible element, and the head portion of the magnetic element retains the resilient arm with respect to the magnetically susceptible element in a substantially vertical direction.
According to one embodiment of the present invention, the magnetically susceptible element is columnar in shape, the second opening fits the magnetically susceptible element in a non-interference manner, and the magnetically susceptible element retains the resilient arm with respect to the magnetically susceptible element in a substantially horizontal direction.
According to one embodiment of the present invention, the magnetic element is a permanent magnet.
According to one embodiment of the present invention, the material of the magnetically susceptible element is metal.
According to one embodiment of the present invention, the bracket and the magnetically susceptible element are integrally formed together.
In another aspect, a thermal module is provided. The thermal module includes a thermal conductor, a pressing member, a bracket, at least one first magnetic element, and at least one second magnetic element. The thermal conductor is located at a first side of a carrier. The pressing member is located at the first side of the carrier, and has a first opening and a second opening collectively forming a through opening. The pressing member is connected with the thermal conductor. The bracket is located at a second side of the carrier opposite to the first side. The first magnetic element is disposed in the through opening. The second magnetic element is fixedly disposed on the carrier at a position vertically aligned with the through opening. The second magnetic element and the bracket produce therebetween a magnetic attractive force to secure the bracket on the second side of the carrier. Another magnetic attractive force produced between the first magnetic element and the second magnetic element enables the pressing member to retain the thermal conductor with respect to the carrier.
According to one embodiment of the present invention, the material of the bracket is metal.
According to one embodiment of the present invention, the second magnetic element and the first magnetic element are made in contact with each other by the magnetic attractive force produced therebetween.
According to one embodiment of the present invention, the pressing member includes at least one resilient arm, and the first magnetic element is connected to the resilient arm.
According to one embodiment of the present invention, the first magnetic element includes a head portion and a shank portion connected with the head portion, the first opening fits the shank portion in a non-interference manner, the shank portion of the first magnetic element contacts with the second magnetic element, and the head portion of the first magnetic element retains the resilient arm with respect to the second magnetic element in a substantially vertical direction.
According to one embodiment of the present invention, the second magnetic element is columnar in shape, the second opening fits the second element in a non-interference manner, and the second magnetic element retains the resilient arm with respect to the second magnetic element in a substantially horizontal direction.
According to one embodiment of the present invention, the first magnetic element is a permanent magnet.
According to one embodiment of the present invention, the second magnetic element is a permanent magnet.
In another aspect, a thermal module is provided. The thermal module includes a thermal conductor, a pressing member, at least one first magnetic element, and at least one second magnetic element. The thermal conductor is located at a first side of a carrier. The pressing member is located at the first side of the carrier, and has a first opening and a second opening collectively forming a through opening. The pressing member is connected with the thermal conductor. The first magnetic element is disposed in the through opening. The second magnetic element is fixedly disposed on the carrier at a position vertically aligned with the through opening. A magnetic attractive force produced between the first magnetic element and the second magnetic element enables the pressing member to retain the thermal conductor with respect to the carrier.
According to one embodiment of the present invention, the pressing member includes at least one resilient arm, and the first magnetic element is connected to the resilient arm.
According to one embodiment of the present invention, the first magnetic element includes a head portion and a shank portion connected with the head portion, the first opening fits the shank portion in a non-interference manner, the shank portion of the first magnetic element contacts with the first side of the carrier, and the head portion of the first magnetic element retains the resilient arm with respect to the second magnetic element in a substantially vertical direction.
According to one embodiment of the present invention, the position at which the second magnetic element is fixedly disposed is on the first side of the carrier, or a second side of the carrier opposite to the first side.
According to one embodiment of the present invention, the thermal module further includes a limit element fixedly mounted to the carrier for horizontally retaining the second magnetic element with respect to the first magnetic element.
According to one embodiment of the present invention, the first magnetic element is a permanent magnet.
According to one embodiment of the present invention, the second magnetic element is a permanent magnet.
The thermal module of the present invention can retain the thermal conductor with respect to the carrier by using the magnetic attractive force or repulsion force produced between either the magnetic element or the magnetically susceptible element and the magnetic element. As a result, the thermal module of the present invention can be quickly mounted to or removed from the carrier manually.
In order to make the aforementioned and other features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

FIG. 1 is a cross-sectional view of a conventional thermal module mounted on a carrier.

