CN102144305B - 光电子部件和制造光电子部件的方法 - Google Patents

光电子部件和制造光电子部件的方法 Download PDF

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Publication number
CN102144305B
CN102144305B CN200980134522.8A CN200980134522A CN102144305B CN 102144305 B CN102144305 B CN 102144305B CN 200980134522 A CN200980134522 A CN 200980134522A CN 102144305 B CN102144305 B CN 102144305B
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Prior art keywords
housing body
optoelectronic component
heat sink
connection
optoelectronic
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Chinese (zh)
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CN102144305A (zh
Inventor
斯特凡·格勒奇
托马斯·蔡勒
迈克尔·齐茨尔斯佩格
哈拉尔德·雅格
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200980134522.8A 2008-09-04 2009-08-20 光电子部件和制造光电子部件的方法 Active CN102144305B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008045925A DE102008045925A1 (de) 2008-09-04 2008-09-04 Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
DE102008045925.9 2008-09-04
PCT/DE2009/001183 WO2010025701A1 (de) 2008-09-04 2009-08-20 Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils

Publications (2)

Publication Number Publication Date
CN102144305A CN102144305A (zh) 2011-08-03
CN102144305B true CN102144305B (zh) 2014-01-08

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CN200980134522.8A Active CN102144305B (zh) 2008-09-04 2009-08-20 光电子部件和制造光电子部件的方法

Country Status (8)

Country Link
US (1) US8502252B2 (enExample)
EP (1) EP2327110B9 (enExample)
JP (1) JP2012502453A (enExample)
KR (1) KR101658682B1 (enExample)
CN (1) CN102144305B (enExample)
DE (1) DE102008045925A1 (enExample)
TW (1) TWI446516B (enExample)
WO (1) WO2010025701A1 (enExample)

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FI20106001A0 (fi) * 2010-09-28 2010-09-28 Kruunutekniikka Oy Menetelmä sähköisen toimilaitteen valmistukseen
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer
DE102014209345A1 (de) * 2014-05-16 2015-11-19 Robert Bosch Gmbh Optikträger, Verfahren zur Herstellung eines Optikträgers, Vorrichtung zur Herstellung eines Optikträgers und Radarmodul
DE102015105692A1 (de) * 2015-04-14 2016-10-20 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung einer Mehrzahl von Halbleiterbauelementen
JP6459949B2 (ja) * 2015-12-21 2019-01-30 日亜化学工業株式会社 発光装置
CN106972093B (zh) * 2016-01-13 2019-01-08 光宝光电(常州)有限公司 发光二极管封装结构
DE102020206897A1 (de) * 2020-06-03 2021-12-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN216450652U (zh) * 2021-03-31 2022-05-06 光宝科技股份有限公司 光电封装结构与光电开关

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Also Published As

Publication number Publication date
EP2327110B9 (de) 2019-05-15
EP2327110B1 (de) 2018-12-26
WO2010025701A1 (de) 2010-03-11
CN102144305A (zh) 2011-08-03
TWI446516B (zh) 2014-07-21
US8502252B2 (en) 2013-08-06
US20120112337A1 (en) 2012-05-10
JP2012502453A (ja) 2012-01-26
DE102008045925A1 (de) 2010-03-11
KR101658682B1 (ko) 2016-09-21
TW201015698A (en) 2010-04-16
EP2327110A1 (de) 2011-06-01
KR20110052711A (ko) 2011-05-18

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