JP4808032B2 - 圧縮荷重適応ソケット - Google Patents
圧縮荷重適応ソケット Download PDFInfo
- Publication number
- JP4808032B2 JP4808032B2 JP2006016014A JP2006016014A JP4808032B2 JP 4808032 B2 JP4808032 B2 JP 4808032B2 JP 2006016014 A JP2006016014 A JP 2006016014A JP 2006016014 A JP2006016014 A JP 2006016014A JP 4808032 B2 JP4808032 B2 JP 4808032B2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- heat sink
- processor
- circuit board
- grid array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
102 ソケットBGA(ボール格子配列ソケット)
104 集積回路
106 回路基板
108 ヒートシンク
110 取り付け要素
116 はんだボール
Claims (3)
- 現場での交換が可能なプロセッサ及びヒートシンクと、
プリント回路基板と、
前記プリント回路基板と前記ヒートシンクとの間に配置される前記プロセッサと電気的に接続されるボール格子配列ソケットと、
前記ヒートシンクを前記プリント回路基板に保持するように構成されるヒートシンクフレームと、
前記プロセッサの平面に結合され、前記プロセッサと前記ソケットとの間の電気接続を形成する複数の表面実装ピンと、
前記ボール格子配列ソケット上に圧縮荷重をかけ、前記ボール格子配列ソケットを前記回路基板に保持するように構成された取り付け要素とを備え、
前記表面実装ピンの長さ及び前記ヒートシンクフレームによって、前記プロセッサ及び前記ソケットの間のギャップが維持され、
前記取り付け要素は、前記ボール格子配列ソケットに直接ばね力を加えるように構成される少なくとも1つのばねクリップであることを特徴とする電子アセンブリ。 - 現場での交換が可能なプロセッサ及びヒートシンクと、
前記プロセッサと電気的に接続するように構成されたボール格子配列ソケットと、
プリント回路基板と、
前記ヒートシンクを前記プリント回路基板に保持するように構成されたヒートシンクフレームと、
前記プロセッサの平面に結合され、前記プロセッサと前記ソケットとの間の電気接続を形成する複数の表面実装ピンと、
前記ボール格子配列ソケット上に圧縮荷重をかけ、前記ボール格子配列ソケットを前記回路基板に保持するように構成された取り付け要素とを備え、
前記表面実装ピンの長さ及び前記ヒートシンクフレームによって、前記プロセッサ及び前記ソケットの間のギャップが形成され、
前記取り付け要素は、前記ヒートシンクフレームと前記ソケットとの間に配置され、前記ソケットに直接ばね力を加えるように構成された少なくとも1つのばね要素であることを特徴とする電子アセンブリ。 - 前記ボール格子配列ソケットは無挿入力ソケットであることを特徴とする請求項1又は請求項2に記載の電子アセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/046,452 US7280360B2 (en) | 2005-01-28 | 2005-01-28 | Socket adapted for compressive loading |
US11/046,452 | 2005-01-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006210343A JP2006210343A (ja) | 2006-08-10 |
JP4808032B2 true JP4808032B2 (ja) | 2011-11-02 |
Family
ID=35997859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006016014A Expired - Fee Related JP4808032B2 (ja) | 2005-01-28 | 2006-01-25 | 圧縮荷重適応ソケット |
Country Status (3)
Country | Link |
---|---|
US (1) | US7280360B2 (ja) |
JP (1) | JP4808032B2 (ja) |
GB (1) | GB2422725B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8169789B1 (en) * | 2007-04-10 | 2012-05-01 | Nvidia Corporation | Graphics processing unit stiffening frame |
US8410602B2 (en) * | 2007-10-15 | 2013-04-02 | Intel Corporation | Cooling system for semiconductor devices |
ITMI20081013A1 (it) * | 2008-06-03 | 2009-12-04 | Eles Semiconductor Equipment Spa | Test di dispositivi elettronici con schede senza zoccoli basate su bloccaggio meccanico indipendente |
US8269248B2 (en) * | 2009-03-02 | 2012-09-18 | Thompson Joseph B | Light emitting assemblies and portions thereof |
US8567483B2 (en) * | 2009-11-06 | 2013-10-29 | International Business Machines Corporation | Heatsink with flexible base and height-adjusted cooling fins |
TWM475056U (zh) * | 2013-06-21 | 2014-03-21 | Hon Hai Prec Ind Co Ltd | 電連接器 |
US9913361B2 (en) | 2016-01-06 | 2018-03-06 | International Business Machines Corporation | Integrated circuit device assembly |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4414562A (en) * | 1980-07-24 | 1983-11-08 | Thermal Associates, Inc. | Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases |
DE3439556A1 (de) | 1984-08-07 | 1986-02-20 | Aavid Engineering Inc., Laconia, N.H. | Eine waermesenke bildende abdeckung fuer einen ein elektronisches chip aufnehmenden traeger |
