CN1816248A - 带有用于球栅阵列装置的加固支架的印制电路板组件 - Google Patents

带有用于球栅阵列装置的加固支架的印制电路板组件 Download PDF

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Publication number
CN1816248A
CN1816248A CN200510125613.9A CN200510125613A CN1816248A CN 1816248 A CN1816248 A CN 1816248A CN 200510125613 A CN200510125613 A CN 200510125613A CN 1816248 A CN1816248 A CN 1816248A
Authority
CN
China
Prior art keywords
bracket
assembly
pcb
circuit board
mounting holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200510125613.9A
Other languages
English (en)
Chinese (zh)
Inventor
托马斯·E·博托
阿尼路德·N·维兹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of CN1816248A publication Critical patent/CN1816248A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200510125613.9A 2005-02-02 2005-11-24 带有用于球栅阵列装置的加固支架的印制电路板组件 Pending CN1816248A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/049,474 2005-02-02
US11/049,474 US7170165B2 (en) 2005-02-02 2005-02-02 Circuit board assembly with a brace surrounding a ball-grid array device

Publications (1)

Publication Number Publication Date
CN1816248A true CN1816248A (zh) 2006-08-09

Family

ID=36756308

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200510125613.9A Pending CN1816248A (zh) 2005-02-02 2005-11-24 带有用于球栅阵列装置的加固支架的印制电路板组件

Country Status (3)

Country Link
US (1) US7170165B2 (enExample)
JP (1) JP2006216944A (enExample)
CN (1) CN1816248A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101887873A (zh) * 2009-05-14 2010-11-17 汤姆逊许可公司 一种散热器安装结构及方法
CN102845143A (zh) * 2009-08-18 2012-12-26 惠普发展公司，有限责任合伙企业 装置安装系统和方法
CN104216477A (zh) * 2013-05-29 2014-12-17 英业达科技有限公司 固定组件
CN107613715A (zh) * 2017-10-20 2018-01-19 上海兴源东安电气设备制造有限公司 一种机柜或开关柜的框架
CN110662354A (zh) * 2019-09-16 2020-01-07 苏州华智诚精工科技有限公司 Pcb板正反加工定位载具
CN111384010A (zh) * 2018-12-26 2020-07-07 台湾积体电路制造股份有限公司 集成电路器件及其形成方法
CN111384043A (zh) * 2018-12-26 2020-07-07 台湾积体电路制造股份有限公司 半导体器件及其形成方法
US11183487B2 (en) 2018-12-26 2021-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
US11538735B2 (en) 2018-12-26 2022-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming integrated circuit packages with mechanical braces

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040238947A1 (en) * 2003-05-28 2004-12-02 Intel Corporation Package and method for attaching an integrated heat spreader
US7492598B2 (en) * 2006-09-20 2009-02-17 Cisco Technology, Inc. Heatsink attachment mechanism
CN101344805B (zh) * 2007-07-12 2011-11-09 鸿富锦精密工业（深圳）有限公司 主机板
CN201112665Y (zh) * 2007-08-28 2008-09-10 富士康(昆山)电脑接插件有限公司 电连接器组件
US20090080126A1 (en) * 2007-09-25 2009-03-26 Ise Corporation Energy Storage Device Coupler and Method
US7432591B1 (en) 2008-02-28 2008-10-07 International Business Machines Corporation Thermal enhanced plastic ball grid array with heat sink attachment option
JP5185048B2 (ja) * 2008-09-29 2013-04-17 株式会社東芝 電子機器、および半導体パッケージ
CN201312048Y (zh) * 2008-10-28 2009-09-16 番禺得意精密电子工业有限公司 插座连接器
JP2010166025A (ja) * 2008-12-19 2010-07-29 Panasonic Corp 実装構造
JP4585592B2 (ja) * 2009-01-30 2010-11-24 株式会社東芝 電子機器
JP2015038897A (ja) 2009-03-30 2015-02-26 株式会社東芝 電子機器
JP4801758B2 (ja) * 2009-06-02 2011-10-26 富士通株式会社 電子機器および補強部品
JP2011082345A (ja) * 2009-10-07 2011-04-21 Panasonic Corp 半導体装置
JP2010093310A (ja) * 2010-01-29 2010-04-22 Toshiba Corp 電子機器
JP4875181B2 (ja) 2010-04-09 2012-02-15 株式会社東芝 電子機器
US20120181008A1 (en) * 2011-01-18 2012-07-19 Chaun-Choung Technology C Heat sink clip device
JP5017473B1 (ja) 2011-03-16 2012-09-05 株式会社東芝 テレビジョン受像機および電子機器
JP5132801B1 (ja) * 2011-07-14 2013-01-30 株式会社東芝 テレビジョン受像機、及び電子機器
JP5002722B2 (ja) * 2011-10-07 2012-08-15 株式会社東芝 電子機器
US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
US9338885B2 (en) 2014-07-07 2016-05-10 International Business Machines Corporation Ball grid array rework
US11382223B2 (en) * 2015-06-30 2022-07-05 Lear Corporation Spring and damper system and method for producing same
US11026356B2 (en) 2016-07-15 2021-06-01 Hewlett-Packard Development Company, L.P. Electrical device and shielding method
US20180082868A1 (en) * 2016-09-20 2018-03-22 Alcatel-Lucent Canada Inc. Gravity force compensation plate for upside down ball grid array
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
US10764990B1 (en) * 2019-04-23 2020-09-01 Adlink Technology Inc. Heat-dissipating module having an elastic mounting structure
US11337338B2 (en) 2020-03-17 2022-05-17 Hamilton Sundstrand Corporation Conductive thermal management architecture employing a stiffener of a printed wiring board assembly
CN112954973A (zh) * 2021-02-09 2021-06-11 陆兵 一种多点热颤动式高散热性电源
US11910566B1 (en) * 2021-03-18 2024-02-20 Amazon Technologies, Inc. Processor heat exchanger with separate mounting structure
US12069794B2 (en) * 2022-07-06 2024-08-20 Cisco Technology, Inc. Dynamic control of heat sink pressure
US12207446B2 (en) * 2022-08-02 2025-01-21 International Business Machines Corporation Adjustable retention device for heat sink assembly
US12471221B2 (en) * 2022-10-21 2025-11-11 Raytheon Company Clamping device with pivoting retainer

