JP6767253B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
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- JP6767253B2 JP6767253B2 JP2016241591A JP2016241591A JP6767253B2 JP 6767253 B2 JP6767253 B2 JP 6767253B2 JP 2016241591 A JP2016241591 A JP 2016241591A JP 2016241591 A JP2016241591 A JP 2016241591A JP 6767253 B2 JP6767253 B2 JP 6767253B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Description
[dmax−dmin]/2=ずれ量 ・・・・・・・(1)
レーザー光線の波長 :1064nm
繰り返し周波数 :10kHz
平均出力 :1.0W
加工送り速度 :2000mm/秒
2:静止基台
3:保持テーブル機構
31、31:Y軸案内レール
32:X軸テーブル
322:X軸案内レール
33:移動基台
34:チャックテーブル
35:吸着チャック
36:Y軸方向移動手段
361:Y軸リニアレール
362:Y軸コイル可動子
37:X軸方向移動手段
371:X軸リニアレール
4:レーザー光線照射手段
43:撮像手段
5:仮置手段
51:仮置テーブル
51a:吸引孔
52:外周検出部
52a:開口部
6:搬出手段
60:搬出機構載置台
61:搬出機構
611:搬出用移動基台
612:円筒部材
613a:第1のアーム
613b:第2のアーム
614:ロボットハンド
62:搬出機構移動手段
621:搬出用案内レール
622:リニアレール
623:コイル可動子
7:カセット載置機構
71:カセットテーブル
72a:加工前カセット
72b:加工済カセット
8:搬送手段
81:ケーシング
82:開口孔
83:搬送アーム
84:ロッド
85:吸着パッド
Claims (5)
- 板状の被加工物にレーザー光線を照射して加工を施すレーザー加工装置であって、
複数の被加工物を収容するカセットを載置するカセットテーブルと、
該カセットテーブルに載置されたカセットから被加工物を搬出する搬出手段と、
該搬出手段によって搬出された該被加工物を仮置きする仮置手段と、
該仮置手段からチャックテーブルまで被加工物を搬送する搬送手段と、
該チャックテーブルに保持された被加工物の加工すべき領域を検出する撮像手段と、
該チャックテーブルに保持された被加工物にレーザー光線を照射する集光器を備えたレーザー光線照射手段と、から少なくとも構成され、
該搬出手段は、該レーザー光線照射手段による加工済みの被加工物を該チャックテーブルから搬出し、該カセットテーブルに載置されたカセットに収容するレーザー加工装置。 - 該仮置手段に対して該搬出手段が配設された方向をX軸方向とし、該X軸方向と直交する方向をY軸方向とした場合、該仮置手段に対し該チャックテーブルが被加工物を受け取る受け取り位置はY軸方向に設定され、
該チャックテーブルの該受け取り位置に対し該集光器はX軸方向に配設され、
該搬送手段は、該仮置手段に載置された被加工物をY軸方向に位置付けられた該チャックテーブルまで搬送し、
該チャックテーブルは、X軸方向移動手段により、該受け取り位置と該集光器から照射されるレーザー光線により被加工物が加工される加工位置との間を移動可能に構成され、
該搬出手段は、Y軸方向に配設された搬出用案内レールと、該搬出用案内レールに移動可能に配設された搬出用移動基台と、該搬出用移動基台に配設されたロボットハンドとから構成され、
該ロボットハンドは、該カセットテーブルと該仮置手段との間に位置付けられてカセットから被加工物を搬出して該仮置手段に仮置きし、該受け取り位置に位置付けられた該チャックテーブルに隣接して位置付けられて該チャックテーブルから加工済みの被加工物を搬出してカセットに収容する請求項1のレーザー加工装置。 - 該仮置手段は、回転可能な仮置テーブルと、該仮置テーブルに仮置きされた被加工物の外周を上下で挟む位置に発光素子、受光素子を備えた外周検出部と、を含み構成され、
該外周検出部は、該仮置テーブルの回転によって被加工物である円形を呈するウエーハの外周と仮置テーブルの外周との距離の最大値と最小値、及び該最大値と最小値を示す外周位置と、該ウエーハの結晶方位を示すノッチの位置とを検出するものであり、該ノッチが検出された角度を検出し、該最大値と該最小値とを示す位置を結ぶ方向をY軸方向に位置付けてウエーハの中心を求め、
該搬送手段によって該チャックテーブルに該ウエーハを搬送して載置する際に、該チャックテーブルの回転中心にウエーハの中心を位置付ける請求項1に記載のレーザー加工装置。 - 該チャックテーブルを移動する該X軸方向移動手段は、X軸方向に配設されたX軸案内レールと、該X軸案内レールに移動可能に取り付けられた移動基台と、該移動基台を移動する駆動源と、から少なくとも構成され、
該移動基台は、炭素繊維強化プラスチックで形成されていて、該チャックテーブルを支持する請求項2に記載のレーザー加工装置。 - 該仮置テーブルは、透明プレートで構成され、該外周検出部は該ウエーハの大きさに対応して径方向に進退可能に構成されている請求項3に記載のレーザー加工装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016241591A JP6767253B2 (ja) | 2016-12-13 | 2016-12-13 | レーザー加工装置 |
TW106138109A TWI733937B (zh) | 2016-12-13 | 2017-11-03 | 雷射加工裝置 |
CN201711202021.1A CN108213725B (zh) | 2016-12-13 | 2017-11-27 | 激光加工装置 |
