JP2017098471A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2017098471A JP2017098471A JP2015231243A JP2015231243A JP2017098471A JP 2017098471 A JP2017098471 A JP 2017098471A JP 2015231243 A JP2015231243 A JP 2015231243A JP 2015231243 A JP2015231243 A JP 2015231243A JP 2017098471 A JP2017098471 A JP 2017098471A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- chuck table
- magnetic force
- holding
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005307 ferromagnetism Effects 0.000 claims abstract description 10
- 230000001747 exhibiting effect Effects 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 description 38
- 230000032258 transport Effects 0.000 description 38
- 230000004048 modification Effects 0.000 description 26
- 238000012986 modification Methods 0.000 description 26
- 239000002390 adhesive tape Substances 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 15
- 238000003754 machining Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
4 基台
4a,4b,4c,4d 開口
6 X軸移動テーブル
8 防塵防滴カバー
10,72,74,76 チャックテーブル
10a 保持面
12 切削ユニット(加工ユニット、加工手段)
14 支持構造
16 切削ユニット移動機構
18 Y軸ガイドレール
20 Y軸移動プレート
22 Y軸ボールネジ
24 Y軸パルスモータ
26 Z軸ガイドレール
28 Z軸移動プレート
30 Z軸ボールネジ
32 Z軸パルスモータ
34 切削ブレード
36 カメラ
42 搬入側テーブル
42a 保持面
44 位置決め部材
46 搬出側テーブル
46a 保持面
48,92,94,96 搬送ユニット(搬送手段)
48a 保持面
50 ノズル
62 支持プレート
62a 吸引路
62b 溝
64 磁石(第1磁力保持部)
66 カバープレート
68 クランプ
82 保持プレート
84 磁石(第2磁力保持部)
86 カバープレート
102 保持フレーム
104 保持部
106 磁石(第2磁力保持部)
108 吸引保持部
114 カセット支持台
116 カセット
118 洗浄ユニット
120 把持部
122 ガイドレール
11 被加工物
13 粘着テープ
15 フレーム
Claims (2)
- 強磁性を示す物質を含んで形成された被加工物を加工する加工装置であって、
被加工物を保持面で保持するチャックテーブルと、該チャックテーブルで保持した被加工物を加工する加工手段と、該チャックテーブルに被加工物を搬入し、又は該チャックテーブルから被加工物を搬出する搬送手段と、を備え、
該チャックテーブルは、被加工物を磁力で保持する第1磁力保持部を該保持面側に有し、
該搬送手段は、被加工物又は被加工物を支持する支持部材を磁力で保持する第2磁力保持部を有することを特徴とする加工装置。 - 該第1磁力保持部又は該第2磁力保持部は、電磁石を有することを特徴とする請求項1記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231243A JP6579930B2 (ja) | 2015-11-27 | 2015-11-27 | 加工装置 |
TW105132909A TWI708657B (zh) | 2015-11-27 | 2016-10-12 | 加工裝置 |
KR1020160146508A KR102486302B1 (ko) | 2015-11-27 | 2016-11-04 | 가공 장치 |
CN201610987077.1A CN107068606B (zh) | 2015-11-27 | 2016-11-09 | 加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231243A JP6579930B2 (ja) | 2015-11-27 | 2015-11-27 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017098471A true JP2017098471A (ja) | 2017-06-01 |
JP6579930B2 JP6579930B2 (ja) | 2019-09-25 |
Family
ID=58803855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015231243A Active JP6579930B2 (ja) | 2015-11-27 | 2015-11-27 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6579930B2 (ja) |
KR (1) | KR102486302B1 (ja) |
CN (1) | CN107068606B (ja) |
TW (1) | TWI708657B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019111628A (ja) * | 2017-12-25 | 2019-07-11 | 株式会社ディスコ | 切削装置 |
JP2019140172A (ja) * | 2018-02-07 | 2019-08-22 | 株式会社ディスコ | 加工装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6765751B2 (ja) * | 2016-06-21 | 2020-10-07 | 株式会社ディスコ | 被加工物の保持機構及び加工装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63159836U (ja) * | 1987-04-08 | 1988-10-19 | ||
JPH08264617A (ja) * | 1995-03-27 | 1996-10-11 | Kawasaki Steel Corp | 半導体装置の搬送方法および搬送装置 |
JP2008103648A (ja) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | 半導体装置の製造装置および半導体装置の製造方法 |
JP2015012263A (ja) * | 2013-07-02 | 2015-01-19 | 株式会社ディスコ | 加工装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004200440A (ja) | 2002-12-19 | 2004-07-15 | Disco Abrasive Syst Ltd | 基板保持システム |
JP4590314B2 (ja) | 2005-06-22 | 2010-12-01 | 三菱電機株式会社 | ウェハキャリア |
JP2009206166A (ja) * | 2008-02-26 | 2009-09-10 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2010129622A (ja) * | 2008-11-26 | 2010-06-10 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP5466964B2 (ja) * | 2010-02-08 | 2014-04-09 | 株式会社ディスコ | ワーク保持機構 |
JP5947010B2 (ja) | 2011-09-15 | 2016-07-06 | 株式会社ディスコ | 分割装置 |
JP6050626B2 (ja) * | 2012-07-03 | 2016-12-21 | 株式会社ディスコ | 切削装置のチャックテーブル機構 |
JP2014116486A (ja) | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP6261967B2 (ja) * | 2013-12-03 | 2018-01-17 | 株式会社ディスコ | 加工装置 |
JP6325335B2 (ja) * | 2014-05-13 | 2018-05-16 | 株式会社ディスコ | 切削装置のチャックテーブル |
-
2015
- 2015-11-27 JP JP2015231243A patent/JP6579930B2/ja active Active
-
2016
- 2016-10-12 TW TW105132909A patent/TWI708657B/zh active
- 2016-11-04 KR KR1020160146508A patent/KR102486302B1/ko active IP Right Grant
- 2016-11-09 CN CN201610987077.1A patent/CN107068606B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63159836U (ja) * | 1987-04-08 | 1988-10-19 | ||
JPH08264617A (ja) * | 1995-03-27 | 1996-10-11 | Kawasaki Steel Corp | 半導体装置の搬送方法および搬送装置 |
JP2008103648A (ja) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | 半導体装置の製造装置および半導体装置の製造方法 |
JP2015012263A (ja) * | 2013-07-02 | 2015-01-19 | 株式会社ディスコ | 加工装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019111628A (ja) * | 2017-12-25 | 2019-07-11 | 株式会社ディスコ | 切削装置 |
TWI806950B (zh) * | 2017-12-25 | 2023-07-01 | 日商迪思科股份有限公司 | 切削裝置 |
JP2019140172A (ja) * | 2018-02-07 | 2019-08-22 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN107068606B (zh) | 2022-02-18 |
KR20170062377A (ko) | 2017-06-07 |
JP6579930B2 (ja) | 2019-09-25 |
CN107068606A (zh) | 2017-08-18 |
TW201720573A (zh) | 2017-06-16 |
TWI708657B (zh) | 2020-11-01 |
KR102486302B1 (ko) | 2023-01-06 |
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