JP2009016634A5 - - Google Patents

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Publication number
JP2009016634A5
JP2009016634A5 JP2007177958A JP2007177958A JP2009016634A5 JP 2009016634 A5 JP2009016634 A5 JP 2009016634A5 JP 2007177958 A JP2007177958 A JP 2007177958A JP 2007177958 A JP2007177958 A JP 2007177958A JP 2009016634 A5 JP2009016634 A5 JP 2009016634A5
Authority
JP
Japan
Prior art keywords
semiconductor package
substrate
pins
mounting structure
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007177958A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009016634A (ja
JP4892425B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007177958A priority Critical patent/JP4892425B2/ja
Priority claimed from JP2007177958A external-priority patent/JP4892425B2/ja
Publication of JP2009016634A publication Critical patent/JP2009016634A/ja
Publication of JP2009016634A5 publication Critical patent/JP2009016634A5/ja
Application granted granted Critical
Publication of JP4892425B2 publication Critical patent/JP4892425B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007177958A 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ Expired - Fee Related JP4892425B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007177958A JP4892425B2 (ja) 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007177958A JP4892425B2 (ja) 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011108068A Division JP5242736B2 (ja) 2011-05-13 2011-05-13 半導体パッケージの実装構造

Publications (3)

Publication Number Publication Date
JP2009016634A JP2009016634A (ja) 2009-01-22
JP2009016634A5 true JP2009016634A5 (enExample) 2010-05-13
JP4892425B2 JP4892425B2 (ja) 2012-03-07

Family

ID=40357169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007177958A Expired - Fee Related JP4892425B2 (ja) 2007-07-06 2007-07-06 半導体パッケージの実装構造および半導体パッケージ

Country Status (1)

Country Link
JP (1) JP4892425B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5383225B2 (ja) 2008-02-06 2014-01-08 富士フイルム株式会社 インク組成物、インクジェット記録方法、および印刷物
JP6064440B2 (ja) * 2012-08-27 2017-01-25 富士通株式会社 電子装置、電子装置の製造方法、および電子部品の単体試験方法
CN109148421B (zh) * 2018-08-31 2020-04-28 成都天箭科技股份有限公司 一种微波单片集成电路接地结构及其安装工艺
US10510713B1 (en) * 2018-10-28 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semicondcutor package and method of manufacturing the same
CN116364660B (zh) * 2023-05-24 2023-11-28 浙江常淳科技有限公司 一种集成电路封装定位装置及定位方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317548A (ja) * 1986-07-09 1988-01-25 Fujitsu Ltd 半導体パツケ−ジ及びその製造方法
JP2646331B2 (ja) * 1993-09-24 1997-08-27 オーガット インコーポレイテッド リードピンキャリア
JPH08271578A (ja) * 1995-03-30 1996-10-18 Toshiba Corp 半導体装置のテストソケット
JPH11185915A (ja) * 1997-12-22 1999-07-09 Toyo Commun Equip Co Ltd エリアアレイパッケージ用ソケット
JP4384316B2 (ja) * 1999-12-06 2009-12-16 イビデン株式会社 電子部品モジュール
JP2003123922A (ja) * 2001-10-11 2003-04-25 Sony Corp 半導体装置とソケットまたは実装基板との接続構造

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