FIG. 2 is a cross-sectional view of another conventional thermal module mounted on a carrier.

FIG. 3 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a first embodiment of the present invention.

FIG. 4 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a second embodiment of the present invention.

FIG. 5 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a third embodiment of the present invention.

FIG. 6 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a fourth embodiment of the present invention.

FIG. 7 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a fifth embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

First Embodiment

FIG. 3 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a first embodiment of the present invention. Referring to FIG. 3, the thermal module 300 is configured to be detachably mounted to a carrier 50, wherein the carrier 50 may be a motherboard of an electronic device such as a motherboard of a notebook computer. The thermal module 300 includes a thermal conductor 310, a bracket 320, a plurality of magnetic elements 330, and a plurality of magnetically susceptible elements 340. The thermal conductor 310 is positioned on a first side 50 a of the carrier 50, and includes a plurality of receiving portions 312, a bottom plate 314, and a heat pipe 316. The bottom plate 314 is in contact with a heat generating component 60 positioned on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 314 to the heat pipe 316 and is then dissipated out. In an alternative embodiment not depicted, however, the heat pipe 316 may be replaced with other components having good heat dissipation performance such as cooling fins. In addition, the receiving portions 312 are arranged at a peripheral portion of the thermal conductor 310, and each receiving portion 312 has an opening 312 a defined in a bottom thereof. The magnetic elements 330 are respectively disposed in the receiving portions 312, and may be adhered to the thermal conductor 310. In this embodiment, the magnetic elements 330 are permanent magnets, for example.
The bracket 320 is positioned on a second side 50 b of the carrier 50 opposite to the first side 50 a, and is positioned corresponding to the thermal conductor 310. The bracket 320 is utilized to support the carrier 50 to prevent deformation thereof. The magnetically susceptible elements 340 are integrally formed with the bracket 320. In an alternative embodiment not depicted, however, the magnetically susceptible elements 340 may be mounted to the bracket 320 by suitable methods such as welding. Further, the magnetically susceptible elements 340 are positioned to align with the receiving portions 312 respectively. In this embodiment, the material of the magnetically susceptible elements 340 is metal, for example.
In addition, the magnetically susceptible elements 340 extend through a plurality of through holes 54 of the carrier 50 respectively, and may extend through the openings 312 a of the receiving portions 312 so as to make contact with the magnetic elements 330 respectively. Bottoms of the magnetic elements 330 interfere with the receiving portions 312 around the openings 312 a. Therefore, once a magnetic attractive force is produced between the magnetic elements 330 and the magnetically susceptible elements 340, the magnetic elements 330 will exert a force on the thermal conductor 310 toward the carrier 50, thereby retaining the thermal conductor 310 and the bracket 320 with respect to the carrier 50, and making the thermal conductor 310 in contact with the heat generating component 60.
In assembly of the thermal module 300 of this embodiment onto the carrier 50, it is only required to make the magnetic elements 330 and the magnetically susceptible elements 340 contact with each other to produce a magnetic attractive force therebetween, thus the assembly thereof can be quickly accomplished. In addition, in disassembly of the thermal module 300, it is only required to exert a force in a reverse direction to counteract the magnetic attractive force produced between the magnetic elements 330 and the magnetically susceptible elements 340, then the thermal conductor 310 can easily be removed from the carrier 50, thus facilitating repairing or replacing of the heat generating component 60.

Second Embodiment

FIG. 4 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a second embodiment of the present invention. Referring to FIG. 4, the thermal module 400 is configured to be detachably mounted between a carrier 50 and a cover 56, wherein the carrier 50 may be a motherboard of an electronic device such as a motherboard of a notebook computer, and the cover 56 may be a detachable portion of a housing of the electronic device. The thermal module 400 includes a thermal conductor 410, a plurality of first magnetic elements 420, and a plurality of second magnetic elements 430. The thermal conductor 410 is positioned on a first side 50 a of the carrier 50, and includes a plurality of receiving portions 412, a bottom plate 414, and a heat pipe 416. The bottom plate 414 is in contact with a heat generating component 60 positioned on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 414 to the heat pipe 416 and is then dissipated out. In an alternative embodiment not depicted, however, the heat pipe 416 may be replaced with other components having good heat dissipation performance such as cooling fins. Further, the cover 56 is positioned above the thermal conductor 410, and its position with respect to the carrier 50 is fixed.
In addition, the receiving portions 412 are arranged at a peripheral portion of the thermal conductor 410. The first magnetic elements 420 are respectively disposed in the receiving portions 412, and may be adhered to the thermal conductor 410. The second magnetic elements 430 are respectively fixedly mounted to the cover 56. In this embodiment, the first magnetic elements 420 and the second magnetic elements 430 are permanent magnets, for example.
Furthermore, the first magnetic elements 420 and corresponding second magnetic elements 430 have same magnetic poles confronting with each other, and the second magnetic elements 430 and the bottom portions of the receiving portions 412 interfere with each other, respectively. Therefore, once a magnetic repulsion force is produced between the first magnetic elements 420 and the corresponding second magnetic elements 430, the second magnetic elements 430 will exert a force on the thermal conductor 410 toward the carrier 50, thereby retaining the thermal conductor 410 with respect to the carrier 50, and making the thermal conductor 410 in contact with the heat generating component 60.
In assembly of the thermal module 400 of this embodiment onto the carrier 50, it is only required to make the second magnetic elements 430 on the cover 56 and the first magnetic elements 420 in the receiving portions 412 produce a magnetic repulsion force therebetween, thus the assembly thereof can be quickly accomplished. In addition, in disassembly of the thermal module 400, it is only required to remove the cover 56 so that the magnetic repulsion force between the first magnetic elements 420 and the second magnetic elements 430 disappears, and then the thermal conductor 410 can easily be removed from the carrier 50, thus facilitating repairing or replacing of the heat generating component 60.

Third Embodiment

FIG. 5 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a third embodiment of the present invention. Referring to FIG. 5, the thermal module 500 is configured to be detachably mounted to a carrier 50, wherein the carrier 50 may be a motherboard of an electronic device such as a motherboard of a notebook computer. The thermal module 500 includes a thermal conductor 510, a bracket 520, a pressing member 530, a plurality of magnetic elements 540, and a plurality of magnetically susceptible elements 550. The thermal conductor 510 is positioned on a first side 50 a of the carrier 50, and includes a heat pipe 512 and a bottom plate 514. The bottom plate 514 is in contact with a heat generating component 60 positioned on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 514 to the heat pipe 512 and is then dissipated out. In an alternative embodiment not depicted, however, the heat pipe 512 may be replaced with other components having good heat dissipation performance such as cooling fins.
The bracket 520 is positioned on a second side 50 b of the carrier 50 opposite to the first side 50 a. The magnetically susceptible elements 550 are integrally formed with the bracket 520. In an alternative embodiment not depicted, however, the magnetically susceptible elements 550 may be mounted to the bracket 520 by suitable methods such as welding. In this embodiment, the material of the magnetically susceptible elements 550 may be metal, and the magnetically susceptible elements 550 is columnar in shape, for example.
In addition, the pressing member 530 is located at the first side 50 a of the carrier 50, for pressing the thermal conductor 510 against the heat generating component 60. The pressing member 530 may further include a plurality of resilient arms 532 to which the magnetic elements 540 are connected. The pressing member 530 includes a plurality of first openings 534 a and a plurality of second openings 534 b. Each first opening 534 a and one corresponding second opening 534 b collectively form a through opening 534. The magnetic elements 540 are respectively disposed in the through openings 534, and each of the magnetic elements 540 include a head portion 540 a and a shank portion 540 b connected with the head portion 540 a. In this embodiment, the magnetic elements 540 are permanent magnets, for example.
In addition, the shank portions 540 b of the magnetic elements 540 may respectively extend through the first openings 534 a of the pressing member 530, and the first openings 534 a respectively fit the shank portions 540 b of the magnetic elements 540 in a non-interference manner. An outer diameter D1 of the head portion 540 a of each magnetic element 540 is larger than an inner diameter D2 of a corresponding one of the first openings 534 a, so that the head portions 540 a of the magnetic elements 540 interfere with the pressing member 530 around the first openings 534 a to thereby retain the resilient arms 532 with respect to the magnetically susceptible elements 550 in a substantially vertical direction.
Furthermore, the magnetically susceptible elements 550 respectively extend through through holes 54 of the carrier 50 and the second openings 534 b, and the second openings 534 b respectively fit the magnetically susceptible elements 550 in a non-interference manner, so that the magnetically susceptible elements 550 retain the resilient arms 534 with respect to the magnetically susceptible elements 550 in a substantially horizontal direction. Once the magnetically susceptible elements 550 and the magnetic elements 540 contact with each other to produce the magnetic attractive force therebetween, the magnetic elements 540 exert a force on the pressing member 530 toward the carrier 50, whereby the pressing member 530 is enabled to retain the thermal conductor 510 with respect to the carrier 50, making the thermal conductor 510 in contact with the heat generating component 60.
In assembly of the thermal module 500 of this embodiment onto the carrier 50, it is only required to make the magnetic elements 540 and the magnetically susceptible elements 550 produce a magnetic attractive force therebetween, thus the assembly thereof can be quickly accomplished. In addition, in disassembly of the thermal module 500, it is only required to exert a force in a reverse direction to counteract the magnetic attractive force produced between the magnetic elements 540 and the magnetically susceptible elements 550, then the thermal conductor 510 can easily be removed from the carrier 50, thus facilitating repairing or replacing of the heat generating component 60.

Fourth Embodiment

FIG. 6 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a fourth embodiment of the present invention. Referring to FIG. 6, the thermal module 600 is configured to be detachably mounted to a carrier 50, wherein the carrier 50 may be a motherboard of an electronic device such as a motherboard of a notebook computer. The thermal module 600 includes a thermal conductor 610, a bracket 620, a pressing member 630, a plurality of first magnetic elements 640, and a plurality of second magnetic elements 650. The thermal conductor 610 is positioned on a first side 50 a of the carrier 50, and includes a heat pipe 612 and a bottom plate 614. The bottom plate 614 is in contact with a heat generating component 60 positioned on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 614 to the heat pipe 612 and is then dissipated out. In an alternative embodiment not depicted, however, the heat pipe 612 may be replaced with other components having good heat dissipation performance such as cooling fins.
In addition, the pressing member 630 is located at the first side 50 a of the carrier 50 and presses the thermal conductor 610. The pressing member 630 may further include a plurality of resilient arms 632 to which the first magnetic element 640 are connected. The pressing member 630 includes a plurality of first openings 634 a and a plurality of second openings 634 b. Each first opening 634 a and one corresponding second opening 634 b collectively form a through opening 634. The first magnetic elements 640 are respectively disposed in the through openings 634, and each of the first magnetic elements 640 includes a head portion 640 a and a shank portion 640 b connected with the head portion 640 a. The second magnetic elements 650 are fixedly disposed on the carrier 50 at positions vertically aligned with the through openings 634, and cooperate with the bracket 620 to produce a magnetic attractive force therebetween, by which the bracket 620 is secured on an second side 50 b of the carrier 50 opposite to the first side 50 a. In this embodiment, the first magnetic elements 640 and the second magnetic elements 650 are permanent magnets, for example, and the material of the bracket 620 may be metal.
In addition, the shank portions 640 b of the first magnetic elements 640 may respectively extend through the through openings 634, and the through openings 634 respectively fit the shank portions 640 b of the first magnetic elements 640 in a non-interference manner. An outer diameter D1 of the head portion 640 a of each first magnetic element 640 is larger than an inner diameter D2 of a corresponding one of the second openings 634 b, so that the head portions 640 a of the first magnetic elements 640 interfere with the pressing member 630 around the first openings 634 a to thereby retain the resilient arms 632 with respect to the second magnetic elements 650 in a substantially vertical direction. Therefore, once each first magnetic element 640 and one corresponding second magnetic element 650 produce a magnetic attractive force therebetween, the first magnetic elements 640 exert a force on the pressing member 630 toward the carrier 50, whereby the pressing member 630 is enabled to retain the thermal conductor 610 with respect to the carrier 50, making the thermal conductor 610 in contact with the heat generating component 60.
In assembly of the thermal module 600 of this embodiment onto the carrier 50, it is only required to make the first magnetic elements 640 and the second magnetic elements 650 to produce a magnetic attractive force therebetween, thus the assembly thereof can be quickly accomplished. In addition, in disassembly of the thermal module 600, it is only required to exert a force in a reverse direction to counteract the magnetic attractive force produced between the first magnetic elements 640 and the second magnetic elements 650, and then the thermal conductor 610 can easily be removed from the carrier 50, thus facilitating repairing or replacing of the heat generating component 60.

