MY7400059A - Transistor assembly - Google Patents

Transistor assembly

Info

Publication number
MY7400059A
MY7400059A MY59/74A MY7400059A MY7400059A MY 7400059 A MY7400059 A MY 7400059A MY 59/74 A MY59/74 A MY 59/74A MY 7400059 A MY7400059 A MY 7400059A MY 7400059 A MY7400059 A MY 7400059A
Authority
MY
Malaysia
Prior art keywords
transistor assembly
transistor
assembly
Prior art date
Application number
MY59/74A
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of MY7400059A publication Critical patent/MY7400059A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
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    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Microwave Amplifiers (AREA)
MY59/74A 1970-06-11 1974-12-30 Transistor assembly MY7400059A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4543470A 1970-06-11 1970-06-11

Publications (1)

Publication Number Publication Date
MY7400059A true MY7400059A (en) 1974-12-31

Family

ID=21937850

Family Applications (1)

Application Number Title Priority Date Filing Date
MY59/74A MY7400059A (en) 1970-06-11 1974-12-30 Transistor assembly

Country Status (10)

Country Link
US (1) US3611059A (en)
JP (1) JPS5135109B1 (en)
BE (1) BE763416A (en)
CA (1) CA920718A (en)
DE (1) DE2111098A1 (en)
FR (1) FR2094178B1 (en)
GB (1) GB1302827A (en)
MY (1) MY7400059A (en)
NL (1) NL7101751A (en)
SE (1) SE377631B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767979A (en) * 1971-03-05 1973-10-23 Communications Transistor Corp Microwave hermetic transistor package
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3828228A (en) * 1973-03-05 1974-08-06 Hewlett Packard Co Microwave transistor package
JPS5834755Y2 (en) * 1978-09-18 1983-08-04 富士通株式会社 semiconductor equipment
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
US6818477B2 (en) * 2001-11-26 2004-11-16 Powerwave Technologies, Inc. Method of mounting a component in an edge-plated hole formed in a printed circuit board
CN111554463B (en) * 2020-05-11 2021-09-24 电子科技大学 Artificial conductor with broadband and low eddy current loss

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2791731A (en) * 1957-05-07 Metal rectifier assemblies
NL179929C (en) * 1952-11-03 1900-01-01 Du Pont
US2984890A (en) * 1956-12-24 1961-05-23 Gahagan Inc Crystal diode rectifier and method of making same
NL234330A (en) * 1957-12-18
US2987658A (en) * 1958-01-10 1961-06-06 Philco Corp Improved semiconductor diode
US3266137A (en) * 1962-06-07 1966-08-16 Hughes Aircraft Co Metal ball connection to crystals
JPS5115155B2 (en) * 1972-06-08 1976-05-14

Also Published As

Publication number Publication date
JPS5135109B1 (en) 1976-09-30
NL7101751A (en) 1971-12-14
FR2094178B1 (en) 1977-01-28
US3611059A (en) 1971-10-05
SE377631B (en) 1975-07-14
GB1302827A (en) 1973-01-10
CA920718A (en) 1973-02-06
BE763416A (en) 1971-07-16
FR2094178A1 (en) 1972-02-04
DE2111098A1 (en) 1971-12-16

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