JP5059486B2 - 部品内蔵モジュールの製造方法 - Google Patents

部品内蔵モジュールの製造方法 Download PDF

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Publication number
JP5059486B2
JP5059486B2 JP2007141161A JP2007141161A JP5059486B2 JP 5059486 B2 JP5059486 B2 JP 5059486B2 JP 2007141161 A JP2007141161 A JP 2007141161A JP 2007141161 A JP2007141161 A JP 2007141161A JP 5059486 B2 JP5059486 B2 JP 5059486B2
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JP
Japan
Prior art keywords
built
layer
thermal expansion
expansion coefficient
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007141161A
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English (en)
Japanese (ja)
Other versions
JP2008294380A (ja
JP2008294380A5 (enExample
Inventor
俊之 小島
幸宏 石丸
力也 沖本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2007141161A priority Critical patent/JP5059486B2/ja
Publication of JP2008294380A publication Critical patent/JP2008294380A/ja
Publication of JP2008294380A5 publication Critical patent/JP2008294380A5/ja
Application granted granted Critical
Publication of JP5059486B2 publication Critical patent/JP5059486B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2007141161A 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法 Expired - Fee Related JP5059486B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007141161A JP5059486B2 (ja) 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007141161A JP5059486B2 (ja) 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2008294380A JP2008294380A (ja) 2008-12-04
JP2008294380A5 JP2008294380A5 (enExample) 2010-04-15
JP5059486B2 true JP5059486B2 (ja) 2012-10-24

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ID=40168763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007141161A Expired - Fee Related JP5059486B2 (ja) 2007-05-28 2007-05-28 部品内蔵モジュールの製造方法

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JP (1) JP5059486B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012056879A1 (ja) * 2010-10-26 2012-05-03 株式会社村田製作所 モジュール基板及びモジュール基板の製造方法
JP2016219638A (ja) * 2015-05-22 2016-12-22 日東電工株式会社 電子部品内蔵基板用封止樹脂シート及び電子部品内蔵基板の製造方法
EP3890460A1 (en) * 2015-09-28 2021-10-06 Tactotek Oy Multilayer structure and related method of manufacture for electronics
JP2019090721A (ja) * 2017-11-15 2019-06-13 ミネベアミツミ株式会社 ひずみゲージ
CN114521044B (zh) * 2020-11-20 2024-06-28 深南电路股份有限公司 电路板及其电器装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06139817A (ja) * 1992-10-20 1994-05-20 Sumitomo Bakelite Co Ltd 導電性銀ペースト組成物
JP3547423B2 (ja) * 2000-12-27 2004-07-28 松下電器産業株式会社 部品内蔵モジュール及びその製造方法
JP2005191156A (ja) * 2003-12-25 2005-07-14 Mitsubishi Electric Corp 電気部品内蔵配線板およびその製造方法
JP4417294B2 (ja) * 2005-06-16 2010-02-17 パナソニック株式会社 プローブカード用部品内蔵基板とその製造方法

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Publication number Publication date
JP2008294380A (ja) 2008-12-04

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