JP2014072510A - チャックテーブル - Google Patents
チャックテーブル Download PDFInfo
- Publication number
- JP2014072510A JP2014072510A JP2012220248A JP2012220248A JP2014072510A JP 2014072510 A JP2014072510 A JP 2014072510A JP 2012220248 A JP2012220248 A JP 2012220248A JP 2012220248 A JP2012220248 A JP 2012220248A JP 2014072510 A JP2014072510 A JP 2014072510A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- wafer
- annular seal
- suction
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 19
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 229920001973 fluoroelastomer Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/24—Chucks characterised by features relating primarily to remote control of the gripping means
- B23B31/30—Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
- B23B31/307—Vacuum chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
Abstract
【解決手段】被加工物(W)を保持するチャックテーブル(15)であって、被加工物を吸引保持する吸着面(153a)を有する吸着部(153)と、吸着部の周囲を囲むように弾性部材で形成され、被加工物の外周部分(W2)を支持する環状シール部(154)と、を備え、吸着部は、吸着面に吸引力を生じさせる負圧生成源と接続されており、環状シール部は、上面(154a)の高さが吸着面より高くなるように形成されると共に、被加工物を吸引保持する際に、被加工物と吸着面との隙間からリークした負圧が、被加工物の外周部分と環状シール部とが当接されてなる空間に作用して被加工物が変形され、表面が面一となるように形成されたことを特徴とする。
【選択図】図2
Description
14 レーザー加工ユニット
15 チャックテーブル
151 θテーブル
152 テーブルベース
152a ベース部
152b 支持部
152c 貫通孔
152d 気体流路
152e 切り欠き部
153 吸着部
153a 吸着面
154 環状シール部
154a 上面
154b 切り欠き部
W ウェーハ(被加工物)
W1 中央部分
W2 外周部分
Claims (1)
- 板状の被加工物に加工を施す加工装置において被加工物を上面に保持するチャックテーブルであって、
被加工物を上面に吸引保持する吸着面を有する吸着部と、該吸着部の周囲を囲繞して環状に形成され且つ被加工物の外周側を支持する弾性部材で形成された環状シール部と、を有し、
該吸着部は該吸着面に負圧を生成する負圧生成源に連通し、
該環状シール部の表面高さは、被加工物の反りに対応して該吸着面の表面高さよりも高く形成されており、
被加工物を吸引保持する際には、被加工物の反りにより被加工物外周と該吸着面の隙間からリークした該負圧は、被加工物外周が該環状シール部と当接することによりシールされ被加工物外周に作用し該弾性部材を変形させ被加工物の表面が面一になり吸引保持されること、
を特徴とするチャックテーブル。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012220248A JP2014072510A (ja) | 2012-10-02 | 2012-10-02 | チャックテーブル |
CN201310445016.9A CN103715127B (zh) | 2012-10-02 | 2013-09-26 | 卡盘工作台 |
KR1020130115198A KR20140043678A (ko) | 2012-10-02 | 2013-09-27 | 척 테이블 |
US14/041,461 US9381577B2 (en) | 2012-10-02 | 2013-09-30 | Chuck table |
DE102013219901.5A DE102013219901B4 (de) | 2012-10-02 | 2013-10-01 | Spanntisch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012220248A JP2014072510A (ja) | 2012-10-02 | 2012-10-02 | チャックテーブル |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014072510A true JP2014072510A (ja) | 2014-04-21 |
Family
ID=50276533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012220248A Pending JP2014072510A (ja) | 2012-10-02 | 2012-10-02 | チャックテーブル |
Country Status (5)
Country | Link |
---|---|
US (1) | US9381577B2 (ja) |
JP (1) | JP2014072510A (ja) |
KR (1) | KR20140043678A (ja) |
CN (1) | CN103715127B (ja) |
DE (1) | DE102013219901B4 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016010840A (ja) * | 2014-06-30 | 2016-01-21 | 株式会社ディスコ | チャックテーブル |
JP2016022538A (ja) * | 2014-07-16 | 2016-02-08 | 株式会社ディスコ | 被加工物保持プレート及び保持ユニット |
WO2017086333A1 (ja) * | 2015-11-19 | 2017-05-26 | 日本特殊陶業株式会社 | 真空チャック |
JP2017123400A (ja) * | 2016-01-07 | 2017-07-13 | 株式会社ディスコ | チャックテーブル |
JP2018017771A (ja) * | 2016-07-25 | 2018-02-01 | ウシオ電機株式会社 | ワークステージ及び露光装置 |
KR20180134292A (ko) | 2017-06-08 | 2018-12-18 | 가부시기가이샤 디스코 | 척테이블 |
JP2020194192A (ja) * | 2016-07-25 | 2020-12-03 | 株式会社アドテックエンジニアリング | ワーク吸着保持方法、ワークステージ及び露光装置 |
JP7515252B2 (ja) | 2019-03-08 | 2024-07-12 | ザ・ボーイング・カンパニー | 機械加工工程中の物質の輪郭シートの支持 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9355882B2 (en) * | 2013-12-04 | 2016-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer module for bowed wafers |
CN104076619A (zh) * | 2014-07-03 | 2014-10-01 | 无锡宏纳科技有限公司 | 一种接触式光刻机吸盘 |
JP6800022B2 (ja) * | 2014-07-03 | 2020-12-16 | エルピーイー ソシエタ ペル アチオニ | 基板を操作するためのツール、操作方法およびエピタキシャル反応器 |
CN104308606B (zh) * | 2014-11-11 | 2017-01-11 | 昆山冠品优精密机械有限公司 | 真空载具 |
TWI581904B (zh) * | 2014-11-18 | 2017-05-11 | 漢民科技股份有限公司 | 工件處理裝置與方法 |
JP6576172B2 (ja) * | 2015-09-03 | 2019-09-18 | 株式会社ディスコ | チャックテーブル |
TWI587970B (zh) * | 2016-10-12 | 2017-06-21 | Direct drive indexing plate adsorption structure | |
