GB1239634A - - Google Patents

Info

Publication number
GB1239634A
GB1239634A GB4680068A GB1239634DA GB1239634A GB 1239634 A GB1239634 A GB 1239634A GB 4680068 A GB4680068 A GB 4680068A GB 1239634D A GB1239634D A GB 1239634DA GB 1239634 A GB1239634 A GB 1239634A
Authority
GB
United Kingdom
Prior art keywords
envelope
dissipation member
bed
heat dissipation
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4680068A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1239634A publication Critical patent/GB1239634A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB4680068A 1968-10-02 1968-10-02 Expired GB1239634A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4680068 1968-10-02

Publications (1)

Publication Number Publication Date
GB1239634A true GB1239634A (enExample) 1971-07-21

Family

ID=10442647

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4680068A Expired GB1239634A (enExample) 1968-10-02 1968-10-02

Country Status (1)

Country Link
GB (1) GB1239634A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction
GB2154791A (en) * 1984-02-17 1985-09-11 Ates Componenti Elettron Packaging semiconductor devices
EP0104231A4 (en) * 1982-04-05 1985-10-30 Motorola Inc SELF-ALIGNING HEAT SPREADING ARRANGEMENT.
EP2005470A4 (en) * 2006-04-06 2010-12-22 Freescale Semiconductor Inc ROUNDED SEMICONDUCTORED SEMICONDUCTOR HOUSING WITH INTEGRATED CONTINUOUS BORE TECHNOLOGY HEAT DISTRIBUTION PEN AND CORRESPONDING MANUFACTURING METHOD
US11229130B2 (en) 2018-02-09 2022-01-18 Zte Corporation Heat-insulation device and electronic product

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0104231A4 (en) * 1982-04-05 1985-10-30 Motorola Inc SELF-ALIGNING HEAT SPREADING ARRANGEMENT.
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
GB2154791A (en) * 1984-02-17 1985-09-11 Ates Componenti Elettron Packaging semiconductor devices
EP2005470A4 (en) * 2006-04-06 2010-12-22 Freescale Semiconductor Inc ROUNDED SEMICONDUCTORED SEMICONDUCTOR HOUSING WITH INTEGRATED CONTINUOUS BORE TECHNOLOGY HEAT DISTRIBUTION PEN AND CORRESPONDING MANUFACTURING METHOD
US8659146B2 (en) 2006-04-06 2014-02-25 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
US11229130B2 (en) 2018-02-09 2022-01-18 Zte Corporation Heat-insulation device and electronic product

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees