JP2006216944A - ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ - Google Patents

ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ Download PDF

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Publication number
JP2006216944A
JP2006216944A JP2006016582A JP2006016582A JP2006216944A JP 2006216944 A JP2006216944 A JP 2006216944A JP 2006016582 A JP2006016582 A JP 2006016582A JP 2006016582 A JP2006016582 A JP 2006016582A JP 2006216944 A JP2006216944 A JP 2006216944A
Authority
JP
Japan
Prior art keywords
pcb
ball grid
assembly
reinforcement
bga
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006016582A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006216944A5 (enExample
Inventor
Thomas E Berto
イー． バート トマス
Anirudh N Vaze
エヌ． ヴェィズ アニルドゥ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2006216944A publication Critical patent/JP2006216944A/ja
Publication of JP2006216944A5 publication Critical patent/JP2006216944A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006016582A 2005-02-02 2006-01-25 ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ Pending JP2006216944A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/049,474 US7170165B2 (en) 2005-02-02 2005-02-02 Circuit board assembly with a brace surrounding a ball-grid array device

Publications (2)

Publication Number Publication Date
JP2006216944A true JP2006216944A (ja) 2006-08-17
JP2006216944A5 JP2006216944A5 (enExample) 2009-02-26

Family

ID=36756308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006016582A Pending JP2006216944A (ja) 2005-02-02 2006-01-25 ボールグリッドアレイ用の補強材を設けたプリント回路基板アセンブリ

Country Status (3)

Country Link
US (1) US7170165B2 (enExample)
JP (1) JP2006216944A (enExample)
CN (1) CN1816248A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010086976A (ja) * 2008-09-29 2010-04-15 Toshiba Corp 電子機器、および半導体パッケージ
JP2010093310A (ja) * 2010-01-29 2010-04-22 Toshiba Corp 電子機器
JP2010177513A (ja) * 2009-01-30 2010-08-12 Toshiba Corp 電子機器
JP2010283017A (ja) * 2009-06-02 2010-12-16 Fujitsu Ltd 電子機器および補強部品
JP2012028810A (ja) * 2011-10-07 2012-02-09 Toshiba Corp 電子機器
US8243450B2 (en) 2010-04-09 2012-08-14 Kabushiki Kaisha Toshiba Electronic apparatus
US8254129B2 (en) 2009-03-30 2012-08-28 Kabushiki Kaisha Toshiba Electronic apparatus
JP5017473B1 (ja) * 2011-03-16 2012-09-05 株式会社東芝 テレビジョン受像機および電子機器
JP2013026633A (ja) * 2011-07-14 2013-02-04 Toshiba Corp テレビジョン受像機、及び電子機器
KR20200081217A (ko) * 2018-12-26 2020-07-07 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 집적 회로 패키지 및 방법
JP2021150645A (ja) * 2020-03-17 2021-09-27 ハミルトン・サンドストランド・コーポレイションHamilton Sundstrand Corporation 電子アセンブリ、および電子アセンブリを組み立てる方法
US12300571B2 (en) 2018-12-26 2025-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method

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US20040238947A1 (en) * 2003-05-28 2004-12-02 Intel Corporation Package and method for attaching an integrated heat spreader
US7492598B2 (en) * 2006-09-20 2009-02-17 Cisco Technology, Inc. Heatsink attachment mechanism
CN101344805B (zh) * 2007-07-12 2011-11-09 鸿富锦精密工业（深圳）有限公司 主机板
CN201112665Y (zh) * 2007-08-28 2008-09-10 富士康(昆山)电脑接插件有限公司 电连接器组件
US20090080126A1 (en) * 2007-09-25 2009-03-26 Ise Corporation Energy Storage Device Coupler and Method
US7432591B1 (en) 2008-02-28 2008-10-07 International Business Machines Corporation Thermal enhanced plastic ball grid array with heat sink attachment option
CN201312048Y (zh) * 2008-10-28 2009-09-16 番禺得意精密电子工业有限公司 插座连接器
JP2010166025A (ja) * 2008-12-19 2010-07-29 Panasonic Corp 実装構造
EP2251903B1 (en) * 2009-05-14 2017-03-29 Thompson Licensing Heat sink mounting method
CN102845143B (zh) * 2009-08-18 2015-05-20 惠普发展公司，有限责任合伙企业 装置安装系统和方法
JP2011082345A (ja) * 2009-10-07 2011-04-21 Panasonic Corp 半導体装置
US20120181008A1 (en) * 2011-01-18 2012-07-19 Chaun-Choung Technology C Heat sink clip device
US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
CN104216477A (zh) * 2013-05-29 2014-12-17 英业达科技有限公司 固定组件
US9338885B2 (en) 2014-07-07 2016-05-10 International Business Machines Corporation Ball grid array rework
US11382223B2 (en) * 2015-06-30 2022-07-05 Lear Corporation Spring and damper system and method for producing same
US11026356B2 (en) 2016-07-15 2021-06-01 Hewlett-Packard Development Company, L.P. Electrical device and shielding method
US20180082868A1 (en) * 2016-09-20 2018-03-22 Alcatel-Lucent Canada Inc. Gravity force compensation plate for upside down ball grid array
CN107613715A (zh) * 2017-10-20 2018-01-19 上海兴源东安电气设备制造有限公司 一种机柜或开关柜的框架
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
DE102019009344B4 (de) * 2018-12-26 2025-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Integriertes schaltungs-package und verfahren
US11183487B2 (en) 2018-12-26 2021-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
US10764990B1 (en) * 2019-04-23 2020-09-01 Adlink Technology Inc. Heat-dissipating module having an elastic mounting structure
CN110662354B (zh) * 2019-09-16 2024-11-08 苏州华智诚精工科技有限公司 Pcb板正反加工定位载具
CN112954973A (zh) * 2021-02-09 2021-06-11 陆兵 一种多点热颤动式高散热性电源
US11910566B1 (en) * 2021-03-18 2024-02-20 Amazon Technologies, Inc. Processor heat exchanger with separate mounting structure
US12069794B2 (en) * 2022-07-06 2024-08-20 Cisco Technology, Inc. Dynamic control of heat sink pressure
US12207446B2 (en) * 2022-08-02 2025-01-21 International Business Machines Corporation Adjustable retention device for heat sink assembly
US12471221B2 (en) * 2022-10-21 2025-11-11 Raytheon Company Clamping device with pivoting retainer

