SG10201606672YA - Chuck table - Google Patents
Chuck tableInfo
- Publication number
- SG10201606672YA SG10201606672YA SG10201606672YA SG10201606672YA SG10201606672YA SG 10201606672Y A SG10201606672Y A SG 10201606672YA SG 10201606672Y A SG10201606672Y A SG 10201606672YA SG 10201606672Y A SG10201606672Y A SG 10201606672YA SG 10201606672Y A SG10201606672Y A SG 10201606672YA
- Authority
- SG
- Singapore
- Prior art keywords
- chuck table
- chuck
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015173976A JP6576172B2 (en) | 2015-09-03 | 2015-09-03 | Chuck table |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201606672YA true SG10201606672YA (en) | 2017-04-27 |
Family
ID=58055160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201606672YA SG10201606672YA (en) | 2015-09-03 | 2016-08-11 | Chuck table |
Country Status (8)
Country | Link |
---|---|
US (1) | US10090186B2 (en) |
JP (1) | JP6576172B2 (en) |
KR (1) | KR102418169B1 (en) |
CN (1) | CN106505027B (en) |
DE (1) | DE102016215891A1 (en) |
MY (1) | MY179208A (en) |
SG (1) | SG10201606672YA (en) |
TW (1) | TWI689036B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9917000B2 (en) * | 2015-10-01 | 2018-03-13 | Infineon Technologies Ag | Wafer carrier, method for manufacturing the same and method for carrying a wafer |
JP6934395B2 (en) * | 2017-11-06 | 2021-09-15 | 株式会社ディスコ | Dividing device and dividing method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2730370A (en) * | 1954-08-13 | 1956-01-10 | George F Brewster | Work holding chuck |
US3727282A (en) * | 1970-02-05 | 1973-04-17 | Burroughs Corp | Semiconductor handling apparatus |
US3743148A (en) * | 1971-03-08 | 1973-07-03 | H Carlson | Wafer breaker |
US4410168A (en) * | 1980-07-11 | 1983-10-18 | Asta, Ltd. | Apparatus for manipulating a stretched resilient diaphragm |
JPH0731245U (en) * | 1993-11-17 | 1995-06-13 | 株式会社森田工業 | Chuck |
US5624299A (en) * | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
KR0174773B1 (en) * | 1995-03-31 | 1999-04-01 | 모리시다 요이치 | Inspecting method for semiconductor device |
JP3662404B2 (en) * | 1997-11-19 | 2005-06-22 | 芝浦メカトロニクス株式会社 | Wafer sheet stretching apparatus and pellet bonding apparatus using the same |
JP2000180469A (en) * | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | Contactor for semiconductor device, tester using contactor for semiconductor device, testing method using contactor for semiconductor device and method for cleaning contactor for semiconductor device |
JP3408805B2 (en) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | Cutting origin region forming method and workpiece cutting method |
US6716084B2 (en) * | 2001-01-11 | 2004-04-06 | Nutool, Inc. | Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
US6939206B2 (en) * | 2001-03-12 | 2005-09-06 | Asm Nutool, Inc. | Method and apparatus of sealing wafer backside for full-face electrochemical plating |
JP4541824B2 (en) * | 2004-10-14 | 2010-09-08 | リンテック株式会社 | Non-contact type adsorption holding device |
JP4630692B2 (en) * | 2005-03-07 | 2011-02-09 | 株式会社ディスコ | Laser processing method |
US7608523B2 (en) * | 2005-08-26 | 2009-10-27 | Disco Corporation | Wafer processing method and adhesive tape used in the wafer processing method |
JP4874602B2 (en) * | 2005-08-26 | 2012-02-15 | 株式会社ディスコ | Adhesive tape used for wafer processing method and wafer processing method |
US20090075459A1 (en) * | 2007-09-06 | 2009-03-19 | Kabushiki Kaisha Shinkawa | Apparatus and method for picking-up semiconductor dies |
JP5361634B2 (en) * | 2009-09-25 | 2013-12-04 | 信越ポリマー株式会社 | Chuck table for semiconductor wafer and method for processing semiconductor wafer |
JP6004725B2 (en) * | 2012-04-24 | 2016-10-12 | 株式会社ディスコ | Chuck table mechanism of processing equipment |
JP2014072510A (en) * | 2012-10-02 | 2014-04-21 | Disco Abrasive Syst Ltd | Chuck table |
JP6061629B2 (en) * | 2012-11-07 | 2017-01-18 | 株式会社ディスコ | Processing equipment |
JP6208956B2 (en) * | 2013-03-04 | 2017-10-04 | 株式会社ディスコ | Annular convex removing device |
JP6205231B2 (en) * | 2013-10-08 | 2017-09-27 | 株式会社ディスコ | Cutting equipment |
-
2015
- 2015-09-03 JP JP2015173976A patent/JP6576172B2/en active Active
-
2016
- 2016-08-03 TW TW105124646A patent/TWI689036B/en active
- 2016-08-11 SG SG10201606672YA patent/SG10201606672YA/en unknown
- 2016-08-11 MY MYPI2016702934A patent/MY179208A/en unknown
- 2016-08-22 US US15/243,291 patent/US10090186B2/en active Active
- 2016-08-24 DE DE102016215891.0A patent/DE102016215891A1/en active Pending
- 2016-08-30 KR KR1020160110710A patent/KR102418169B1/en active IP Right Grant
- 2016-08-31 CN CN201610791367.9A patent/CN106505027B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN106505027A (en) | 2017-03-15 |
DE102016215891A1 (en) | 2017-03-09 |
JP6576172B2 (en) | 2019-09-18 |
JP2017050461A (en) | 2017-03-09 |
US20170069524A1 (en) | 2017-03-09 |
KR102418169B1 (en) | 2022-07-08 |
TWI689036B (en) | 2020-03-21 |
MY179208A (en) | 2020-11-01 |
US10090186B2 (en) | 2018-10-02 |
CN106505027B (en) | 2021-10-08 |
KR20170028256A (en) | 2017-03-13 |
TW201712797A (en) | 2017-04-01 |
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