SG10201709844WA SG10201709844WA (en) | 2016-12-13 | 2017-11-28 | Laser processing apparatus |
MYPI2017704596A MY185737A (en) | 2016-12-13 | 2017-11-29 | Laser processing apparatus |
KR1020170161903A KR102245112B1 (ko) | 2016-12-13 | 2017-11-29 | 레이저 가공 장치 |
DE102017222478.9A DE102017222478B4 (de) | 2016-12-13 | 2017-12-12 | Laserbearbeitungsvorrichtung |
US15/839,276 US10695862B2 (en) | 2016-12-13 | 2017-12-12 | Laser processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016241591A JP6767253B2 (ja) | 2016-12-13 | 2016-12-13 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018098363A JP2018098363A (ja) | 2018-06-21 |
JP6767253B2 true JP6767253B2 (ja) | 2020-10-14 |
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JP2016241591A Active JP6767253B2 (ja) | 2016-12-13 | 2016-12-13 | レーザー加工装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10695862B2 (ja) |
JP (1) | JP6767253B2 (ja) |
KR (1) | KR102245112B1 (ja) |
CN (1) | CN108213725B (ja) |
DE (1) | DE102017222478B4 (ja) |
MY (1) | MY185737A (ja) |
SG (1) | SG10201709844WA (ja) |
TW (1) | TWI733937B (ja) |
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KR102654506B1 (ko) * | 2018-10-26 | 2024-04-03 | 세메스 주식회사 | 웨이퍼 분리 방법 및 웨이퍼 분리 장치 |
JP7109863B2 (ja) * | 2018-11-30 | 2022-08-01 | 株式会社ディスコ | 搬送システム |
JP7355618B2 (ja) * | 2018-12-04 | 2023-10-03 | 株式会社ディスコ | ウエーハ分割装置 |
JP7246904B2 (ja) * | 2018-12-05 | 2023-03-28 | 株式会社ディスコ | 搬送装置 |
JP7162513B2 (ja) * | 2018-12-07 | 2022-10-28 | 株式会社ディスコ | 加工装置 |
JP7312579B2 (ja) * | 2019-03-15 | 2023-07-21 | 株式会社東京精密 | 偏心量検出装置及び偏心量検出方法 |
JP7399552B2 (ja) * | 2019-03-27 | 2023-12-18 | 株式会社オーク製作所 | 収納体搬送装置及びレーザ加工装置 |
JP7325897B2 (ja) * | 2019-04-18 | 2023-08-15 | 株式会社ディスコ | 加工装置及び被加工物の加工方法 |
JP7358107B2 (ja) * | 2019-07-31 | 2023-10-10 | 株式会社ディスコ | レーザー加工装置 |
JP7350438B2 (ja) | 2019-09-09 | 2023-09-26 | 株式会社ディスコ | チャックテーブル及びチャックテーブルの製造方法 |
JP7536582B2 (ja) * | 2020-10-01 | 2024-08-20 | ニデックインスツルメンツ株式会社 | 搬送システム |
TWI766466B (zh) * | 2020-12-07 | 2022-06-01 | 上銀科技股份有限公司 | 迴轉座及迴轉工作台 |
WO2022172373A1 (ja) | 2021-02-10 | 2022-08-18 | ヤマハ発動機株式会社 | 加工装置 |
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TWI733937B (zh) | 2021-07-21 |
JP2018098363A (ja) | 2018-06-21 |
US10695862B2 (en) | 2020-06-30 |
KR20180068285A (ko) | 2018-06-21 |
US20180161920A1 (en) | 2018-06-14 |
DE102017222478B4 (de) | 2022-06-02 |
MY185737A (en) | 2021-06-02 |
TW201821206A (zh) | 2018-06-16 |
CN108213725B (zh) | 2021-07-09 |
CN108213725A (zh) | 2018-06-29 |
SG10201709844WA (en) | 2018-07-30 |
DE102017222478A1 (de) | 2018-06-14 |
KR102245112B1 (ko) | 2021-04-26 |
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