JP2008166803A5 - - Google Patents

Download PDF

Info

Publication number
JP2008166803A5
JP2008166803A5 JP2007337022A JP2007337022A JP2008166803A5 JP 2008166803 A5 JP2008166803 A5 JP 2008166803A5 JP 2007337022 A JP2007337022 A JP 2007337022A JP 2007337022 A JP2007337022 A JP 2007337022A JP 2008166803 A5 JP2008166803 A5 JP 2008166803A5
Authority
JP
Japan
Prior art keywords
integrated circuit
package
sealing
circuit package
dialog
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007337022A
Other languages
English (en)
Japanese (ja)
Other versions
JP5067662B2 (ja
JP2008166803A (ja
Filing date
Publication date
Priority claimed from US11/617,413 external-priority patent/US7687897B2/en
Application filed filed Critical
Publication of JP2008166803A publication Critical patent/JP2008166803A/ja
Publication of JP2008166803A5 publication Critical patent/JP2008166803A5/ja
Application granted granted Critical
Publication of JP5067662B2 publication Critical patent/JP5067662B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007337022A 2006-12-28 2007-12-27 装着可能な集積回路パッケージインパッケージシステムおよびその製造方法 Active JP5067662B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/617,413 US7687897B2 (en) 2006-12-28 2006-12-28 Mountable integrated circuit package-in-package system with adhesive spacing structures
US11/617,413 2006-12-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012108490A Division JP5757448B2 (ja) 2006-12-28 2012-05-10 装着可能な集積回路パッケージインパッケージシステム

Publications (3)

Publication Number Publication Date
JP2008166803A JP2008166803A (ja) 2008-07-17
JP2008166803A5 true JP2008166803A5 (enExample) 2011-03-31
JP5067662B2 JP5067662B2 (ja) 2012-11-07

Family

ID=39582706

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007337022A Active JP5067662B2 (ja) 2006-12-28 2007-12-27 装着可能な集積回路パッケージインパッケージシステムおよびその製造方法
JP2012108490A Active JP5757448B2 (ja) 2006-12-28 2012-05-10 装着可能な集積回路パッケージインパッケージシステム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012108490A Active JP5757448B2 (ja) 2006-12-28 2012-05-10 装着可能な集積回路パッケージインパッケージシステム

Country Status (4)

Country Link
US (1) US7687897B2 (enExample)
JP (2) JP5067662B2 (enExample)
KR (1) KR101476385B1 (enExample)
TW (1) TWI394236B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569918B2 (en) * 2006-05-01 2009-08-04 Texas Instruments Incorporated Semiconductor package-on-package system including integrated passive components
US7687897B2 (en) * 2006-12-28 2010-03-30 Stats Chippac Ltd. Mountable integrated circuit package-in-package system with adhesive spacing structures
US9466545B1 (en) * 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
US7868471B2 (en) * 2007-09-13 2011-01-11 Stats Chippac Ltd. Integrated circuit package-in-package system with leads
US8110905B2 (en) * 2007-12-17 2012-02-07 Stats Chippac Ltd. Integrated circuit packaging system with leadframe interposer and method of manufacture thereof
US7741154B2 (en) * 2008-03-26 2010-06-22 Stats Chippac Ltd. Integrated circuit package system with stacking module
US7968373B2 (en) * 2008-05-02 2011-06-28 Stats Chippac Ltd. Integrated circuit package on package system
US7977779B2 (en) * 2008-06-10 2011-07-12 Stats Chippac Ltd. Mountable integrated circuit package-in-package system
US8283209B2 (en) 2008-06-10 2012-10-09 Stats Chippac, Ltd. Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps
US8406004B2 (en) 2008-12-09 2013-03-26 Stats Chippac Ltd. Integrated circuit packaging system and method of manufacture thereof
US8390110B2 (en) * 2009-10-20 2013-03-05 Stats Chippac Ltd. Integrated circuit packaging system with cavity and method of manufacture thereof
US9147670B2 (en) 2012-02-24 2015-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Functional spacer for SIP and methods for forming the same
JP5921297B2 (ja) * 2012-04-09 2016-05-24 キヤノン株式会社 積層型半導体装置、プリント回路板及び積層型半導体装置の製造方法
CN102738094B (zh) * 2012-05-25 2015-04-29 日月光半导体制造股份有限公司 用于堆叠的半导体封装构造及其制造方法
US20140284040A1 (en) * 2013-03-22 2014-09-25 International Business Machines Corporation Heat spreading layer with high thermal conductivity
CN104752491A (zh) 2013-12-30 2015-07-01 晟碟半导体（上海）有限公司 用于半导体装置的间隔体层和半导体装置
US10418343B2 (en) 2017-12-05 2019-09-17 Infineon Technologies Ag Package-in-package structure for semiconductor devices and methods of manufacture

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111306A (en) 1993-12-06 2000-08-29 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
US5656550A (en) 1994-08-24 1997-08-12 Fujitsu Limited Method of producing a semicondutor device having a lead portion with outer connecting terminal
TW373308B (en) 1995-02-24 1999-11-01 Agere Systems Inc Thin packaging of multi-chip modules with enhanced thermal/power management
US6005778A (en) 1995-06-15 1999-12-21 Honeywell Inc. Chip stacking and capacitor mounting arrangement including spacers
US5663593A (en) 1995-10-17 1997-09-02 National Semiconductor Corporation Ball grid array package with lead frame
JP3297387B2 (ja) 1998-11-20 2002-07-02 沖電気工業株式会社 半導体装置の製造方法
JP3722209B2 (ja) 2000-09-05 2005-11-30 セイコーエプソン株式会社 半導体装置
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US6946323B1 (en) 2001-11-02 2005-09-20 Amkor Technology, Inc. Semiconductor package having one or more die stacked on a prepackaged device and method therefor
JP2003273317A (ja) * 2002-03-19 2003-09-26 Nec Electronics Corp 半導体装置及びその製造方法
US7423336B2 (en) * 2002-04-08 2008-09-09 Micron Technology, Inc. Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
US7129115B2 (en) 2002-06-19 2006-10-31 United Test & Assembly Center Limited Packaging of a microchip device
US6785137B2 (en) 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
US6965160B2 (en) 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
US6972481B2 (en) 2002-09-17 2005-12-06 Chippac, Inc. Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
US7049691B2 (en) 2002-10-08 2006-05-23 Chippac, Inc. Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package
US6861288B2 (en) 2003-01-23 2005-03-01 St Assembly Test Services, Ltd. Stacked semiconductor packages and method for the fabrication thereof
US6936929B1 (en) 2003-03-17 2005-08-30 National Semiconductor Corporation Multichip packages with exposed dice
US20040194882A1 (en) * 2003-04-07 2004-10-07 Ying-Hao Hung Method for disassembling a stacked-chip package
JP4197140B2 (ja) * 2003-06-19 2008-12-17 パナソニック株式会社 半導体装置
US7071421B2 (en) 2003-08-29 2006-07-04 Micron Technology, Inc. Stacked microfeature devices and associated methods
US6936922B1 (en) 2003-09-26 2005-08-30 Amkor Technology, Inc. Semiconductor package structure reducing warpage and manufacturing method thereof
US8970049B2 (en) * 2003-12-17 2015-03-03 Chippac, Inc. Multiple chip package module having inverted package stacked over die
JP2005209882A (ja) * 2004-01-22 2005-08-04 Renesas Technology Corp 半導体パッケージ及び半導体装置
US7629695B2 (en) * 2004-05-20 2009-12-08 Kabushiki Kaisha Toshiba Stacked electronic component and manufacturing method thereof
TWI236744B (en) * 2004-06-25 2005-07-21 Advanced Semiconductor Eng Method for manufacturing stacked multi-chip package
US7253511B2 (en) * 2004-07-13 2007-08-07 Chippac, Inc. Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
JP2006049569A (ja) * 2004-08-04 2006-02-16 Sharp Corp スタック型半導体装置パッケージおよびその製造方法
TWI250592B (en) * 2004-11-16 2006-03-01 Siliconware Precision Industries Co Ltd Multi-chip semiconductor package and fabrication method thereof
US7205656B2 (en) 2005-02-22 2007-04-17 Micron Technology, Inc. Stacked device package for peripheral and center device pad layout device
US7372141B2 (en) * 2005-03-31 2008-05-13 Stats Chippac Ltd. Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
US7435619B2 (en) * 2006-02-14 2008-10-14 Stats Chippac Ltd. Method of fabricating a 3-D package stacking system
US20080237824A1 (en) * 2006-02-17 2008-10-02 Amkor Technology, Inc. Stacked electronic component package having single-sided film spacer
US7288835B2 (en) * 2006-03-17 2007-10-30 Stats Chippac Ltd. Integrated circuit package-in-package system
US7420269B2 (en) * 2006-04-18 2008-09-02 Stats Chippac Ltd. Stacked integrated circuit package-in-package system
TWI298198B (en) * 2006-05-30 2008-06-21 Advanced Semiconductor Eng Stackable semiconductor package
TWI319618B (en) * 2006-12-18 2010-01-11 Advanced Semiconductor Eng Three dimensional package and method of making the same
US7687897B2 (en) * 2006-12-28 2010-03-30 Stats Chippac Ltd. Mountable integrated circuit package-in-package system with adhesive spacing structures

Similar Documents

Publication Publication Date Title
JP2008166803A5 (enExample)
JP2009532912A5 (enExample)
US8686556B2 (en) Wafer level applied thermal heat sink
WO2008099784A1 (ja) Ｌｅｄパッケージおよび立体回路部品の取付構造
JP2008533700A5 (enExample)
EP1938383A4 (en) INTEGRATED CIRCUIT ASSEMBLY FOR THERMAL STRAIN RELIEF USED IN A MULTI-CHIP MODULE
JP2010219210A5 (ja) 半導体装置
WO2007145778A3 (en) Mems device and method of fabricating the same
JP2010245280A5 (enExample)
JP2008193097A5 (enExample)
US20100090295A1 (en) Folded lead-frame packages for MEMS devices
JP2007048976A5 (enExample)
JP2009130104A5 (enExample)
TW200737383A (en) Substrate with built-in chip and method for manufacturing substrate with built-in chip
WO2009069308A1 (ja) 放熱構造体基板とこれを用いたモジュール及び放熱構造体基板の製造方法
JP2010110143A5 (enExample)
JP2008147669A5 (enExample)
JP2009141844A5 (enExample)
WO2008011276A3 (en) Microphone module and method for fabricating the same
WO2007074941A8 (ja) 多層プリント配線板
TW200710867A (en) Semiconductor memory card and manufacturing method thereof
TWI456713B (zh) 具有突部之可安裝的積體電路封裝件系統
JP2006324665A5 (enExample)
JP2009081358A5 (enExample)
WO2012122868A1 (zh) 微机电系统麦克风封装结构及其形成方法