Fifth Embodiment

FIG. 7 is a cross-sectional view of a thermal module mounted on a carrier in accordance with a fifth embodiment. Referring to FIG. 7, the thermal module 700 is configured to be detachably mounted to a carrier 50, wherein the carrier 50 may be a motherboard of an electronic device such as a motherboard of a notebook computer. The thermal module 700 includes a thermal conductor 710, a pressing member 720, a plurality of first magnetic elements 730, a plurality of second magnetic elements 740, and a plurality of limit elements 750. The thermal conductor 710 is located at a first side 50 a of the carrier 50, and includes a heat pipe 712 and a bottom plate 714. The bottom plate 714 is in contact with a heat generating component 60 positioned on the carrier 50, whereby heat generated from the heat generating component 60 is conducted through the bottom plate 714 to the heat pipe 712 and is then dissipated out. In an alternative embodiment not depicted, however, the heat pipe 712 may be replaced with other components having good heat dissipation performance such as cooling fins.
In addition, the pressing member 720 is located at the first side 50 a of the carrier 50 and presses the thermal conductor 710. The pressing member 720 may further include a plurality of resilient arms 722 to which the first magnetic elements 730 are connected. The pressing member 720 includes a plurality of first openings 724 a and a plurality of second openings 724 b. Each first opening 724 a and one corresponding second opening 724 b collectively form a through opening 724. The first magnetic elements 730 are respectively disposed in the through openings 724, and each of the first magnetic elements 730 includes a head portion 730 a and a shank portion 730 b connected with the head portion 730 a. The second magnetic elements 740 are located on a second side 50 b of the carrier 50 opposite to the first side 50 a, and fixedly disposed on the carrier 50 at positions vertically aligned with the through openings 724, respectively. In an alternative embodiment not depicted, however, the second magnetic elements 740 may be located on the first side 50 a of the carrier 50. In this embodiment, the first magnetic elements 730 and the second magnetic elements 740 are permanent magnets, for example.
The limit elements 750 are fixedly mounted to the carrier 50 for horizontally retaining the second magnetic elements 740 with respect to the first magnetic elements 730. The limit elements 750 are each shaped, for example, as a column having an opening 752, and respectively fit the shank portions 730 b of the first magnetic elements 730 in a non-interference manner. In an alternative embodiment not depicted, however, the limit elements 750 may be of another suitable shape.
In addition, the shank portions 730 b of the first magnetic elements 730 may respectively extend through the through openings 724, and the through openings 724 respectively fit the shank portions 730 b of the first magnetic elements 730 in a non-interference manner. An outer diameter D1 of the head portion 730 a of each first magnetic element 730 is larger than an inner diameter D2 of a corresponding one of the first openings 724 a, so that the head portions 730 a of the first magnetic elements 730 interfere with the pressing member 720 around the first openings 724 a to thereby retain the resilient arms 722 in a substantially vertical direction. Once the first magnetic element 730 and the corresponding second magnetic elements 740 produce a magnetic attractive force therebetween, the first magnetic elements 730 exert a force on the pressing member 720 toward the carrier 50, whereby the pressing member 720 is enabled to retain the thermal conductor 710 with respect to the carrier 50, making the thermal conductor 710 in contact with the heat generating component 60.
In assembly of the thermal module 700 of this embodiment onto the carrier 50, it is only required to make the first magnetic elements 730 and the second magnetic elements 740 produce the magnetic attractive force therebetween, thus the assembly thereof can be quickly accomplished. In addition, in disassembly of the thermal module 700, it is only required to exert a force in a reverse direction to counteract the magnetic attractive force produced between the first magnetic elements 730 and the second magnetic elements 740, and then the thermal conductor 710 can easily be removed from the carrier 50, thus facilitating repairing or replacing of the heat generating component 60.
In sum, the thermal module of the present invention employs a securing force derived from magnetic force, which can quickly assemble the thermal module to the carrier. In addition, if desired, the thermal module can be quickly removed from the carrier for repairing or replacing of the thermal module. Therefore, the thermal module of the present invention can effectively reduce the time and cost for assembly or disassembly, and enhance the efficiency of repairing or replacing in comparison with the prior arts.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims

What is claimed is:

1. A thermal module comprising:

a thermal conductor located at a first side of a carrier, and having at least one receiving portion;

a bracket located at a second side of the carrier opposite to the first side;

at least one magnetic element disposed in the receiving portion; and

at least one magnetically susceptible element fixedly mounted to the bracket, and extending through a through hole of the carrier to contact with the magnetic element,

wherein a magnetic attractive force produced between the magnetic element and the magnetically susceptible element retains the thermal conductor and the bracket with respect to the carrier.

2. A thermal module in accordance with claim 1, wherein the receiving portion has an opening defined in a bottom thereof, and the magnetically susceptible element extends through the through hole and the opening to contact with the magnetic element.

3. A thermal module in accordance with claim 1, wherein the magnetic element is adhered to the thermal conductor.

4. A thermal module in accordance with claim 1, wherein the magnetic element is a permanent magnet.

5. A thermal module suitable for being detachably mounted between a carrier and a cover, a position of the carrier being fixed with respect to the cover, the thermal module comprising:

a thermal conductor located at a side of the carrier, and having at least one receiving portion;

at least one first magnetic element disposed in the receiving portion; and

at least one second magnetic element fixedly mounted to the cover,

wherein the first magnetic element and the second magnetic element comprise same magnetic poles confronting with each other, and a magnetic repulsion force produced between the first magnetic element and the second magnetic element retains the thermal conductor with respect to the carrier.

6. A thermal module in accordance with claim 5, wherein the first magnetic element is adhered to the thermal conductor.

7. A thermal module in accordance with claim 5, wherein the first magnetic element and the second magnetic element are permanent magnets.

8. A thermal module comprising:

a thermal conductor located at a first side of a carrier;

a pressing member located at the first side of the carrier, and having a first opening and a second opening, the first opening and the second opening collectively forming a through opening, the pressing member connected with the thermal conductor;

a bracket located at a second side of the carrier opposite to the first side;

at least one magnetic element disposed in the through opening; and

at least one magnetically susceptible element fixedly mounted to the bracket, the magnetically susceptible element extending through a through hole of the carrier to contact with the magnetic element;

wherein a magnetic attractive force produced between the magnetic element and the magnetically susceptible element enables the pressing member to retain the thermal conductor with respect to the carrier.

