GB1302827A - - Google Patents

Info

Publication number
GB1302827A
GB1302827A GB2331171*A GB2331171A GB1302827A GB 1302827 A GB1302827 A GB 1302827A GB 2331171 A GB2331171 A GB 2331171A GB 1302827 A GB1302827 A GB 1302827A
Authority
GB
United Kingdom
Prior art keywords
passage
film
copper
seals
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2331171*A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1302827A publication Critical patent/GB1302827A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Microwave Amplifiers (AREA)
GB2331171*A 1970-06-11 1971-04-19 Expired GB1302827A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4543470A 1970-06-11 1970-06-11

Publications (1)

Publication Number Publication Date
GB1302827A true GB1302827A (enExample) 1973-01-10

Family

ID=21937850

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2331171*A Expired GB1302827A (enExample) 1970-06-11 1971-04-19

Country Status (10)

Country Link
US (1) US3611059A (enExample)
JP (1) JPS5135109B1 (enExample)
BE (1) BE763416A (enExample)
CA (1) CA920718A (enExample)
DE (1) DE2111098A1 (enExample)
FR (1) FR2094178B1 (enExample)
GB (1) GB1302827A (enExample)
MY (1) MY7400059A (enExample)
NL (1) NL7101751A (enExample)
SE (1) SE377631B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111554463A (zh) * 2020-05-11 2020-08-18 电子科技大学 一种宽频低涡流损耗的人工导体

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767979A (en) * 1971-03-05 1973-10-23 Communications Transistor Corp Microwave hermetic transistor package
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3828228A (en) * 1973-03-05 1974-08-06 Hewlett Packard Co Microwave transistor package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
US6818477B2 (en) * 2001-11-26 2004-11-16 Powerwave Technologies, Inc. Method of mounting a component in an edge-plated hole formed in a printed circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2791731A (en) * 1957-05-07 Metal rectifier assemblies
NL179929C (enExample) * 1952-11-03 1900-01-01 Du Pont
US2984890A (en) * 1956-12-24 1961-05-23 Gahagan Inc Crystal diode rectifier and method of making same
NL234330A (enExample) * 1957-12-18
US2987658A (en) * 1958-01-10 1961-06-06 Philco Corp Improved semiconductor diode
US3266137A (en) * 1962-06-07 1966-08-16 Hughes Aircraft Co Metal ball connection to crystals
JPS5115155B2 (enExample) * 1972-06-08 1976-05-14

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111554463A (zh) * 2020-05-11 2020-08-18 电子科技大学 一种宽频低涡流损耗的人工导体
CN111554463B (zh) * 2020-05-11 2021-09-24 电子科技大学 一种宽频低涡流损耗的人工导体

Also Published As

Publication number Publication date
NL7101751A (enExample) 1971-12-14
US3611059A (en) 1971-10-05
JPS5135109B1 (enExample) 1976-09-30
FR2094178B1 (enExample) 1977-01-28
BE763416A (fr) 1971-07-16
CA920718A (en) 1973-02-06
DE2111098A1 (de) 1971-12-16
MY7400059A (en) 1974-12-31
FR2094178A1 (enExample) 1972-02-04
SE377631B (enExample) 1975-07-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee