JP2006131926A - 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置 - Google Patents
微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置 Download PDFInfo
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Abstract
【解決手段】 ヨウ化金錯イオン及び非水溶媒を含有する金メッキ液を用い、正電流のみ或いは正負電流のパルス波のメッキ電流を適切なパルス電流波形で印加してフォトレジスト6に形成された開口部6aに金メッキを施すことで金バンプを形成する。
【選択図】 図3
Description
2Au + I2 + 2I− → 2[AuI2]− (2)
酸化剤としては、ヨウ素(I2)を直接用いて金メッキ液を調製してもよいし、またメッキ液中のヨウ化物イオン(I−)を酸化してI2とする酸化剤を添加して調製してもよい。このような酸化剤としては、メッキ液中のヨウ化物イオン(I−)を酸化してI2とするものであれば任意のものを使用できる。具体的には例えば、ヨウ素酸(HIO3)、過ヨウ素酸(HIO4)やこれらの塩等が挙げられる。なかでも、溶液への溶解性及び液中の安定性等を考慮して上記金メッキ液を調製する際は、ヨウ素(I2)を用いることが好ましい。
金源としては、金合金、または単体の金などが挙げられるが、メッキ液への不純物混入防止の点から単体の金またはヨウ化金などが好ましく用いられるが、入手のしやすさから、単体の金が望ましい。単体の金は、金メッキ液製造方法に応じて、塊、箔、板、粒、粉等、いずれの形態でも差し支えない。また、同じく、メッキ液組成に及ぼす影響から、合金のメッキ液とする場合は、メッキ膜を得ようとする合金と同様の組成の単体の金属が好ましく用いられる。この場合は、溶解速度を考慮して、合金組成をメッキ膜組成と若干ずれた組成を用いることもある。
f[Hz] = 1000[msec]/(Ton+Toff)
CDave[mA/cm2] = CD/(Ton+Toff)
で与えられる。
f[Hz] = 1000[msec]/(Tf+Tr)
CDave[mA/cm2] = (CDf×Tf+CDr×Tr)/(Tf+Tr)
で与えられる。
[実施例1]
まず、図3(a)に示すように、電極パッド2を有する半導体チップと、保護膜3とを有する直径8インチの半導体ウエハ1を、既存の技術で形成した。次に、図3(b)に示すように、スパッタリング法によりバリアメタル4とカレントフィルム5とを順に形成した。バリアメタル4としては、Ti、Ti−W、Ti−Nなどの高融点金属、またはその化合物を用いることができるが、ここではTi−Wを用いた。また、その膜厚は0.25μmとした。また、カレントフィルム5としては金を用い、膜厚は0.3μmとした。
[実施例2]
前述したように、バンプピッチの狭小化に伴い、ACFの導電粒子も小さくなる傾向にあり、バンプ表面ラフネス低減が強く求められる。そこで、さらにバンプラフネスの低減を図るために、パルス逆方向のパルス電流を加えることを試みた。
Tr=0.5msec以下では、バンプ高さばらつき、ウエハ面内高さばらつき、バンプ表面ラフネス、共に悪化していることが分かった。
2 電極パッド
3 保護膜
4 バリアメタル
5 カレントフィルム
6 フォトレジスト(レジスト層)
6a 開口部(微細孔)
7 金バンプ
Claims (7)
- ヨウ化金錯イオン及び非水溶媒を含有する金メッキ液を用い、正電流のパルス波のメッキ電流を印加して微細孔内に金メッキを施すことを特徴とする微細孔に対するメッキ方法。
- 上記正電流のパルス波は、電流密度CD[mA/cm2]が0<CD<20、パルスオン時間Ton[msec]が0<Ton<10000、パルスオフ時間Toff[msec]がToff>0.5であることを特徴とする請求項1に記載の微細孔に対するメッキ方法。
- ヨウ化金錯イオン及び非水溶媒を含有する金メッキ液を用い、正負電流のパルス波のメッキ電流を印加して微細孔内に金メッキを施すことを特徴とする微細孔に対するメッキ方法。
- 上記正負電流のパルス波は、正電流密度CDf[mA/cm2]が0<CDf<20、負電流密度CDr[mA/cm2]が−20<CDr<0、正パルス時間Tf[msec]が0<Tf<10000、負パルス時間Tr[msec]がTr>0.5であることを特徴とする請求項2に記載の微細孔に対するメッキ方法。
- 基板の電極パッド形成面に積層されたレジスト層の微細孔にメッキを施すことで上記電極パッド上に金バンプを形成する金バンプ形成方法において、
請求項1又は3に記載の微細孔に対するメッキ方法を用いて上記レジスト層の微細孔にメッキを施し金バンプを形成することを特徴とする金バンプ形成方法。 - 電極パッド上に金バンプが形成されてなる半導体装置の製造方法において、
電極パッドを有する半導体装置が形成された基板上にレジスト層を形成し、請求項1又は3に記載の微細孔に対するメッキ方法を用いて上記レジスト層に形成した微細孔にメッキを施すことで上記電極パッド上に金バンプを形成する工程を含むことを特徴とする半導体装置の製造方法。 - 電極パッド上に金バンプが形成されてなる半導体装置において、