9. A thermal module in accordance with claim 8, wherein the pressing member comprises at least one resilient arm, and the magnetic element is connected to the resilient arm.

10. A thermal module in accordance with claim 9, wherein the magnetic element comprises a head portion and a shank portion connected with the head portion, the first opening fits the shank portion in a non-interference manner, the shank portion of the magnetic element contacts with the magnetically susceptible element, and the head portion of the magnetic element retains the resilient arm with respect to the magnetically susceptible element in a substantially vertical direction.

11. A thermal module in accordance with claim 10, wherein the magnetically susceptible element is columnar in shape, the second opening fits the magnetically susceptible element in a non-interference manner, and the magnetically susceptible element retains the resilient arm with respect to the magnetically susceptible element in a substantially horizontal direction.

12. A thermal module in accordance with claim 8, wherein the magnetic element is a permanent magnet.

13. A thermal module comprising:

a thermal conductor located at a first side of a carrier;

a bracket located at a second side of the carrier opposite to the first side;

at least one first magnetic element disposed in the through opening; and

at least one second magnetic element fixedly disposed on the carrier at a position vertically aligned with the through opening, the second magnetic element and the bracket producing therebetween a magnetic attractive force to secure the bracket on the second side of the carrier,

wherein another magnetic attractive force produced between the first magnetic element and the second magnetic element enables the pressing member to retain the thermal conductor with respect to the carrier.

14. A thermal module in accordance with claim 13, wherein the second magnetic element and the first magnetic element are made in contact with each other by the magnetic attractive force produced therebetween.

15. A thermal module in accordance with claim 13, wherein the pressing member comprises at least one resilient arm, and the first magnetic element is connected to the resilient arm.

16. A thermal module in accordance with claim 15, wherein the first magnetic element comprises a head portion and a shank portion connected with the head portion, the first opening fits the shank portion in a non-interference manner, the shank portion of the first magnetic element contacts with the second magnetic element, and the head portion of the first magnetic element retains the resilient arm with respect to the second magnetic element in a substantially vertical direction.

17. A thermal module in accordance with claim 15, wherein the second magnetic element is columnar in shape, the second opening fits the second element in a non-interference manner, and the second magnetic element retains the resilient arm with respect to the second magnetic element in a substantially horizontal direction.

18. A thermal module in accordance with claim 13, wherein the first magnetic element is a permanent magnet.

19. A thermal module in accordance with claim 13, wherein the second magnetic element is a permanent magnet.

20. A thermal module comprising:

a thermal conductor located at a first side of a carrier;

at least one first magnetic element disposed in the through opening; and

at least one second magnetic element fixedly disposed on the carrier at a position vertically aligned with the through opening,

wherein a magnetic attractive force produced between the first magnetic element and the second magnetic element enables the pressing member to retain the thermal conductor with respect to the carrier.

21. A thermal module in accordance with claim 20, wherein the pressing member comprises at least one resilient arm, and the first magnetic element is connected to the resilient arm.

22. A thermal module in accordance with claim 21, wherein the first magnetic element comprises a head portion and a shank portion connected with the head portion, the first opening fits the shank portion in a non-interference manner, the shank portion of the first magnetic element contacts with the first side of the carrier, and the head portion of the first magnetic element retains the resilient arm with respect to the second magnetic element in a substantially vertical direction.

23. A thermal module in accordance with claim 20, wherein the position is on one of the first side of the carrier and a second side of the carrier opposite to the first side.

24. A thermal module in accordance with claim 20, further comprising:

a limit element fixedly mounted to the carrier for horizontally retaining the second magnetic element with respect to the first magnetic element.

25. A thermal module in accordance with claim 20, wherein the first magnetic element is a permanent magnet.

26. A thermal module in accordance with claim 20, wherein the second magnetic element is a permanent magnet.