JP4779826B2 - フレキシブルプリント基板 - Google Patents

フレキシブルプリント基板 Download PDF

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Publication number
JP4779826B2
JP4779826B2 JP2006179143A JP2006179143A JP4779826B2 JP 4779826 B2 JP4779826 B2 JP 4779826B2 JP 2006179143 A JP2006179143 A JP 2006179143A JP 2006179143 A JP2006179143 A JP 2006179143A JP 4779826 B2 JP4779826 B2 JP 4779826B2
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JP
Japan
Prior art keywords
semiconductor chip
flexible printed
circuit board
printed circuit
long hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006179143A
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English (en)
Japanese (ja)
Other versions
JP2008010615A (ja
JP2008010615A5 (enExample
Inventor
宗伯 青柳
英仁 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2006179143A priority Critical patent/JP4779826B2/ja
Publication of JP2008010615A publication Critical patent/JP2008010615A/ja
Publication of JP2008010615A5 publication Critical patent/JP2008010615A5/ja
Application granted granted Critical
Publication of JP4779826B2 publication Critical patent/JP4779826B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Structure Of Printed Boards (AREA)
JP2006179143A 2006-06-29 2006-06-29 フレキシブルプリント基板 Expired - Fee Related JP4779826B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006179143A JP4779826B2 (ja) 2006-06-29 2006-06-29 フレキシブルプリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006179143A JP4779826B2 (ja) 2006-06-29 2006-06-29 フレキシブルプリント基板

Publications (3)

Publication Number Publication Date
JP2008010615A JP2008010615A (ja) 2008-01-17
JP2008010615A5 JP2008010615A5 (enExample) 2008-11-27
JP4779826B2 true JP4779826B2 (ja) 2011-09-28

Family

ID=39068567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006179143A Expired - Fee Related JP4779826B2 (ja) 2006-06-29 2006-06-29 フレキシブルプリント基板

Country Status (1)

Country Link
JP (1) JP4779826B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101473477B1 (ko) 2008-07-24 2014-12-16 한국단자공업 주식회사 인쇄회로 기판의 모듈 실장 구조

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5238274B2 (ja) * 2008-01-31 2013-07-17 日東電工株式会社 配線回路基板およびその製造方法
JP2009182228A (ja) 2008-01-31 2009-08-13 Nitto Denko Corp 配線回路基板およびその製造方法
JP5845792B2 (ja) * 2011-10-07 2016-01-20 株式会社村田製作所 電子部品
KR102550170B1 (ko) * 2018-01-04 2023-07-03 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 카메라 모듈

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2844085B2 (ja) * 1989-07-20 1999-01-06 セイコーインスツルメンツ株式会社 回路基板及び半導体素子の実装方法
JPH11103137A (ja) * 1997-09-29 1999-04-13 Canon Inc フレキシブルプリント回路基板および格子状に配列された複数の接続端子を有する電子部品を実装したプリント配線基板
JP2001119107A (ja) * 1999-10-19 2001-04-27 Nec Saitama Ltd プリント配線板
JP2001326428A (ja) * 2000-05-17 2001-11-22 Pioneer Electronic Corp プリント基板
JP2005011867A (ja) * 2003-06-17 2005-01-13 Sankyo Seiki Mfg Co Ltd 回路基板および光ピックアップ装置
JP2005322844A (ja) * 2004-05-11 2005-11-17 Sony Corp 回路基板及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101473477B1 (ko) 2008-07-24 2014-12-16 한국단자공업 주식회사 인쇄회로 기판의 모듈 실장 구조

Also Published As

Publication number Publication date
JP2008010615A (ja) 2008-01-17

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