JP6576172B2 - チャックテーブル - Google Patents
チャックテーブル Download PDFInfo
- Publication number
- JP6576172B2 JP6576172B2 JP2015173976A JP2015173976A JP6576172B2 JP 6576172 B2 JP6576172 B2 JP 6576172B2 JP 2015173976 A JP2015173976 A JP 2015173976A JP 2015173976 A JP2015173976 A JP 2015173976A JP 6576172 B2 JP6576172 B2 JP 6576172B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- outer peripheral
- chuck table
- peripheral surplus
- holding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Description
11 半導体ウェーハ
15 デバイス
17 電極バンプ
19 デバイス領域
21 外周余剰領域
24 チャックテーブル
42 枠体
44 吸引保持部
44a 保持面
48 シート部材
50 Oリング固定部
54 Oリング
56 高さ調整手段
60 シート部材固定部
Claims (3)
- 格子状に区画された複数の領域に電極バンプを有するデバイスがそれぞれ形成されたデバイス領域と、該デバイス領域を囲繞する外周余剰領域とを表面に備えたウェーハの表面を吸引して保持するチャックテーブルであって、
枠体と、
該枠体の凹部に嵌合され、該電極バンプと対向しウェーハの該デバイス領域を吸引保持する保持面を備える吸引保持部と、
該保持面を囲繞し、該保持面より突出した弾性部材でウェーハの該外周余剰領域を支持する外周余剰領域支持部と、を備え、
該外周余剰領域支持部は、該電極バンプの高さに対応して該保持面から突出し、
該枠体及び該吸引保持部は、ウェーハの該外周余剰領域を支持しないことを特徴とするチャックテーブル。 - ウェーハより大きい直径で可撓性と通気性を備え、該保持面と該外周余剰領域支持部とを覆って吸引保持したウェーハの表面を保護するシート部材と、
該シート部材の外周を該外周余剰領域支持部より下方に押し下げて固定するシート部材固定部と、を更に備えた請求項1記載のチャックテーブル。 - 該外周余剰領域支持部の該保持面からの突出量を調整する高さ調整手段を更に備えた請求項1又は2記載のチャックテーブル。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015173976A JP6576172B2 (ja) | 2015-09-03 | 2015-09-03 | チャックテーブル |
TW105124646A TWI689036B (zh) | 2015-09-03 | 2016-08-03 | 工作夾台 |
MYPI2016702934A MY179208A (en) | 2015-09-03 | 2016-08-11 | Chuck table |
SG10201606672YA SG10201606672YA (en) | 2015-09-03 | 2016-08-11 | Chuck table |
US15/243,291 US10090186B2 (en) | 2015-09-03 | 2016-08-22 | Chuck table |
DE102016215891.0A DE102016215891A1 (de) | 2015-09-03 | 2016-08-24 | Einspanntisch |
KR1020160110710A KR102418169B1 (ko) | 2015-09-03 | 2016-08-30 | 척 테이블 |
CN201610791367.9A CN106505027B (zh) | 2015-09-03 | 2016-08-31 | 卡盘工作台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015173976A JP6576172B2 (ja) | 2015-09-03 | 2015-09-03 | チャックテーブル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017050461A JP2017050461A (ja) | 2017-03-09 |
JP6576172B2 true JP6576172B2 (ja) | 2019-09-18 |
Family
ID=58055160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015173976A Active JP6576172B2 (ja) | 2015-09-03 | 2015-09-03 | チャックテーブル |
Country Status (8)
Country | Link |
---|---|
US (1) | US10090186B2 (ja) |
JP (1) | JP6576172B2 (ja) |
KR (1) | KR102418169B1 (ja) |
CN (1) | CN106505027B (ja) |
DE (1) | DE102016215891A1 (ja) |
MY (1) | MY179208A (ja) |
SG (1) | SG10201606672YA (ja) |
TW (1) | TWI689036B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9917000B2 (en) * | 2015-10-01 | 2018-03-13 | Infineon Technologies Ag | Wafer carrier, method for manufacturing the same and method for carrying a wafer |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2730370A (en) * | 1954-08-13 | 1956-01-10 | George F Brewster | Work holding chuck |
US3727282A (en) * | 1970-02-05 | 1973-04-17 | Burroughs Corp | Semiconductor handling apparatus |
US3743148A (en) * | 1971-03-08 | 1973-07-03 | H Carlson | Wafer breaker |
US4410168A (en) * | 1980-07-11 | 1983-10-18 | Asta, Ltd. | Apparatus for manipulating a stretched resilient diaphragm |
JPH0731245U (ja) * | 1993-11-17 | 1995-06-13 | 株式会社森田工業 | チャック |
US5624299A (en) * | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
KR0174773B1 (ko) * | 1995-03-31 | 1999-04-01 | 모리시다 요이치 | 반도체장치의 검사방법 |
JP3662404B2 (ja) * | 1997-11-19 | 2005-06-22 | 芝浦メカトロニクス株式会社 | ウエハシート引伸ばし装置およびそれを用いたペレットボンディング装置 |
JP2000180469A (ja) * | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
