JP2009532912A5 - - Google Patents

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Publication number
JP2009532912A5
JP2009532912A5 JP2009504367A JP2009504367A JP2009532912A5 JP 2009532912 A5 JP2009532912 A5 JP 2009532912A5 JP 2009504367 A JP2009504367 A JP 2009504367A JP 2009504367 A JP2009504367 A JP 2009504367A JP 2009532912 A5 JP2009532912 A5 JP 2009532912A5
Authority
JP
Japan
Prior art keywords
heat dissipation
pad
die
mold structure
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009504367A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009532912A (ja
Filing date
Publication date
Priority claimed from US11/398,944 external-priority patent/US7772036B2/en
Application filed filed Critical
Publication of JP2009532912A publication Critical patent/JP2009532912A/ja
Publication of JP2009532912A5 publication Critical patent/JP2009532912A5/ja
Pending legal-status Critical Current

Links

JP2009504367A 2006-04-06 2007-03-12 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージ Pending JP2009532912A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/398,944 US7772036B2 (en) 2006-04-06 2006-04-06 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
PCT/US2007/063777 WO2007117819A2 (en) 2006-04-06 2007-03-12 Molded semiconductor package with integrated through hole heat spreader pin(s)

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013164657A Division JP2014013908A (ja) 2006-04-06 2013-08-08 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2009532912A JP2009532912A (ja) 2009-09-10
JP2009532912A5 true JP2009532912A5 (enExample) 2010-03-11

Family

ID=38575814

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009504367A Pending JP2009532912A (ja) 2006-04-06 2007-03-12 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージ
JP2013164657A Pending JP2014013908A (ja) 2006-04-06 2013-08-08 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013164657A Pending JP2014013908A (ja) 2006-04-06 2013-08-08 一体型スルーホール熱放散ピンを有するモールドされた半導体パッケージおよびその製造方法

Country Status (6)

Country Link
US (2) US7772036B2 (enExample)
EP (1) EP2005470B1 (enExample)
JP (2) JP2009532912A (enExample)
KR (1) KR101388328B1 (enExample)
CN (1) CN101416305B (enExample)
WO (1) WO2007117819A2 (enExample)

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US8737073B2 (en) * 2011-02-09 2014-05-27 Tsmc Solid State Lighting Ltd. Systems and methods providing thermal spreading for an LED module
US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
CN104900623B (zh) 2014-03-06 2018-11-30 恩智浦美国有限公司 露出管芯的功率半导体装置
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US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US11336167B1 (en) 2016-04-05 2022-05-17 Vicor Corporation Delivering power to semiconductor loads
US10785871B1 (en) 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US9892999B2 (en) 2016-06-07 2018-02-13 Globalfoundries Inc. Producing wafer level packaging using leadframe strip and related device
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