JP2008010615A5 - - Google Patents
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- Publication number
- JP2008010615A5 JP2008010615A5 JP2006179143A JP2006179143A JP2008010615A5 JP 2008010615 A5 JP2008010615 A5 JP 2008010615A5 JP 2006179143 A JP2006179143 A JP 2006179143A JP 2006179143 A JP2006179143 A JP 2006179143A JP 2008010615 A5 JP2008010615 A5 JP 2008010615A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- semiconductor chip
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006179143A JP4779826B2 (ja) | 2006-06-29 | 2006-06-29 | フレキシブルプリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006179143A JP4779826B2 (ja) | 2006-06-29 | 2006-06-29 | フレキシブルプリント基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008010615A JP2008010615A (ja) | 2008-01-17 |
| JP2008010615A5 true JP2008010615A5 (enExample) | 2008-11-27 |
| JP4779826B2 JP4779826B2 (ja) | 2011-09-28 |
Family
ID=39068567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006179143A Expired - Fee Related JP4779826B2 (ja) | 2006-06-29 | 2006-06-29 | フレキシブルプリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4779826B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5238274B2 (ja) * | 2008-01-31 | 2013-07-17 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| JP2009182228A (ja) | 2008-01-31 | 2009-08-13 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
| KR101473477B1 (ko) | 2008-07-24 | 2014-12-16 | 한국단자공업 주식회사 | 인쇄회로 기판의 모듈 실장 구조 |
| JP5845792B2 (ja) * | 2011-10-07 | 2016-01-20 | 株式会社村田製作所 | 電子部品 |
| KR102550170B1 (ko) * | 2018-01-04 | 2023-07-03 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 카메라 모듈 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2844085B2 (ja) * | 1989-07-20 | 1999-01-06 | セイコーインスツルメンツ株式会社 | 回路基板及び半導体素子の実装方法 |
| JPH11103137A (ja) * | 1997-09-29 | 1999-04-13 | Canon Inc | フレキシブルプリント回路基板および格子状に配列された複数の接続端子を有する電子部品を実装したプリント配線基板 |
| JP2001119107A (ja) * | 1999-10-19 | 2001-04-27 | Nec Saitama Ltd | プリント配線板 |
| JP2001326428A (ja) * | 2000-05-17 | 2001-11-22 | Pioneer Electronic Corp | プリント基板 |
| JP2005011867A (ja) * | 2003-06-17 | 2005-01-13 | Sankyo Seiki Mfg Co Ltd | 回路基板および光ピックアップ装置 |
| JP2005322844A (ja) * | 2004-05-11 | 2005-11-17 | Sony Corp | 回路基板及び半導体装置 |
-
2006
- 2006-06-29 JP JP2006179143A patent/JP4779826B2/ja not_active Expired - Fee Related
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