US6716084B2 (en) * | 2001-01-11 | 2004-04-06 | Nutool, Inc. | Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
US6939206B2 (en) * | 2001-03-12 | 2005-09-06 | Asm Nutool, Inc. | Method and apparatus of sealing wafer backside for full-face electrochemical plating |
JP4541824B2 (ja) * | 2004-10-14 | 2010-09-08 | リンテック株式会社 | 非接触型吸着保持装置 |
JP4630692B2 (ja) * | 2005-03-07 | 2011-02-09 | 株式会社ディスコ | レーザー加工方法 |
US7608523B2 (en) * | 2005-08-26 | 2009-10-27 | Disco Corporation | Wafer processing method and adhesive tape used in the wafer processing method |
JP4874602B2 (ja) * | 2005-08-26 | 2012-02-15 | 株式会社ディスコ | ウエーハの加工方法およびウエーハの加工方法に用いる粘着テープ |
US20090075459A1 (en) * | 2007-09-06 | 2009-03-19 | Kabushiki Kaisha Shinkawa | Apparatus and method for picking-up semiconductor dies |
JP5361634B2 (ja) * | 2009-09-25 | 2013-12-04 | 信越ポリマー株式会社 | 半導体ウェーハ用チャックテーブル及び半導体ウェーハの加工方法 |
JP6004725B2 (ja) * | 2012-04-24 | 2016-10-12 | 株式会社ディスコ | 加工装置のチャックテーブル機構 |
JP2014072510A (ja) * | 2012-10-02 | 2014-04-21 | Disco Abrasive Syst Ltd | チャックテーブル |
JP6061629B2 (ja) * | 2012-11-07 | 2017-01-18 | 株式会社ディスコ | 加工装置 |
JP6208956B2 (ja) * | 2013-03-04 | 2017-10-04 | 株式会社ディスコ | 環状凸部除去装置 |
JP6205231B2 (ja) * | 2013-10-08 | 2017-09-27 | 株式会社ディスコ | 切削装置 |
-
2015
- 2015-09-03 JP JP2015173976A patent/JP6576172B2/ja active Active
-
2016
- 2016-08-03 TW TW105124646A patent/TWI689036B/zh active
- 2016-08-11 SG SG10201606672YA patent/SG10201606672YA/en unknown
- 2016-08-11 MY MYPI2016702934A patent/MY179208A/en unknown
- 2016-08-22 US US15/243,291 patent/US10090186B2/en active Active
- 2016-08-24 DE DE102016215891.0A patent/DE102016215891A1/de active Pending
- 2016-08-30 KR KR1020160110710A patent/KR102418169B1/ko active IP Right Grant
- 2016-08-31 CN CN201610791367.9A patent/CN106505027B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10090186B2 (en) | 2018-10-02 |
KR102418169B1 (ko) | 2022-07-08 |
SG10201606672YA (en) | 2017-04-27 |
CN106505027B (zh) | 2021-10-08 |
US20170069524A1 (en) | 2017-03-09 |
DE102016215891A1 (de) | 2017-03-09 |
MY179208A (en) | 2020-11-01 |
CN106505027A (zh) | 2017-03-15 |
KR20170028256A (ko) | 2017-03-13 |
TW201712797A (zh) | 2017-04-01 |
TWI689036B (zh) | 2020-03-21 |
JP2017050461A (ja) | 2017-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6151557B2 (ja) | レーザー加工方法 | |
KR101160200B1 (ko) | 웨이퍼의 분할방법 | |
KR102313271B1 (ko) | 웨이퍼의 가공 방법 | |
CN105514036B (zh) | 晶片的加工方法 | |
JP5378780B2 (ja) | テープ拡張方法およびテープ拡張装置 | |
US20160240424A1 (en) | Chuck table of processing apparatus | |
JP2009525601A (ja) | ウェハ個片切断用支持体 | |
JP7072977B2 (ja) | デバイスの移設方法 | |
JP6189066B2 (ja) | ウエーハの加工方法 | |
JP2015028980A (ja) | ウエーハの加工方法 | |
JP4833657B2 (ja) | ウエーハの分割方法 | |
KR20180070479A (ko) | 다이 본더 | |
JP6576172B2 (ja) | チャックテーブル | |
JP2020068316A (ja) | ウェーハの加工方法 | |
JP2018006574A (ja) | チャックテーブル | |
TWI701731B (zh) | 晶圓的加工方法 | |
TW202221779A (zh) | 工作夾台及雷射加工裝置 | |
KR20190024683A (ko) | 레이저 가공 장치 | |
JP6290010B2 (ja) | ウェーハの分割方法 | |
KR102607962B1 (ko) | 웨이퍼의 가공 방법 | |
TWI767009B (zh) | 晶圓的加工方法 | |
JP2009277778A (ja) | ウエーハの分割方法 | |
CN115701650A (zh) | 晶片的分割方法 | |
JP2014143295A (ja) | 加工装置のチャックテーブル | |
JP2021019163A (ja) | チップの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180724 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190319 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190426 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190820 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190820 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6576172 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |