JP2006114640A - 非接触型吸着保持装置 - Google Patents
非接触型吸着保持装置 Download PDFInfo
- Publication number
- JP2006114640A JP2006114640A JP2004299507A JP2004299507A JP2006114640A JP 2006114640 A JP2006114640 A JP 2006114640A JP 2004299507 A JP2004299507 A JP 2004299507A JP 2004299507 A JP2004299507 A JP 2004299507A JP 2006114640 A JP2006114640 A JP 2006114640A
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- Prior art keywords
- suction
- wafer
- bernoulli
- adsorption
- plate
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
【解決手段】本発明に係る非接触型吸着保持装置1は、エアー(気体)の噴出によって負圧を発生するベルヌーイ吸着手段10を吸着テーブル2に配置し、下面周縁部が前記吸着テーブル2上に載置されたウエハ(板状部材)Wの周縁部を除く部分(主要部分)を吸着テーブル2に対してフローティングさせた状態で、前記ベルヌーイ吸着手段10によってウエハWを保持してこれを吸着テーブル2に対して非接触で吸着保持することを特徴とする。又、前記吸着テーブル2に吸着保持された前記ウエハWの下面中央部を上方へ加圧して該ウエハWを略フラットに保持するための加圧手段を設ける。
【選択図】図2
Description
2 吸着テーブル
3 ベースプレート
4,5 円板プレート
6 エアー噴射口
10 ベルヌーイ吸着手段
11 本体
12 排気口
13 円孔
15 チャンバ
16 給気口
17 連通路
18,19 シールリング(Oリング)
20 支持リング
D エアダクト
S 密閉空間
W ウエハ(板状部材)
Claims (8)
- 気体の噴出によって負圧を発生するベルヌーイ吸着手段を吸着テーブルに配置し、下面周縁部が前記吸着テーブル上に載置された板状部材の周縁部を除く部分を吸着テーブルに対してフローティングさせた状態で、前記ベルヌーイ吸着手段によって板状部材を保持してこれを吸着テーブルに対して非接触で吸着保持することを特徴とする非接触型吸着保持装置。
- 前記ベルヌーイ吸着手段を前記吸着テーブルに複数配置したことを特徴とする請求項1記載の非接触型吸着保持装置。
- 複数の前記ベルヌーイ吸着手段を前記吸着テーブルの同一円周上に等配的に配置したことを特徴とする請求項2記載の非接触型吸着保持装置。
- 前記吸着テーブルにチャンバを形成し、該チャンバを圧縮気体供給源に接続するとともに、複数の前記ベルヌーイ吸着手段に連通せしめたことを特徴とする請求項2又は3記載の非接触型吸着保持装置。
- 前記吸着テーブルに吸着保持された前記板状部材の下面中央部を上方へ加圧して該板状部材を略フラットに保持するための加圧手段を設けたことを特徴とする請求項1〜4の何れかに記載の非接触型吸着保持装置。
- 前記加圧手段を、前記吸着テーブルの中央部から圧縮気体を上方に向かって噴射する気体噴射手段で構成したことを特徴とする請求項5記載の非接触型吸着保持装置。
- 前記ベルヌーイ吸着手段の周辺に、当該ベルヌーイ吸着手段から噴出される気体を排出する排気口を設けたことを特徴とする請求項1〜6の何れかに記載の非接触型吸着保持装置。
- 前記排気口から排出される気体をエアダクトによって機外(屋外)に排出することを特徴とする請求項7記載の非接触型吸着保持装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004299507A JP4541824B2 (ja) | 2004-10-14 | 2004-10-14 | 非接触型吸着保持装置 |
KR1020077008361A KR101098025B1 (ko) | 2004-10-14 | 2005-06-29 | 비접촉형 흡착 홀딩 장치 |
CNB2005800337584A CN100495680C (zh) | 2004-10-14 | 2005-06-29 | 非接触型吸附保持装置 |
PCT/JP2005/011912 WO2006040858A1 (ja) | 2004-10-14 | 2005-06-29 | 非接触型吸着保持装置 |
US11/577,146 US20090026676A1 (en) | 2004-10-14 | 2005-06-29 | Non-Contact Type Suction Holding Apparatus |
TW094124956A TWI417985B (zh) | 2004-10-14 | 2005-07-22 | Non - contact type adsorption holding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004299507A JP4541824B2 (ja) | 2004-10-14 | 2004-10-14 | 非接触型吸着保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006114640A true JP2006114640A (ja) | 2006-04-27 |
JP4541824B2 JP4541824B2 (ja) | 2010-09-08 |
Family
ID=36148160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004299507A Expired - Fee Related JP4541824B2 (ja) | 2004-10-14 | 2004-10-14 | 非接触型吸着保持装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090026676A1 (ja) |
JP (1) | JP4541824B2 (ja) |
KR (1) | KR101098025B1 (ja) |
CN (1) | CN100495680C (ja) |
TW (1) | TWI417985B (ja) |
WO (1) | WO2006040858A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010103426A (ja) * | 2008-10-27 | 2010-05-06 | Lintec Corp | 板状部材の支持装置および支持方法 |
WO2014084229A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社ニコン | 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置 |
WO2014084228A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社ニコン | 吸引装置、搬入方法、搬送システム及び露光装置、並びにデバイス製造方法 |
JP2014135390A (ja) * | 2013-01-10 | 2014-07-24 | Olympus Corp | 基板搬送装置、基板検査装置及び基板搬送方法 |
KR101476061B1 (ko) * | 2013-11-22 | 2014-12-30 | 윤웅 | 반도체 웨이퍼 ocr 소터 |
KR20150088828A (ko) * | 2012-11-27 | 2015-08-03 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 지지 장치 |
KR20150101421A (ko) * | 2014-02-26 | 2015-09-03 | 고요 기카이 고교 가부시키가이샤 | 양두 평면 연삭법 및 양두 평면 연삭반 |
JP7383147B2 (ja) | 2020-05-25 | 2023-11-17 | 株式会社日立ハイテク | 基板保持装置及び基板処理装置 |
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KR100674440B1 (ko) * | 2005-08-12 | 2007-01-25 | 주식회사 파이컴 | 프로브 카드 제조 방법 및 장치 |
JP5013400B2 (ja) * | 2006-09-29 | 2012-08-29 | 国立大学法人東北大学 | 塗布膜コーティング装置 |
DE102009018434B4 (de) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten |
CN103168352B (zh) * | 2010-08-20 | 2015-12-02 | 第一太阳能有限公司 | 胶带设置器 |
CN102103987B (zh) * | 2010-12-21 | 2013-01-23 | 上海技美电子科技有限公司 | 晶圆贴膜方法及晶圆贴膜装置 |
CN103199049B (zh) * | 2012-01-04 | 2015-09-09 | 沈阳芯源微电子设备有限公司 | 一种可兼容不同尺寸晶圆的伯努利承片台 |
JP5888051B2 (ja) * | 2012-03-27 | 2016-03-16 | 三菱電機株式会社 | ウエハ吸着方法、ウエハ吸着ステージ、ウエハ吸着システム |
JP5454971B2 (ja) * | 2012-04-13 | 2014-03-26 | 株式会社日本製鋼所 | 移動ステージ |
CN104096980B (zh) * | 2014-06-26 | 2016-01-20 | 长春光华微电子设备工程中心有限公司 | 激光切割真空吸附平台 |
JP6576172B2 (ja) * | 2015-09-03 | 2019-09-18 | 株式会社ディスコ | チャックテーブル |
WO2018022914A1 (en) | 2016-07-28 | 2018-02-01 | Lashify, Inc. | Artificial lash extensions |
WO2018119034A1 (en) | 2016-12-20 | 2018-06-28 | Lashify, Inc. | Applicators and cases for artificial lash extensions |
CN108878338B (zh) * | 2017-05-11 | 2020-10-13 | 北京北方华创微电子装备有限公司 | 一种吸片装置 |
CN109461691A (zh) * | 2017-09-06 | 2019-03-12 | 富士迈半导体精密工业(上海)有限公司 | 晶圆支撑装置 |
DE102018125682B4 (de) * | 2018-10-16 | 2023-01-19 | Asm Assembly Systems Gmbh & Co. Kg | Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils |
JP7185695B2 (ja) | 2018-10-19 | 2022-12-07 | ラシフィ インコーポレイテッド | 人工まつ毛エクステンションのアプリケーターおよびその使用方法と製造方法 |
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CN112201610A (zh) * | 2020-09-30 | 2021-01-08 | 南京华易泰电子科技有限公司 | 一种非接触式晶片支撑装置 |
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2004
- 2004-10-14 JP JP2004299507A patent/JP4541824B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-29 CN CNB2005800337584A patent/CN100495680C/zh active Active
- 2005-06-29 US US11/577,146 patent/US20090026676A1/en not_active Abandoned
- 2005-06-29 WO PCT/JP2005/011912 patent/WO2006040858A1/ja active Application Filing
- 2005-06-29 KR KR1020077008361A patent/KR101098025B1/ko active IP Right Grant
- 2005-07-22 TW TW094124956A patent/TWI417985B/zh active
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JPH02303047A (ja) * | 1989-05-18 | 1990-12-17 | Shioya Seisakusho:Kk | ウエハチヤツク方法及び装置 |
JPH03102850A (ja) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | ウェハホルダ |
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Cited By (27)
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---|---|---|---|---|
JP2010103426A (ja) * | 2008-10-27 | 2010-05-06 | Lintec Corp | 板状部材の支持装置および支持方法 |
KR20150088828A (ko) * | 2012-11-27 | 2015-08-03 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 지지 장치 |
KR102124417B1 (ko) | 2012-11-27 | 2020-06-24 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 지지 장치 |
