JP2012502453A5 - - Google Patents

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Publication number
JP2012502453A5
JP2012502453A5 JP2011525401A JP2011525401A JP2012502453A5 JP 2012502453 A5 JP2012502453 A5 JP 2012502453A5 JP 2011525401 A JP2011525401 A JP 2011525401A JP 2011525401 A JP2011525401 A JP 2011525401A JP 2012502453 A5 JP2012502453 A5 JP 2012502453A5
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JP
Japan
Prior art keywords
connection
optoelectronic
cooling body
optoelectronic device
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011525401A
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English (en)
Japanese (ja)
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JP2012502453A (ja
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Publication date
Priority claimed from DE102008045925A external-priority patent/DE102008045925A1/de
Application filed filed Critical
Publication of JP2012502453A publication Critical patent/JP2012502453A/ja
Publication of JP2012502453A5 publication Critical patent/JP2012502453A5/ja
Pending legal-status Critical Current

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JP2011525401A 2008-09-04 2009-08-20 オプトエレクトロニクス素子およびオプトエレクトロニクス素子の製造方法 Pending JP2012502453A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008045925A DE102008045925A1 (de) 2008-09-04 2008-09-04 Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
DE102008045925.9 2008-09-04
PCT/DE2009/001183 WO2010025701A1 (de) 2008-09-04 2009-08-20 Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils

Publications (2)

Publication Number Publication Date
JP2012502453A JP2012502453A (ja) 2012-01-26
JP2012502453A5 true JP2012502453A5 (enExample) 2012-09-20

Family

ID=41650706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011525401A Pending JP2012502453A (ja) 2008-09-04 2009-08-20 オプトエレクトロニクス素子およびオプトエレクトロニクス素子の製造方法

Country Status (8)

Country Link
US (1) US8502252B2 (enExample)
EP (1) EP2327110B9 (enExample)
JP (1) JP2012502453A (enExample)
KR (1) KR101658682B1 (enExample)
CN (1) CN102144305B (enExample)
DE (1) DE102008045925A1 (enExample)
TW (1) TWI446516B (enExample)
WO (1) WO2010025701A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20106001A0 (fi) * 2010-09-28 2010-09-28 Kruunutekniikka Oy Menetelmä sähköisen toimilaitteen valmistukseen
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
DE102014209345A1 (de) * 2014-05-16 2015-11-19 Robert Bosch Gmbh Optikträger, Verfahren zur Herstellung eines Optikträgers, Vorrichtung zur Herstellung eines Optikträgers und Radarmodul
DE102015105692A1 (de) * 2015-04-14 2016-10-20 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung einer Mehrzahl von Halbleiterbauelementen
JP6459949B2 (ja) * 2015-12-21 2019-01-30 日亜化学工業株式会社 発光装置
CN106972093B (zh) * 2016-01-13 2019-01-08 光宝光电(常州)有限公司 发光二极管封装结构
DE102020206897A1 (de) * 2020-06-03 2021-12-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN216450652U (zh) * 2021-03-31 2022-05-06 光宝科技股份有限公司 光电封装结构与光电开关

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0432709Y2 (enExample) * 1987-12-11 1992-08-06
US5748658A (en) * 1993-10-22 1998-05-05 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and optical pickup head
EP2267798B1 (de) * 1997-07-29 2015-09-30 OSRAM Opto Semiconductors GmbH Optoelektronisches Bauelement
US6335548B1 (en) 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6274924B1 (en) * 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
DE10033502A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
DE10117889A1 (de) * 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
US6936855B1 (en) * 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
US7429757B2 (en) 2002-06-19 2008-09-30 Sanken Electric Co., Ltd. Semiconductor light emitting device capable of increasing its brightness
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
JP3910144B2 (ja) * 2003-01-06 2007-04-25 シャープ株式会社 半導体発光装置およびその製造方法
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
US7173951B2 (en) * 2003-03-25 2007-02-06 Sharp Kabushiki Kaisha Semiconductor laser device with light receiving element
JP2004342870A (ja) * 2003-05-16 2004-12-02 Stanley Electric Co Ltd 大電流駆動用発光ダイオード
WO2004107461A1 (en) * 2003-05-28 2004-12-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
TWI241042B (en) * 2004-03-11 2005-10-01 Chen-Lun Hsingchen A low thermal resistance LED device
DE102004021870A1 (de) 2004-05-04 2005-12-01 Lite-On Technology Corporation Optohalbleiterkomponente
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US7855395B2 (en) * 2004-09-10 2010-12-21 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins on a light emitting diode die
KR100678848B1 (ko) * 2004-10-07 2007-02-06 서울반도체 주식회사 힛트 싱크를 갖는 발광다이오드 패키지 및 그 제조방법
TWI277223B (en) * 2004-11-03 2007-03-21 Chen-Lun Hsingchen A low thermal resistance LED package
JP2006179541A (ja) * 2004-12-21 2006-07-06 Enomoto Co Ltd パワーｌｅｄ用リードフレーム及びその製造方法
TWI248219B (en) * 2005-02-18 2006-01-21 Au Optronics Corp LED module
US8076680B2 (en) * 2005-03-11 2011-12-13 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
KR100616684B1 (ko) * 2005-06-03 2006-08-28 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
JP4369409B2 (ja) * 2005-09-27 2009-11-18 日本ライツ株式会社 光源装置
JP2007095797A (ja) 2005-09-27 2007-04-12 Nippon Leiz Co Ltd 光源装置
DE102006004397A1 (de) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR101055772B1 (ko) * 2005-12-15 2011-08-11 서울반도체 주식회사 발광장치
US7960819B2 (en) * 2006-07-13 2011-06-14 Cree, Inc. Leadframe-based packages for solid state emitting devices
CN101523620B (zh) * 2006-09-29 2012-06-06 罗姆股份有限公司 半导体发光装置
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
JP5071069B2 (ja) * 2006-12-01 2012-11-14 日亜化学工業株式会社 発光装置
TWI367573B (en) * 2007-01-31 2012-07-01 Young Lighting Technology Inc Light emitting diode package and manufacturing method thereof
JP4408931B2 (ja) * 2007-12-26 2010-02-03 シャープ株式会社 半導体発光装置

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