JP2006029997A5 - - Google Patents
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- Publication number
- JP2006029997A5 JP2006029997A5 JP2004209583A JP2004209583A JP2006029997A5 JP 2006029997 A5 JP2006029997 A5 JP 2006029997A5 JP 2004209583 A JP2004209583 A JP 2004209583A JP 2004209583 A JP2004209583 A JP 2004209583A JP 2006029997 A5 JP2006029997 A5 JP 2006029997A5
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- substrate
- unit
- voltage
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 167
- 239000000758 substrate Substances 0.000 claims description 123
- 239000002245 particle Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 24
- 230000006837 decompression Effects 0.000 claims description 21
- 238000010521 absorption reaction Methods 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 239000012780 transparent material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004209583A JP2006029997A (ja) | 2004-07-16 | 2004-07-16 | 基板検査装置及び基板検査方法 |
| TW094123344A TW200617413A (en) | 2004-07-16 | 2005-07-11 | Substrate inspection device and substrate inspecting method |
| US11/182,017 US7202690B2 (en) | 2001-02-19 | 2005-07-15 | Substrate inspection device and substrate inspecting method |
| KR1020050064414A KR20060053842A (ko) | 2004-07-16 | 2005-07-15 | 기판 검사장치 및 기판 검사방법 |
| CNA2005100848435A CN1721868A (zh) | 2004-07-16 | 2005-07-18 | 基板检查装置以及基板检查方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004209583A JP2006029997A (ja) | 2004-07-16 | 2004-07-16 | 基板検査装置及び基板検査方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006029997A JP2006029997A (ja) | 2006-02-02 |
| JP2006029997A5 true JP2006029997A5 (enExample) | 2007-08-30 |
Family
ID=35896538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004209583A Pending JP2006029997A (ja) | 2001-02-19 | 2004-07-16 | 基板検査装置及び基板検査方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006029997A (enExample) |
| KR (1) | KR20060053842A (enExample) |
| CN (1) | CN1721868A (enExample) |
| TW (1) | TW200617413A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101021506B1 (ko) * | 2007-04-10 | 2011-03-16 | 파나소닉 주식회사 | 반도체 디바이스의 검사 방법 및 반도체 디바이스의 검사장치 |
| KR100868748B1 (ko) * | 2007-11-26 | 2008-11-13 | 주식회사 오킨스전자 | 회로기판 검사장치 및 그 검사 방법 |
| JP5406480B2 (ja) * | 2008-08-08 | 2014-02-05 | 東京エレクトロン株式会社 | プローブ方法及びプローブ用プログラム |
| JP5797502B2 (ja) * | 2011-09-08 | 2015-10-21 | 日本メクトロン株式会社 | 導通検査装置および導通検査方法 |
| CN102928770B (zh) * | 2012-11-15 | 2015-04-22 | 昆山迈致治具科技有限公司 | Fpc测试治具 |
| JP6339834B2 (ja) * | 2014-03-27 | 2018-06-06 | 東京エレクトロン株式会社 | 基板検査装置 |
| CN106324481B (zh) * | 2016-08-23 | 2018-11-27 | 管仙福 | 一种用于集成电路的定位检测装置 |
| CN112212782B (zh) * | 2019-06-25 | 2023-01-17 | 合肥欣奕华智能机器股份有限公司 | 一种玻璃基板检测方法、装置及系统 |
| US11668601B2 (en) | 2020-02-24 | 2023-06-06 | Kla Corporation | Instrumented substrate apparatus |
| CN113030703A (zh) * | 2021-03-11 | 2021-06-25 | 上海伊诺尔信息电子有限公司 | 一种双界面智能卡模块开短路的测试装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4970461A (en) * | 1989-06-26 | 1990-11-13 | Lepage Andrew J | Method and apparatus for non-contact opens/shorts testing of electrical circuits |
| JPH11509321A (ja) * | 1996-07-11 | 1999-08-17 | エクスサイト エレクトロ オプティカル システムズ リミテッド | 非接触検査のための、レーザ誘導の金属プラズマ |
| JP3804046B2 (ja) * | 2001-02-19 | 2006-08-02 | 日本電産リード株式会社 | 回路基板の検査装置および検査方法 |
-
2004
- 2004-07-16 JP JP2004209583A patent/JP2006029997A/ja active Pending
-
2005
- 2005-07-11 TW TW094123344A patent/TW200617413A/zh unknown
- 2005-07-15 KR KR1020050064414A patent/KR20060053842A/ko not_active Withdrawn
- 2005-07-18 CN CNA2005100848435A patent/CN1721868A/zh active Pending
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