JP4342992B2 - レーザー加工装置のチャックテーブル - Google Patents
レーザー加工装置のチャックテーブル Download PDFInfo
- Publication number
- JP4342992B2 JP4342992B2 JP2004076064A JP2004076064A JP4342992B2 JP 4342992 B2 JP4342992 B2 JP 4342992B2 JP 2004076064 A JP2004076064 A JP 2004076064A JP 2004076064 A JP2004076064 A JP 2004076064A JP 4342992 B2 JP4342992 B2 JP 4342992B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- chuck table
- workpiece
- semiconductor wafer
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 description 61
- 235000012431 wafers Nutrition 0.000 description 58
- 238000005520 cutting process Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 10
- 239000012212 insulator Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0452—Orientable fixtures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Description
該被加工物保持領域が被加工物と相似形で且つ被加工物よりも小さく形成されており、該被加工物保持領域の外側周囲に緩衝溝が形成されている、
ことを特徴とするレーザー加工装置のチャックテーブルが提供される。
図6にはレーザー加工される被加工物としての半導体ウエーハの斜視図が示されており、図7には図6に示す半導体ウエーハの分割予定ラインにおける拡大断面図が示されている。図6および図7に示す半導体ウエーハ20は、シリコンウエーハからなる半導体基板21の表面21aに格子状に配列された複数の分割予定ライン211によって複数の領域が区画され、この区画された領域にIC、LSI等の回路212が形成されている。なお、この半導体ウエーハ20は、半導体基板21の表面に低誘電率絶縁体被膜213が積層して形成されている。
このようにしてダイシングフレーム25にダイシングテープ26を介して支持された半導体ウエーハ20は、図1に示すレーザー加工装置のチャックテーブル機構3を構成するチャックテーブル36の被加工物保持領域360上に表面21aを上側にして搬送され、該被加工物保持領域360上にダイシングテープ26を介して載置される。そして、図示しない吸引手段を作動することにより、半導体ウエーハ20は被加工物保持領域360上 に吸引保持される。このとき、被加工物保持領域360は上述したように半導体ウエーハ20と相似形でその外周が半導体ウエーハ20の外周より僅かにちいさく形成されているので、半導体ウエーハ20の外周部は被加工物保持領域360の外周縁から外方にはみ出して環状の緩衝溝366の上方に位置付けられる。また、ダイシングフレーム25はチャックテーブル36に配設されたクランプ機構368によって固定される。このようにして半導体ウエーハ20を吸引保持したチャックテーブル36は、移動手段37の作動により案内レール31、31に沿って移動せしめられレーザー光線照射ユニット5に配設された撮像手段6の直下に位置付けられる。
光源 ;YAGレーザーまたはYVO4レーザー
波長 ;355nm
出力 ;0.5W
繰り返し周波数:50kHz
パルス幅 ;10nsec
集光スポット径;φ9.2μm
加工送り速度 ;100mm/秒
3:チャックテーブル機構
31:案内レール
36:チャックテーブル
360:被加工物保持領域
362:吸着チャック
367:レーザー光線緩衝溝
362:レーザー光線吸収部材
4:レーザー光線照射ユニット支持機構
41:案内レール
42:可動支持基台
5:レーザー光線照射ユニット
51:ユニットホルダ
52:レーザー光線加工手段
522:レーザー光線発振手段
523:レーザー光線変調手段
524:集光器
6:撮像手段
20:半導体ウエーハ
21:半導体基板
211:分割予定ライン
212:回路
213:低誘電率絶縁体被膜
Claims (2)
- 被加工物を保持する被加工物保持領域を備えたレーザー加工装置のチャックテーブルにおいて、
該被加工物保持領域が被加工物と相似形で且つ被加工物よりも小さく形成されており、該被加工物保持領域の外側周囲に緩衝溝が形成されている、
ことを特徴とするレーザー加工装置のチャックテーブル。 - 該緩衝溝の底面には、レーザー光線吸収部材が配設されている、請求項1記載のレーザー加工装置のチャックテーブル。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004076064A JP4342992B2 (ja) | 2004-03-17 | 2004-03-17 | レーザー加工装置のチャックテーブル |
US11/078,621 US7649157B2 (en) | 2004-03-17 | 2005-03-14 | Chuck table for use in a laser beam processing machine |
DE102005012144A DE102005012144B4 (de) | 2004-03-17 | 2005-03-16 | Einspanntisch zur Verwendung in einer Laserstrahlbearbeitungsmaschine |
CN2005100551147A CN1669720B (zh) | 2004-03-17 | 2005-03-17 | 用于激光束加工机中的卡盘工作台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004076064A JP4342992B2 (ja) | 2004-03-17 | 2004-03-17 | レーザー加工装置のチャックテーブル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005262249A JP2005262249A (ja) | 2005-09-29 |
JP4342992B2 true JP4342992B2 (ja) | 2009-10-14 |
Family
ID=34985103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004076064A Expired - Lifetime JP4342992B2 (ja) | 2004-03-17 | 2004-03-17 | レーザー加工装置のチャックテーブル |
Country Status (4)
Country | Link |
---|---|
US (1) | US7649157B2 (ja) |
JP (1) | JP4342992B2 (ja) |
CN (1) | CN1669720B (ja) |
DE (1) | DE102005012144B4 (ja) |
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JP4782544B2 (ja) * | 2005-11-02 | 2011-09-28 | 株式会社ディスコ | レーザー加工装置 |