US10213842B2 (en) * | 2017-02-10 | 2019-02-26 | Spy Eye, Llc | Method for achieving length accuracy of diamond turned parts |
JP6994852B2 (ja) * | 2017-06-30 | 2022-01-14 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
JP6881284B2 (ja) * | 2017-12-27 | 2021-06-02 | 株式会社Sumco | 吸着チャック |
DE102018202774A1 (de) * | 2018-02-23 | 2019-08-29 | Homag Bohrsysteme Gmbh | Spannelement sowie Bearbeitungsmaschine mit diesem |
US11587818B2 (en) * | 2019-07-18 | 2023-02-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck design and method for wafer |
CN112442735A (zh) * | 2019-08-30 | 2021-03-05 | 西安交通大学 | 一种可吸附拼接生长大面积单晶金刚石的方法 |
CN111515534B (zh) * | 2020-04-08 | 2021-12-21 | 哈尔滨汽轮机厂有限责任公司 | 一种燃机喷嘴呼啦密封的制作方法及支撑工装 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0584682A (ja) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | 真空チヤツク装置 |
JPH11309638A (ja) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | 真空吸着盤 |
JP2010153419A (ja) * | 2008-12-24 | 2010-07-08 | Ushio Inc | ワークステージおよびこのワークステージを使った露光装置 |
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US2730370A (en) * | 1954-08-13 | 1956-01-10 | George F Brewster | Work holding chuck |
US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
JPS59201736A (ja) * | 1983-04-27 | 1984-11-15 | Toshiba Corp | 基板固定装置 |
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JPH03270048A (ja) * | 1990-03-19 | 1991-12-02 | Fujitsu Ltd | 真空チャック |
JPH0464216A (ja) * | 1990-07-04 | 1992-02-28 | Canon Inc | 基板チャック装置 |
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US5930652A (en) * | 1996-05-28 | 1999-07-27 | Motorola, Inc. | Semiconductor encapsulation method |
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JP2000180469A (ja) * | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
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AT511627B1 (de) * | 2011-07-01 | 2015-05-15 | Mechatronic Systemtechnik Gmbh | Vorrichtung zum halten eines flächigen substrats |
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2012
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-
2013
- 2013-09-26 CN CN201310445016.9A patent/CN103715127B/zh active Active
- 2013-09-27 KR KR1020130115198A patent/KR20140043678A/ko not_active Application Discontinuation
- 2013-09-30 US US14/041,461 patent/US9381577B2/en active Active
- 2013-10-01 DE DE102013219901.5A patent/DE102013219901B4/de active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0584682A (ja) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | 真空チヤツク装置 |
JPH11309638A (ja) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | 真空吸着盤 |
JP2010153419A (ja) * | 2008-12-24 | 2010-07-08 | Ushio Inc | ワークステージおよびこのワークステージを使った露光装置 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016010840A (ja) * | 2014-06-30 | 2016-01-21 | 株式会社ディスコ | チャックテーブル |
JP2016022538A (ja) * | 2014-07-16 | 2016-02-08 | 株式会社ディスコ | 被加工物保持プレート及び保持ユニット |
WO2017086333A1 (ja) * | 2015-11-19 | 2017-05-26 | 日本特殊陶業株式会社 | 真空チャック |
JPWO2017086333A1 (ja) * | 2015-11-19 | 2017-11-16 | 日本特殊陶業株式会社 | 真空チャック |
JP2017123400A (ja) * | 2016-01-07 | 2017-07-13 | 株式会社ディスコ | チャックテーブル |
KR20180011710A (ko) * | 2016-07-25 | 2018-02-02 | 우시오덴키 가부시키가이샤 | 워크 스테이지 및 노광 장치 |
JP2018017771A (ja) * | 2016-07-25 | 2018-02-01 | ウシオ電機株式会社 | ワークステージ及び露光装置 |
JP2020194192A (ja) * | 2016-07-25 | 2020-12-03 | 株式会社アドテックエンジニアリング | ワーク吸着保持方法、ワークステージ及び露光装置 |
TWI718309B (zh) * | 2016-07-25 | 2021-02-11 | 日商牛尾電機股份有限公司 | 工件平台及曝光裝置 |
KR102229484B1 (ko) * | 2016-07-25 | 2021-03-18 | 우시오덴키 가부시키가이샤 | 워크 스테이지 및 노광 장치 |
KR20180134292A (ko) | 2017-06-08 | 2018-12-18 | 가부시기가이샤 디스코 | 척테이블 |
JP2018207033A (ja) * | 2017-06-08 | 2018-12-27 | 株式会社ディスコ | チャックテーブル |
JP7515252B2 (ja) | 2019-03-08 | 2024-07-12 | ザ・ボーイング・カンパニー | 機械加工工程中の物質の輪郭シートの支持 |
Also Published As
Publication number | Publication date |
---|---|
US20140091537A1 (en) | 2014-04-03 |
KR20140043678A (ko) | 2014-04-10 |
US9381577B2 (en) | 2016-07-05 |
CN103715127B (zh) | 2018-01-23 |
DE102013219901A1 (de) | 2014-04-03 |
CN103715127A (zh) | 2014-04-09 |
DE102013219901B4 (de) | 2024-05-16 |
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