US10410906B2 (en) | 2012-11-27 | 2019-09-10 | Acm Research (Shanghai) Inc. | Substrate supporting apparatus |
JP2015537385A (ja) * | 2012-11-27 | 2015-12-24 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | 基板支持装置 |
US10081108B2 (en) | 2012-11-30 | 2018-09-25 | Nikon Corporation | Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device |
WO2014084228A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社ニコン | 吸引装置、搬入方法、搬送システム及び露光装置、並びにデバイス製造方法 |
KR102523729B1 (ko) | 2012-11-30 | 2023-04-19 | 가부시키가이샤 니콘 | 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치 |
JPWO2014084229A1 (ja) * | 2012-11-30 | 2017-01-05 | 株式会社ニコン | 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置 |
JPWO2014084228A1 (ja) * | 2012-11-30 | 2017-01-05 | 株式会社ニコン | 吸引装置、搬入方法、搬送システム及び露光装置、並びにデバイス製造方法 |
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TWI623999B (zh) * | 2012-11-30 | 2018-05-11 | 日商尼康股份有限公司 | 吸引裝置、搬入方法、搬送系統及曝光裝置、以及元件製造方法 |
US11511438B2 (en) | 2012-11-30 | 2022-11-29 | Nikon Corporation | Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device |
US10242903B2 (en) | 2012-11-30 | 2019-03-26 | Nikon Corporation | Suction device, carry-in method, carrier system and exposure apparatus, and device manufacturing method |
TWI667725B (zh) * | 2012-11-30 | 2019-08-01 | 尼康股份有限公司 | 搬送系統、曝光裝置、曝光方法、元件製造方法及搬送方法 |
US10384350B2 (en) | 2012-11-30 | 2019-08-20 | Nikon Corporation | Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device |
US11289362B2 (en) | 2012-11-30 | 2022-03-29 | Nikon Corporation | Suction device, carry-in method, carrier system and exposure apparatus, and device manufacturing method |
US10586728B2 (en) | 2012-11-30 | 2020-03-10 | Nikon Corporation | Suction device, carry-in method, carrier system and exposure apparatus, and device manufacturing method |
WO2014084229A1 (ja) * | 2012-11-30 | 2014-06-05 | 株式会社ニコン | 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置 |
US10744648B2 (en) | 2012-11-30 | 2020-08-18 | Nikon Corporation | Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device |
KR20220034924A (ko) * | 2012-11-30 | 2022-03-18 | 가부시키가이샤 니콘 | 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치 |
US11097426B2 (en) | 2012-11-30 | 2021-08-24 | Nikon Corporation | Carrier system, exposure apparatus, carrier method, exposure method, device manufacturing method, and suction device |
JP2014135390A (ja) * | 2013-01-10 | 2014-07-24 | Olympus Corp | 基板搬送装置、基板検査装置及び基板搬送方法 |
KR101476061B1 (ko) * | 2013-11-22 | 2014-12-30 | 윤웅 | 반도체 웨이퍼 ocr 소터 |
KR102241071B1 (ko) * | 2014-02-26 | 2021-04-16 | 고요 기카이 고교 가부시키가이샤 | 양두 평면 연삭법 |
KR20150101421A (ko) * | 2014-02-26 | 2015-09-03 | 고요 기카이 고교 가부시키가이샤 | 양두 평면 연삭법 및 양두 평면 연삭반 |
JP7383147B2 (ja) | 2020-05-25 | 2023-11-17 | 株式会社日立ハイテク | 基板保持装置及び基板処理装置 |
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US20090026676A1 (en) | 2009-01-29 |
WO2006040858A1 (ja) | 2006-04-20 |
TWI417985B (zh) | 2013-12-01 |
CN100495680C (zh) | 2009-06-03 |
CN101036221A (zh) | 2007-09-12 |
KR20070069162A (ko) | 2007-07-02 |
KR101098025B1 (ko) | 2011-12-22 |
TW200625503A (en) | 2006-07-16 |
JP4541824B2 (ja) | 2010-09-08 |
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