JP2008294380A5 - - Google Patents

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Publication number
JP2008294380A5
JP2008294380A5 JP2007141161A JP2007141161A JP2008294380A5 JP 2008294380 A5 JP2008294380 A5 JP 2008294380A5 JP 2007141161 A JP2007141161 A JP 2007141161A JP 2007141161 A JP2007141161 A JP 2007141161A JP 2008294380 A5 JP2008294380 A5 JP 2008294380A5
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JP
Japan
Prior art keywords
built
substrate
layer
thermal expansion
expansion coefficient
Prior art date
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Application number
JP2007141161A
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English (en)
Japanese (ja)
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JP5059486B2 (ja
JP2008294380A (ja
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Priority to JP2007141161A priority Critical patent/JP5059486B2/ja
Priority claimed from JP2007141161A external-priority patent/JP5059486B2/ja
Publication of JP2008294380A publication Critical patent/JP2008294380A/ja
Publication of JP2008294380A5 publication Critical patent/JP2008294380A5/ja
Application granted granted Critical
Publication of JP5059486B2 publication Critical patent/JP5059486B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007141161A 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法 Expired - Fee Related JP5059486B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007141161A JP5059486B2 (ja) 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007141161A JP5059486B2 (ja) 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2008294380A JP2008294380A (ja) 2008-12-04
JP2008294380A5 true JP2008294380A5 (enExample) 2010-04-15
JP5059486B2 JP5059486B2 (ja) 2012-10-24

Family

ID=40168763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007141161A Expired - Fee Related JP5059486B2 (ja) 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法

Country Status (1)

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JP (1) JP5059486B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012056879A1 (ja) * 2010-10-26 2012-05-03 株式会社村田製作所 モジュール基板及びモジュール基板の製造方法
JP2016219638A (ja) * 2015-05-22 2016-12-22 日東電工株式会社 電子部品内蔵基板用封止樹脂シート及び電子部品内蔵基板の製造方法
EP3890460A1 (en) * 2015-09-28 2021-10-06 Tactotek Oy Multilayer structure and related method of manufacture for electronics
JP2019090721A (ja) * 2017-11-15 2019-06-13 ミネベアミツミ株式会社 ひずみゲージ
CN114521044B (zh) * 2020-11-20 2024-06-28 深南电路股份有限公司 电路板及其电器装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06139817A (ja) * 1992-10-20 1994-05-20 Sumitomo Bakelite Co Ltd 導電性銀ペースト組成物
JP3547423B2 (ja) * 2000-12-27 2004-07-28 松下電器産業株式会社 部品内蔵モジュール及びその製造方法
JP2005191156A (ja) * 2003-12-25 2005-07-14 Mitsubishi Electric Corp 電気部品内蔵配線板およびその製造方法
JP4417294B2 (ja) * 2005-06-16 2010-02-17 パナソニック株式会社 プローブカード用部品内蔵基板とその製造方法

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