GB2154791A - Packaging semiconductor devices - Google Patents

Packaging semiconductor devices Download PDF

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Publication number
GB2154791A
GB2154791A GB08503303A GB8503303A GB2154791A GB 2154791 A GB2154791 A GB 2154791A GB 08503303 A GB08503303 A GB 08503303A GB 8503303 A GB8503303 A GB 8503303A GB 2154791 A GB2154791 A GB 2154791A
Authority
GB
United Kingdom
Prior art keywords
package
semiconductor devices
electronic component
rod
packaging semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08503303A
Other versions
GB8503303D0 (en
Inventor
De Martiis Carlo Cognetti
Giuseppe Marchisi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of GB8503303D0 publication Critical patent/GB8503303D0/en
Publication of GB2154791A publication Critical patent/GB2154791A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A copper rod (2) is embedded in "pre-molded" package (1) and supports a silicon wafer 4, the copper rod acting to increase heat dissipation from the package. <IMAGE>

Description

SPECIFICATION Electronic integrated component for surface assembling The present invention relates to an integrated electronic component for surface assembling, particularly of the "micropackage" type.
It is known that an important problem of the known integrated electronic components, particularly of those of very little size, such as the so called "micropackages", is represented by the high thermic resistance (Rth), which hinders the satisfactory heat dissipation of the semiconductor wafer inserted in the resin package.
Object of the present invention is to realize an integrated electronic component, particu larly a "micropackage", which shows improved features of heat dissipation.
According to the invention such an object has been reached by an integrated electronic component, comprising an insulating "premolded" package provided with an inner space for receiving a semiconductor wafer which may be electrically connected to outer electric contacts, characterized in that it includes a rod of material with high thermic conductivity, particularly of copper, which is embedded in said insulating package for the support of said wafer.
It has been possible to verify that the inclusion of the copper rod (or of any other similar material) greatly reduces the thermic resistance and therefore increases the heat dissipation. Moreover, since the rod constitutes a mechanical resistance element also, it is made possible to manufacture linear components of increased length.
An embodiment of an electronic component according to the invention is illustrated for better clarity in the enclosed drawings, in which: Figure 1 shows the component in perspective view; Figure 2 shows the same component in cross-section along line Il-Il of Fig. 1.
The component shown in the drawings comprises a resin "pre-molded" package 1 in which a copper rod 2 is embedded.
In the package 1 there is defined an inner space 3, in which there is housed a semiconductor wafer 4 resting on the copper rod 2 and electrically connected through conducting wires 5 to outer electric contacts 6 bent around two opposed sides of the package 1.
A resin cover 7 closes upwards the space 3, thus protecting the wafer housed therein.

Claims (2)

1. Integrated electronic component for surface assembling, comprising an insulating "pre-molded" package (1) provided with an inner space (3) for receiving a semiconductor wafer (4) which may be electrically connected to outer electric contacts (6), characterized in that it includes a rod (2) of material with high thermic conductivity which is embedded in said insulating package (1) for the support of said wafer (4).
2. Electronic component according to claim 1, characterized in that said rod (2) is made of copper.
GB08503303A 1984-02-17 1985-02-08 Packaging semiconductor devices Withdrawn GB2154791A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8419669A IT1213140B (en) 1984-02-17 1984-02-17 INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY.

Publications (2)

Publication Number Publication Date
GB8503303D0 GB8503303D0 (en) 1985-03-13
GB2154791A true GB2154791A (en) 1985-09-11

Family

ID=11160247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08503303A Withdrawn GB2154791A (en) 1984-02-17 1985-02-08 Packaging semiconductor devices

Country Status (5)

Country Link
JP (1) JPS60233843A (en)
DE (1) DE3504949A1 (en)
FR (1) FR2559955B1 (en)
GB (1) GB2154791A (en)
IT (1) IT1213140B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292003A (en) * 1994-07-29 1996-02-07 Ibm Uk Direct chip attach
US5625226A (en) * 1994-09-19 1997-04-29 International Rectifier Corporation Surface mount package with improved heat transfer
EP0880177A2 (en) * 1997-05-20 1998-11-25 Nec Corporation Semiconductor device having lead terminals bent in J-shape

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322452A (en) * 1991-04-23 1992-11-12 Mitsubishi Electric Corp Semiconductor device housing container of semiconductor element manufacture of semicondcutor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1239634A (en) * 1968-10-02 1971-07-21
GB1289932A (en) * 1971-03-30 1972-09-20
GB1538556A (en) * 1975-03-17 1979-01-24 Nat Semiconductor Corp Encapsulated integrated circuits
GB2022317A (en) * 1978-05-31 1979-12-12 Burroughs Corp Method of forming a plastic cavity package for integrated circuit devices
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4420767A (en) * 1978-11-09 1983-12-13 Zilog, Inc. Thermally balanced leadless microelectronic circuit chip carrier
FR2488445A1 (en) * 1980-08-06 1982-02-12 Efcis PLASTIC CASE FOR INTEGRATED CIRCUITS

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1239634A (en) * 1968-10-02 1971-07-21
GB1289932A (en) * 1971-03-30 1972-09-20
GB1538556A (en) * 1975-03-17 1979-01-24 Nat Semiconductor Corp Encapsulated integrated circuits
GB2022317A (en) * 1978-05-31 1979-12-12 Burroughs Corp Method of forming a plastic cavity package for integrated circuit devices
GB2136205A (en) * 1983-03-09 1984-09-12 Printed Circuits Int Semiconductor chip carrier and contact array package and method of construction

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292003A (en) * 1994-07-29 1996-02-07 Ibm Uk Direct chip attach
US5625226A (en) * 1994-09-19 1997-04-29 International Rectifier Corporation Surface mount package with improved heat transfer
EP0880177A2 (en) * 1997-05-20 1998-11-25 Nec Corporation Semiconductor device having lead terminals bent in J-shape
EP0880177A3 (en) * 1997-05-20 1999-02-03 Nec Corporation Semiconductor device having lead terminals bent in J-shape
US6104086A (en) * 1997-05-20 2000-08-15 Nec Corporation Semiconductor device having lead terminals bent in J-shape

Also Published As

Publication number Publication date
DE3504949A1 (en) 1985-08-22
FR2559955B1 (en) 1988-01-15
IT1213140B (en) 1989-12-14
IT8419669A0 (en) 1984-02-17
JPS60233843A (en) 1985-11-20
FR2559955A1 (en) 1985-08-23
GB8503303D0 (en) 1985-03-13

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)