JP2006029997A - 基板検査装置及び基板検査方法 - Google Patents

基板検査装置及び基板検査方法 Download PDF

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Publication number
JP2006029997A
JP2006029997A JP2004209583A JP2004209583A JP2006029997A JP 2006029997 A JP2006029997 A JP 2006029997A JP 2004209583 A JP2004209583 A JP 2004209583A JP 2004209583 A JP2004209583 A JP 2004209583A JP 2006029997 A JP2006029997 A JP 2006029997A
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Japan
Prior art keywords
inspection
substrate
unit
wiring pattern
voltage
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Pending
Application number
JP2004209583A
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English (en)
Japanese (ja)
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JP2006029997A5 (enExample
Inventor
Masami Yamamoto
正美 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2004209583A priority Critical patent/JP2006029997A/ja
Priority to TW094123344A priority patent/TW200617413A/zh
Priority to US11/182,017 priority patent/US7202690B2/en
Priority to KR1020050064414A priority patent/KR20060053842A/ko
Priority to CNA2005100848435A priority patent/CN1721868A/zh
Publication of JP2006029997A publication Critical patent/JP2006029997A/ja
Publication of JP2006029997A5 publication Critical patent/JP2006029997A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2004209583A 2001-02-19 2004-07-16 基板検査装置及び基板検査方法 Pending JP2006029997A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004209583A JP2006029997A (ja) 2004-07-16 2004-07-16 基板検査装置及び基板検査方法
TW094123344A TW200617413A (en) 2004-07-16 2005-07-11 Substrate inspection device and substrate inspecting method
US11/182,017 US7202690B2 (en) 2001-02-19 2005-07-15 Substrate inspection device and substrate inspecting method
KR1020050064414A KR20060053842A (ko) 2004-07-16 2005-07-15 기판 검사장치 및 기판 검사방법
CNA2005100848435A CN1721868A (zh) 2004-07-16 2005-07-18 基板检查装置以及基板检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004209583A JP2006029997A (ja) 2004-07-16 2004-07-16 基板検査装置及び基板検査方法

Publications (2)

Publication Number Publication Date
JP2006029997A true JP2006029997A (ja) 2006-02-02
JP2006029997A5 JP2006029997A5 (enExample) 2007-08-30

Family

ID=35896538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004209583A Pending JP2006029997A (ja) 2001-02-19 2004-07-16 基板検査装置及び基板検査方法

Country Status (4)

Country Link
JP (1) JP2006029997A (enExample)
KR (1) KR20060053842A (enExample)
CN (1) CN1721868A (enExample)
TW (1) TW200617413A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106324481A (zh) * 2016-08-23 2017-01-11 王文庆 一种用于集成电路的定位检测装置
WO2021173454A1 (en) * 2020-02-24 2021-09-02 Kla Corporation Instrumented substrate apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101021506B1 (ko) * 2007-04-10 2011-03-16 파나소닉 주식회사 반도체 디바이스의 검사 방법 및 반도체 디바이스의 검사장치
KR100868748B1 (ko) * 2007-11-26 2008-11-13 주식회사 오킨스전자 회로기판 검사장치 및 그 검사 방법
JP5406480B2 (ja) * 2008-08-08 2014-02-05 東京エレクトロン株式会社 プローブ方法及びプローブ用プログラム
JP5797502B2 (ja) * 2011-09-08 2015-10-21 日本メクトロン株式会社 導通検査装置および導通検査方法
CN102928770B (zh) * 2012-11-15 2015-04-22 昆山迈致治具科技有限公司 Fpc测试治具
JP6339834B2 (ja) * 2014-03-27 2018-06-06 東京エレクトロン株式会社 基板検査装置
CN112212782B (zh) * 2019-06-25 2023-01-17 合肥欣奕华智能机器股份有限公司 一种玻璃基板检测方法、装置及系统
CN113030703A (zh) * 2021-03-11 2021-06-25 上海伊诺尔信息电子有限公司 一种双界面智能卡模块开短路的测试装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03135778A (ja) * 1989-06-26 1991-06-10 Digital Equip Corp <Dec> 電気回路の開路／短絡試験を非接触に行う方法及び装置
JPH11509321A (ja) * 1996-07-11 1999-08-17 エクスサイト エレクトロ オプティカル システムズ リミテッド 非接触検査のための、レーザ誘導の金属プラズマ
JP2002318258A (ja) * 2001-02-19 2002-10-31 Nidec-Read Corp 回路基板の検査装置および検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03135778A (ja) * 1989-06-26 1991-06-10 Digital Equip Corp <Dec> 電気回路の開路／短絡試験を非接触に行う方法及び装置
JPH11509321A (ja) * 1996-07-11 1999-08-17 エクスサイト エレクトロ オプティカル システムズ リミテッド 非接触検査のための、レーザ誘導の金属プラズマ
JP2002318258A (ja) * 2001-02-19 2002-10-31 Nidec-Read Corp 回路基板の検査装置および検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106324481A (zh) * 2016-08-23 2017-01-11 王文庆 一种用于集成电路的定位检测装置
WO2021173454A1 (en) * 2020-02-24 2021-09-02 Kla Corporation Instrumented substrate apparatus
US11668601B2 (en) 2020-02-24 2023-06-06 Kla Corporation Instrumented substrate apparatus
TWI871439B (zh) * 2020-02-24 2025-02-01 美商科磊股份有限公司 儀器化基板設備，製造儀器化基板設備之方法，以及光電感測器

Also Published As

Publication number Publication date
KR20060053842A (ko) 2006-05-22
CN1721868A (zh) 2006-01-18
TW200617413A (en) 2006-06-01

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