IT1213140B - INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY. - Google Patents

INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY.

Info

Publication number
IT1213140B
IT1213140B IT8419669A IT1966984A IT1213140B IT 1213140 B IT1213140 B IT 1213140B IT 8419669 A IT8419669 A IT 8419669A IT 1966984 A IT1966984 A IT 1966984A IT 1213140 B IT1213140 B IT 1213140B
Authority
IT
Italy
Prior art keywords
electronic component
integrated electronic
surface assembly
package
copper rod
Prior art date
Application number
IT8419669A
Other languages
Italian (it)
Other versions
IT8419669A0 (en
Inventor
Giuseppe Marchisi
Carlo Cognetti De Martiis
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT8419669A priority Critical patent/IT1213140B/en
Publication of IT8419669A0 publication Critical patent/IT8419669A0/en
Priority to GB08503303A priority patent/GB2154791A/en
Priority to DE19853504949 priority patent/DE3504949A1/en
Priority to FR8502261A priority patent/FR2559955B1/en
Priority to JP60026633A priority patent/JPS60233843A/en
Application granted granted Critical
Publication of IT1213140B publication Critical patent/IT1213140B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A copper rod (2) is embedded in "pre-molded" package (1) and supports a silicon wafer 4, the copper rod acting to increase heat dissipation from the package. <IMAGE>
IT8419669A 1984-02-17 1984-02-17 INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY. IT1213140B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8419669A IT1213140B (en) 1984-02-17 1984-02-17 INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY.
GB08503303A GB2154791A (en) 1984-02-17 1985-02-08 Packaging semiconductor devices
DE19853504949 DE3504949A1 (en) 1984-02-17 1985-02-13 INTEGRATED ELECTRONIC COMPONENT FOR THE SURFACE STRUCTURE
FR8502261A FR2559955B1 (en) 1984-02-17 1985-02-15 HOUSING FOR INTEGRATED ELECTRONIC COMPONENT BY SURFACE ASSEMBLY INCLUDING INTEGRATED THERMAL DISSIPATION MEANS
JP60026633A JPS60233843A (en) 1984-02-17 1985-02-15 Outer surface structure of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8419669A IT1213140B (en) 1984-02-17 1984-02-17 INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY.

Publications (2)

Publication Number Publication Date
IT8419669A0 IT8419669A0 (en) 1984-02-17
IT1213140B true IT1213140B (en) 1989-12-14

Family

ID=11160247

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8419669A IT1213140B (en) 1984-02-17 1984-02-17 INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY.

Country Status (5)

Country Link
JP (1) JPS60233843A (en)
DE (1) DE3504949A1 (en)
FR (1) FR2559955B1 (en)
GB (1) GB2154791A (en)
IT (1) IT1213140B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322452A (en) * 1991-04-23 1992-11-12 Mitsubishi Electric Corp Semiconductor device housing container of semiconductor element manufacture of semicondcutor device
GB2292003A (en) * 1994-07-29 1996-02-07 Ibm Uk Direct chip attach
US5625226A (en) * 1994-09-19 1997-04-29 International Rectifier Corporation Surface mount package with improved heat transfer
JP2924854B2 (en) * 1997-05-20 1999-07-26 日本電気株式会社 Semiconductor device and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1239634A (en) * 1968-10-02 1971-07-21
GB1289932A (en) * 1971-03-30 1972-09-20
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
GB2022317A (en) * 1978-05-31 1979-12-12 Burroughs Corp Method of forming a plastic cavity package for integrated circuit devices
US4420767A (en) * 1978-11-09 1983-12-13 Zilog, Inc. Thermally balanced leadless microelectronic circuit chip carrier
FR2488445A1 (en) * 1980-08-06 1982-02-12 Efcis PLASTIC CASE FOR INTEGRATED CIRCUITS
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Also Published As

Publication number Publication date
FR2559955B1 (en) 1988-01-15
GB2154791A (en) 1985-09-11
JPS60233843A (en) 1985-11-20
DE3504949A1 (en) 1985-08-22
IT8419669A0 (en) 1984-02-17
FR2559955A1 (en) 1985-08-23
GB8503303D0 (en) 1985-03-13

Similar Documents

Publication Publication Date Title
US5525428B1 (en) Substrate for semiconductor apparatus
DE3471205D1 (en) Semiconductor power module
IT1201836B (en) SEMICONDUCTOR DEVICE MOUNTED IN A HIGHLY FLEXIBLE SEGMENTED CONTAINER AND PROVIDED WITH A THERMAL DISSIPATOR
EP0468379A3 (en) Semiconductor device having a package
AU5819590A (en) Improved thermal performance package for integrated circuit chip
DE69124735D1 (en) Integrated semiconductor circuit
DE3676836D1 (en) COOLING ARRANGEMENT FOR INTEGRATED CIRCUIT CHIP.
DE3481795D1 (en) COOLING ARRANGEMENT FOR SEMICONDUCTOR CHIPS.
KR900008635A (en) Anti-fog device for semiconductor wafers
DE69224314D1 (en) Integrated heat sink for semiconductor modules
GB9017779D0 (en) Semiconductor integrated circuit chip having an identification circuit therein
DE69130819D1 (en) Integrated semiconductor circuit
DE69231409D1 (en) Surface mount semiconductor package
DE69012194D1 (en) Integrated semiconductor circuit.
EP0432790A3 (en) Data output buffer circuit for semiconductor integrated circuit
DE58903159D1 (en) DEVICE FOR HEAT TRANSFER.
DE69011038D1 (en) Integrated semiconductor circuit.
GB2239560B (en) Compound semiconductor integrated circuit device
KR900015299A (en) Semiconductor device and heat sink fin
DE69031671D1 (en) Integrated semiconductor circuit
IT1213140B (en) INTEGRATED ELECTRONIC COMPONENT FOR SURFACE ASSEMBLY.
DE69222084D1 (en) Surface mount semiconductor package
IT8224680A0 (en) PROCEDURE FOR MANUFACTURING SEMICONDUCTOR DEVICES AND SEMI-CONDUCTOR DEVICES SO OBTAINED.
DE69026226D1 (en) Integrated semiconductor circuit
DE3584102D1 (en) INTEGRATED SEMICONDUCTOR CIRCUIT DEVICE.

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970227