JP2005515614A - 2回のマスキング工程で製造されるトレンチショットキーダイオード - Google Patents
2回のマスキング工程で製造されるトレンチショットキーダイオード Download PDFInfo
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- JP2005515614A JP2005515614A JP2002592178A JP2002592178A JP2005515614A JP 2005515614 A JP2005515614 A JP 2005515614A JP 2002592178 A JP2002592178 A JP 2002592178A JP 2002592178 A JP2002592178 A JP 2002592178A JP 2005515614 A JP2005515614 A JP 2005515614A
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- 230000000873 masking effect Effects 0.000 title description 5
- 239000004065 semiconductor Substances 0.000 claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 17
- 229920005591 polysilicon Polymers 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 description 32
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- FAIAAWCVCHQXDN-UHFFFAOYSA-N phosphorus trichloride Chemical compound ClP(Cl)Cl FAIAAWCVCHQXDN-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66143—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0814—Diodes only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
- H01L29/8725—Schottky diodes of the trench MOS barrier type [TMBS]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (26)
- それぞれが活性半導体領域及び終端半導体領域を画定するように延びる対向する第1及び第2の面と、該第1の面に隣接する第1の伝導性タイプを有するカソード領域と、該第2の面に隣接し、該第1の伝導性タイプを有し、該カソード領域より低い正味ドープ濃度を有するドリフト領域とを有する半導体構造体と、
上記第2の面から上記半導体構造体内部に延び、該半導体構造体内に複数のメサを画定し、上記活性半導体領域内及び上記終端半導体領域内に少なくとも1つずつ含まれる複数のトレンチと、
上記複数のトレンチ内に形成され、上記半導体構造体に隣接する第1の絶縁領域と、
上記活性半導体領域と上記終端半導体領域とを電気的に絶縁する第2の絶縁領域と、
(a)上記第2の面において、上記半導体構造体に隣接し、該半導体構造体にショットキー整流コンタクトし、(b)上記トレンチ内の第1の絶縁領域に隣接し、上記複数のトレンチを互いに電気的に接続するアノード電極とを備えるショットキー整流器。 - 上記第1の絶縁領域は、酸化物を含むことを特徴とする請求項1記載のショットキー整流器。
- 上記第1の絶縁領域は、酸化シリコンを含むことを特徴とする請求項2記載のショットキー整流器。
- 上記半導体は、シリコンであることを特徴とする請求項1記載のショットキー整流器。
- 上記第1の伝導性タイプは、n−型伝導性であることを特徴とする請求項1記載のショットキー整流器。
- 上記トレンチは、上記カソード領域内に延びることを特徴とする請求項1記載のショットキー整流器。
- 上記アノード電極は、ポリシリコンであることを特徴とする請求項1記載のショットキー整流器。
- 上記ポリシリコンは、上記トレンチを実質的に埋めていることを特徴とする請求項7記載のショットキー整流器。
- 上記第2の絶縁領域は、LOCOS領域であることを特徴とする請求項1記載のショットキー整流器。
- 上記半導体構造体は、基板と、該基板上に成長されたエピタキシャル半導体層とを備えることを特徴とする請求項1記載のショットキー整流器。
- それぞれが活性半導体領域及び終端半導体領域を画定するように延びる対向する第1及び第2の面と、該第1の面に隣接する第1の伝導性タイプを有するカソード領域と、該第2の面に隣接し、該第1の伝導性タイプを有し、該カソード領域より低い正味ドープ濃度を有するドリフト領域とを有する半導体構造体を形成する工程と、
上記第2の面から上記半導体構造体内部に延び、該半導体構造体内に複数のメサを画定し、上記活性半導体領域内及び上記終端半導体領域内に少なくとも1つずつ含まれる複数のトレンチを形成する工程と、
上記複数のトレンチ内に、上記半導体構造体に隣接する第1の絶縁領域を形成する工程と、
上記活性半導体領域と上記終端半導体領域とを電気的に絶縁する第2の絶縁領域を形成する工程と、
(a)上記第2の面において、上記半導体構造体に隣接し、該半導体構造体にショットキー整流コンタクトし、(b)上記トレンチ内の第1の絶縁領域に隣接し、上記複数のトレンチを互いに電気的に接続するアノード電極を形成する工程とを有するショットキー整流器の製造方法。 - 上記半導体構造体の第1の面にカソード電極を形成する工程を更に有する請求項11記載のショットキー整流器の製造方法。
- 上記半導体構造体を形成する工程は、上記カソード領域に対応する半導体基板を準備する工程と、該半導体基板上に、上記ドリフト領域に対応するエピタキシャル半導体層を成長させる工程とを有することを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記トレンチを形成する工程は、上記半導体構造体の第2の面上にパターン化されたマスク層を形成し、該マスク層を介して該トレンチをエッチングする工程を有することを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記アノード電極を形成する工程は、上記第1の絶縁領域上にポリシリコンを蒸着させる工程を有することを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記アノード電極を形成する工程は、上記第1の絶縁領域上にポリシリコンを蒸着させる工程を有することを特徴とする請求項14記載のショットキー整流器の製造方法。
- 上記トレンチは、上記カソード領域内に延びるように形成されることを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記第1の絶縁領域は、酸化物を含むことを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記第1の絶縁領域は、酸化シリコンを含むことを特徴とする請求項18記載のショットキー整流器の製造方法。
- 上記半導体は、シリコンであることを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記第1の伝導性タイプは、n−型伝導性であることを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記トレンチは、上記カソード領域内に延びることを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記アノード電極は、ポリシリコンであることを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記ポリシリコンは、上記トレンチを実質的に埋めていることを特徴とする請求項23記載のショットキー整流器の製造方法。