JP4907965B2 (ja) | 2005-11-25 | 2012-04-04 | 浜松ホトニクス株式会社 | レーザ加工方法 |
GB2434913A (en) * | 2006-02-02 | 2007-08-08 | Xsil Technology Ltd | Support for wafer singulation |
JP2007275962A (ja) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP4847784B2 (ja) * | 2006-04-28 | 2011-12-28 | 株式会社ディスコ | チャックテーブルからのウェーハの取り外し方法 |
DE102007015767A1 (de) * | 2007-03-30 | 2008-10-02 | Oerlikon Optics UK Ltd., Yarnton | Methode zum Laserritzen von Solarzellen |
DE102007033242A1 (de) | 2007-07-12 | 2009-01-15 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser |
US9039487B2 (en) * | 2008-08-07 | 2015-05-26 | Fuji Manufacturing Co., Ltd. | Blasting method and apparatus having abrasive recovery system, processing method of thin-film solar cell panel, and thin-film solar cell panel processed by the method |
KR101041137B1 (ko) * | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
KR20100107253A (ko) * | 2009-03-25 | 2010-10-05 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
JP5394211B2 (ja) * | 2009-11-26 | 2014-01-22 | 株式会社ディスコ | レーザ加工装置 |
JP5504021B2 (ja) * | 2010-03-17 | 2014-05-28 | 株式会社ディスコ | レーザー加工方法 |
JP5240301B2 (ja) * | 2011-01-25 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | 被加工物載置固定用テーブルおよび被加工物載置固定用ガラスチャック |
JP5839383B2 (ja) * | 2011-03-18 | 2016-01-06 | 株式会社ディスコ | ウエーハの加工方法 |
CN102528300B (zh) * | 2011-12-28 | 2015-08-19 | 北京工业大学 | 吸盘式装夹装置 |
JP5967985B2 (ja) * | 2012-03-12 | 2016-08-10 | 株式会社ディスコ | レーザー加工方法 |
JP2014072510A (ja) | 2012-10-02 | 2014-04-21 | Disco Abrasive Syst Ltd | チャックテーブル |
JP6054161B2 (ja) * | 2012-12-13 | 2016-12-27 | 株式会社ディスコ | レーザ加工方法 |
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JP6385131B2 (ja) * | 2014-05-13 | 2018-09-05 | 株式会社ディスコ | ウェーハの加工方法 |
JP6815138B2 (ja) * | 2016-09-06 | 2021-01-20 | 株式会社ディスコ | 吸引保持システム |
JP6870974B2 (ja) * | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | 被加工物の分割方法 |
JP6767253B2 (ja) * | 2016-12-13 | 2020-10-14 | 株式会社ディスコ | レーザー加工装置 |
JP6938212B2 (ja) | 2017-05-11 | 2021-09-22 | 株式会社ディスコ | 加工方法 |
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CN112872681A (zh) * | 2021-01-13 | 2021-06-01 | 谭传选 | 一种汽车焊装车身固定装置 |
CN112935576B (zh) * | 2021-01-25 | 2023-09-01 | 深圳市大族半导体装备科技有限公司 | 一种激光加工调焦系统及其调焦方法 |
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JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP2002192380A (ja) * | 2000-12-27 | 2002-07-10 | Jsr Corp | ハンダペースト組成物 |
JP2003002677A (ja) * | 2001-06-22 | 2003-01-08 | Seiko Epson Corp | レーザ割断用支持テーブル、レーザ割断装置、レーザ割断方法、及び、液晶パネルの製造方法 |
JP2003320466A (ja) | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | レーザビームを使用した加工機 |
US6806544B2 (en) * | 2002-11-05 | 2004-10-19 | New Wave Research | Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
JP3914840B2 (ja) | 2002-07-26 | 2007-05-16 | カルプ工業株式会社 | 混練押出機 |
JP2004322168A (ja) * | 2003-04-25 | 2004-11-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2005251882A (ja) * | 2004-03-03 | 2005-09-15 | Disco Abrasive Syst Ltd | レーザー加工装置 |
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2004
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- 2005-03-14 US US11/078,621 patent/US7649157B2/en active Active
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US20050205531A1 (en) | 2005-09-22 |
JP2005262249A (ja) | 2005-09-29 |
DE102005012144A1 (de) | 2005-11-03 |
US7649157B2 (en) | 2010-01-19 |
DE102005012144B4 (de) | 2011-08-18 |
CN1669720B (zh) | 2012-02-22 |
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