US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US5833472A (en) | 1995-07-27 | 1998-11-10 | The Whitaker Corporation | Socket assembly for an electronic package |
US5702255A (en) * | 1995-11-03 | 1997-12-30 | Advanced Interconnections Corporation | Ball grid array socket assembly |
US5985697A (en) | 1996-05-06 | 1999-11-16 | Sun Microsystems, Inc. | Method and apparatus for mounting an integrated circuit to a printed circuit board |
US5805430A (en) * | 1996-07-22 | 1998-09-08 | International Business Machines Corporation | Zero force heat sink |
US5907474A (en) | 1997-04-25 | 1999-05-25 | Advanced Micro Devices, Inc. | Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package |
US6084178A (en) | 1998-02-27 | 2000-07-04 | Hewlett-Packard Company | Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU) |
US6137164A (en) * | 1998-03-16 | 2000-10-24 | Texas Instruments Incorporated | Thin stacked integrated circuit device |
TW383955U (en) * | 1998-08-31 | 2000-03-01 | Hon Hai Prec Ind Co Ltd | Module apparatus for slot connector |
US6947293B2 (en) * | 1999-07-15 | 2005-09-20 | Incep Technologies | Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
US6840777B2 (en) * | 2000-11-30 | 2005-01-11 | Intel Corporation | Solderless electronics packaging |
US6462271B2 (en) | 2000-12-27 | 2002-10-08 | International Business Machines Corporation | Capping structure for electronics package undergoing compressive socket actuation |
US6586684B2 (en) * | 2001-06-29 | 2003-07-01 | Intel Corporation | Circuit housing clamp and method of manufacture therefor |
US6713684B2 (en) | 2001-11-01 | 2004-03-30 | Intel Corporation | Hole grid array package and socket technology |
TW511811U (en) * | 2001-11-16 | 2002-11-21 | Via Tech Inc | Removable integrated circuit device |
US6740820B2 (en) * | 2001-12-11 | 2004-05-25 | Andrew Cheng | Heat distributor for electrical connector |
US6626691B2 (en) * | 2001-12-19 | 2003-09-30 | Hon Hai Precision Ind. Co., Ltd. | Pick up cap for BGA socket |
US20030150645A1 (en) * | 2002-02-12 | 2003-08-14 | Chia-Pin Chiu | Method and apparatus for coupling a microelectronic device package to a circuit board |
WO2003073251A2 (en) * | 2002-02-25 | 2003-09-04 | Molex Incorporated | Power delivery to base of processor |
US20040111876A1 (en) * | 2002-12-13 | 2004-06-17 | Andrew Cheng | Reworking device for removing electrical elements mounted on motherboard |
US20050108877A1 (en) * | 2003-11-24 | 2005-05-26 | Peterson Eric C. | Apparatus and method for coupling a thermal dissipation device to an electronic substrate |
US7280362B2 (en) * | 2003-12-04 | 2007-10-09 | Dell Products L.P. | Method and apparatus for attaching a processor and corresponding heat sink to a circuit board |
US7567435B2 (en) * | 2005-03-07 | 2009-07-28 | Advanced Thermal Solutions, Inc. | Heat sink assembly |
-
2005
- 2005-01-28 US US11/046,452 patent/US7280360B2/en not_active Expired - Fee Related
-
2006
- 2006-01-11 GB GB0600518A patent/GB2422725B/en not_active Expired - Fee Related
- 2006-01-25 JP JP2006016014A patent/JP4808032B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7280360B2 (en) | 2007-10-09 |
GB0600518D0 (en) | 2006-02-22 |
GB2422725A (en) | 2006-08-02 |
US20060171122A1 (en) | 2006-08-03 |
GB2422725B (en) | 2010-10-20 |
JP2006210343A (ja) | 2006-08-10 |
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