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JPH06224535A (ja) * 1993-01-22 1994-08-12 Fujitsu Ltd 電子部品の実装構造
JPH09293808A (ja) * 1996-04-25 1997-11-11 Fujitsu Ltd 半導体装置
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JP2000151083A (ja) * 1998-11-09 2000-05-30 Nec Saitama Ltd Ｉｃパッケージの補強構造

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JPH06224535A (ja) * 1993-01-22 1994-08-12 Fujitsu Ltd 電子部品の実装構造
JPH09293808A (ja) * 1996-04-25 1997-11-11 Fujitsu Ltd 半導体装置
JPH11150155A (ja) * 1997-11-18 1999-06-02 Matsushita Electric Ind Co Ltd 半導体装置の製造方法および当該方法に用いる回路基板保持具
JP2000058984A (ja) * 1998-08-10 2000-02-25 Fujitsu Ltd プリント基板補強部品及びこれを有するシステムボード装置
JP2000058703A (ja) * 1998-08-11 2000-02-25 Nec Corp Ｌｓｉの実装構造
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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010086976A (ja) * 2008-09-29 2010-04-15 Toshiba Corp 電子機器、および半導体パッケージ
JP2010177513A (ja) * 2009-01-30 2010-08-12 Toshiba Corp 電子機器
US8004859B2 (en) 2009-01-30 2011-08-23 Kabushiki Kaisha Toshiba Electronic apparatus
US8254129B2 (en) 2009-03-30 2012-08-28 Kabushiki Kaisha Toshiba Electronic apparatus
JP2010283017A (ja) * 2009-06-02 2010-12-16 Fujitsu Ltd 電子機器および補強部品
JP2010093310A (ja) * 2010-01-29 2010-04-22 Toshiba Corp 電子機器
US8767390B2 (en) 2010-04-09 2014-07-01 Kabushiki Kaisha Toshiba Electronic apparatus
US8243450B2 (en) 2010-04-09 2012-08-14 Kabushiki Kaisha Toshiba Electronic apparatus
JP5017473B1 (ja) * 2011-03-16 2012-09-05 株式会社東芝 テレビジョン受像機および電子機器
US9042118B2 (en) 2011-03-16 2015-05-26 Kabushiki Kaisha Toshiba Television receiver and electronic apparatus
JP2013026633A (ja) * 2011-07-14 2013-02-04 Toshiba Corp テレビジョン受像機、及び電子機器
JP2012028810A (ja) * 2011-10-07 2012-02-09 Toshiba Corp 電子機器
KR20200081217A (ko) * 2018-12-26 2020-07-07 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 집적 회로 패키지 및 방법
KR102448216B1 (ko) * 2018-12-26 2022-09-27 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 집적 회로 패키지 및 방법
US11538735B2 (en) 2018-12-26 2022-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming integrated circuit packages with mechanical braces
US12300571B2 (en) 2018-12-26 2025-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
JP2021150645A (ja) * 2020-03-17 2021-09-27 ハミルトン・サンドストランド・コーポレイションHamilton Sundstrand Corporation 電子アセンブリ、および電子アセンブリを組み立てる方法

Also Published As

Publication number Publication date
CN1816248A (zh) 2006-08-09
US7170165B2 (en) 2007-01-30
US20060171129A1 (en) 2006-08-03

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