上記金バンプが請求項1又は3に記載の微細孔に対するメッキ方法を用いて形成されていることを特徴とする半導体装置。
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JP2004319902A JP2006131926A (ja) | 2004-11-02 | 2004-11-02 | 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置 |
TW094138476A TW200619433A (en) | 2004-11-02 | 2005-11-02 | Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device |
US11/266,095 US20060118952A1 (en) | 2004-11-02 | 2005-11-02 | Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device |
KR1020050104365A KR100743015B1 (ko) | 2004-11-02 | 2005-11-02 | 미세 구멍에 대한 도금방법, 및 이것을 이용한 금 범프 형성방법과 반도체장치의 제조방법 |
CNB2005100483972A CN100449696C (zh) | 2004-11-02 | 2005-11-02 | 微细孔电镀和金凸起形成方法、半导体器件及其制造方法 |
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US (1) | US20060118952A1 (ja) |
JP (1) | JP2006131926A (ja) |
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CN (1) | CN100449696C (ja) |
TW (1) | TW200619433A (ja) |
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JP2007177291A (ja) * | 2005-12-28 | 2007-07-12 | Shinshu Univ | 金めっき膜およびその製造方法 |
JP2008174795A (ja) * | 2007-01-18 | 2008-07-31 | Mitsubishi Chemicals Corp | 金メッキ液および金メッキ方法 |
CN103179806A (zh) * | 2011-12-21 | 2013-06-26 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
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US8828213B2 (en) * | 2011-02-09 | 2014-09-09 | Dai Nippon Printing Co., Ltd. | Stainless substrate having a gold-plating layer, and process of forming a partial gold-plating pattern on a stainless substrate |
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- 2005-11-02 US US11/266,095 patent/US20060118952A1/en not_active Abandoned
- 2005-11-02 CN CNB2005100483972A patent/CN100449696C/zh not_active Expired - Fee Related
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JP2008174795A (ja) * | 2007-01-18 | 2008-07-31 | Mitsubishi Chemicals Corp | 金メッキ液および金メッキ方法 |
CN103179806A (zh) * | 2011-12-21 | 2013-06-26 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
CN103179806B (zh) * | 2011-12-21 | 2019-05-28 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
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TW200619433A (en) | 2006-06-16 |
US20060118952A1 (en) | 2006-06-08 |
CN1822322A (zh) | 2006-08-23 |
CN100449696C (zh) | 2009-01-07 |
KR20060052415A (ko) | 2006-05-19 |
KR100743015B1 (ko) | 2007-07-26 |
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