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224535A (ja) * 1993-01-22 1994-08-12 Fujitsu Ltd 電子部品の実装構造
TW441227B (en) * 1995-05-26 2001-06-16 E Tec Ag Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
JPH09293808A (ja) * 1996-04-25 1997-11-11 Fujitsu Ltd 半導体装置
JPH11150155A (ja) * 1997-11-18 1999-06-02 Matsushita Electric Ind Co Ltd 半導体装置の製造方法および当該方法に用いる回路基板保持具
JP3634159B2 (ja) * 1998-08-10 2005-03-30 富士通株式会社 プリント基板補強部品及びこれを有するシステムボード装置
JP3161423B2 (ja) * 1998-08-11 2001-04-25 日本電気株式会社 Ｌｓｉの実装構造
JP3241669B2 (ja) * 1998-11-09 2001-12-25 埼玉日本電気株式会社 Ｉｃパッケージの補強構造
JP2000269671A (ja) * 1999-03-19 2000-09-29 Toshiba Corp 電子機器
SE521646C2 (sv) * 1999-11-23 2003-11-18 Ericsson Telefon Ab L M Täckande element för modul
US6213787B1 (en) * 1999-12-16 2001-04-10 Advanced Interconnections Corporation Socket/adapter system
US6252774B1 (en) * 2000-03-28 2001-06-26 Chip Coolers, Inc. Multi-device heat sink assembly
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
US7222243B2 (en) * 2001-04-26 2007-05-22 Tyco Electronics Corporation Power delivery system for a microprocessor
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
TW511811U (en) * 2001-11-16 2002-11-21 Via Tech Inc Removable integrated circuit device
US6614659B2 (en) * 2001-12-07 2003-09-02 Delphi Technologies, Inc. De-mountable, solderless in-line lead module package with interface
US7127805B2 (en) * 2002-11-20 2006-10-31 Intel Corporation Electronic device carrier and manufacturing tape
TWI278975B (en) * 2003-03-04 2007-04-11 Siliconware Precision Industries Co Ltd Semiconductor package with heatsink
TWI265611B (en) * 2003-03-11 2006-11-01 Siliconware Precision Industries Co Ltd Semiconductor package with heatsink
TWI242862B (en) * 2003-08-21 2005-11-01 Siliconware Precision Industries Co Ltd Semiconductor package with heat sink
US6903271B2 (en) * 2003-09-30 2005-06-07 Intel Corporation Electronic assembly with thermally separated support
US7575955B2 (en) * 2004-01-06 2009-08-18 Ismat Corporation Method for making electronic packages
US7119433B2 (en) * 2004-06-16 2006-10-10 International Business Machines Corporation Packaging for enhanced thermal and structural performance of electronic chip modules

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101887873A (zh) * 2009-05-14 2010-11-17 汤姆逊许可公司 一种散热器安装结构及方法
CN102845143A (zh) * 2009-08-18 2012-12-26 惠普发展公司，有限责任合伙企业 装置安装系统和方法
CN102845143B (zh) * 2009-08-18 2015-05-20 惠普发展公司，有限责任合伙企业 装置安装系统和方法
CN104216477A (zh) * 2013-05-29 2014-12-17 英业达科技有限公司 固定组件
CN107613715A (zh) * 2017-10-20 2018-01-19 上海兴源东安电气设备制造有限公司 一种机柜或开关柜的框架
CN111384010A (zh) * 2018-12-26 2020-07-07 台湾积体电路制造股份有限公司 集成电路器件及其形成方法
CN111384043A (zh) * 2018-12-26 2020-07-07 台湾积体电路制造股份有限公司 半导体器件及其形成方法
US11183487B2 (en) 2018-12-26 2021-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
CN111384010B (zh) * 2018-12-26 2021-12-14 台湾积体电路制造股份有限公司 集成电路器件及其形成方法
CN111384043B (zh) * 2018-12-26 2022-05-17 台湾积体电路制造股份有限公司 半导体器件及其形成方法
US11538735B2 (en) 2018-12-26 2022-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming integrated circuit packages with mechanical braces
US12300571B2 (en) 2018-12-26 2025-05-13 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
CN110662354A (zh) * 2019-09-16 2020-01-07 苏州华智诚精工科技有限公司 Pcb板正反加工定位载具

Also Published As

Publication number Publication date
JP2006216944A (ja) 2006-08-17
US7170165B2 (en) 2007-01-30
US20060171129A1 (en) 2006-08-03

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