- 上記第2の絶縁領域は、LOCOS領域であることを特徴とする請求項11記載のショットキー整流器の製造方法。
- 上記半導体構造体は、基板を備え、該基板上にエピタキシャル半導体層を形成する工程を更に有することを特徴とする請求項11記載のショットキー整流器の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/862,532 US6740951B2 (en) | 2001-05-22 | 2001-05-22 | Two-mask trench schottky diode |
PCT/US2002/016096 WO2002095812A1 (en) | 2001-05-22 | 2002-05-22 | Two-mask trench schottky diode |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005515614A true JP2005515614A (ja) | 2005-05-26 |
JP2005515614A5 JP2005515614A5 (ja) | 2006-01-05 |
JP4382360B2 JP4382360B2 (ja) | 2009-12-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002592178A Expired - Lifetime JP4382360B2 (ja) | 2001-05-22 | 2002-05-22 | ショットキー整流素子及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6740951B2 (ja) |
EP (1) | EP1396015A4 (ja) |
JP (1) | JP4382360B2 (ja) |
KR (1) | KR100884078B1 (ja) |
CN (1) | CN1314082C (ja) |
TW (1) | TW571445B (ja) |
WO (1) | WO2002095812A1 (ja) |
Cited By (1)
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JP2017503353A (ja) * | 2014-01-10 | 2017-01-26 | ヴィシェイ ジェネラル セミコンダクター,エルエルシーVishay General Semiconductor,Llc | 複数電界緩和トレンチを備えた終端構造を有する高電圧用トレンチ型mosデバイス |
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US6998694B2 (en) * | 2003-08-05 | 2006-02-14 | Shye-Lin Wu | High switching speed two mask Schottky diode with high field breakdown |
US7973381B2 (en) * | 2003-09-08 | 2011-07-05 | International Rectifier Corporation | Thick field oxide termination for trench schottky device |
US7064408B2 (en) * | 2003-12-10 | 2006-06-20 | Shye-Lin Wu | Schottky barrier diode and method of making the same |
FR2864345B1 (fr) * | 2003-12-18 | 2006-03-31 | St Microelectronics Sa | Realisation de la peripherie d'une diode schottky a tranchees mos |
US7560787B2 (en) * | 2005-12-22 | 2009-07-14 | Fairchild Semiconductor Corporation | Trench field plate termination for power devices |
US8384181B2 (en) * | 2007-02-09 | 2013-02-26 | Cree, Inc. | Schottky diode structure with silicon mesa and junction barrier Schottky wells |
JP2008226906A (ja) * | 2007-03-08 | 2008-09-25 | Sharp Corp | 窒化物半導体発光素子 |
JP5531620B2 (ja) * | 2010-01-05 | 2014-06-25 | 富士電機株式会社 | 半導体装置 |
CN101800252B (zh) * | 2010-03-04 | 2012-05-30 | 无锡新洁能功率半导体有限公司 | 沟槽型肖特基势垒整流器及其制造方法 |
CN102446980A (zh) * | 2010-09-30 | 2012-05-09 | 比亚迪股份有限公司 | 一种低正向压降肖特基二极管及其制造方法 |
TWM406804U (en) * | 2011-01-31 | 2011-07-01 | Taiwan Semiconductor Co Ltd | Structure of termination trench region for Schottky diode |
JP2013030618A (ja) | 2011-07-28 | 2013-02-07 | Rohm Co Ltd | 半導体装置 |
TWI451498B (zh) * | 2011-12-28 | 2014-09-01 | Pfc Device Corp | 具快速反應速度的金氧半p-n接面二極體及其製作方法 |
CN103187271A (zh) * | 2011-12-30 | 2013-07-03 | 敦南科技股份有限公司 | 二极管结构及其制造方法 |
CN103426910B (zh) | 2012-05-24 | 2016-01-20 | 杰力科技股份有限公司 | 功率半导体元件及其边缘终端结构 |
KR101463078B1 (ko) * | 2013-11-08 | 2014-12-04 | 주식회사 케이이씨 | 쇼트키 배리어 다이오드 및 그의 제조 방법 |
EP2945192A1 (en) * | 2014-05-14 | 2015-11-18 | Nxp B.V. | Semiconductive device and associated method of manufacture |
CN104241285B (zh) * | 2014-09-30 | 2017-07-28 | 桑德斯微电子器件(南京)有限公司 | 一种肖特基势垒二极管芯片生产工艺 |
CN107204319A (zh) * | 2015-01-19 | 2017-09-26 | 苏州固锝电子股份有限公司 | 小信号用稳压半导体器件 |
CN104900719A (zh) * | 2015-05-12 | 2015-09-09 | 上海格瑞宝电子有限公司 | 一种沟槽肖特基二极管终端结构及其制备方法 |
TWI576920B (zh) * | 2015-11-20 | 2017-04-01 | 敦南科技股份有限公司 | 二極體元件及其製造方法 |
US10756189B2 (en) * | 2017-02-10 | 2020-08-25 | Mitsubishi Electric Corporation | Semiconductor device |
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2001
- 2001-05-22 US US09/862,532 patent/US6740951B2/en not_active Expired - Lifetime
-
2002
- 2002-05-21 TW TW091110667A patent/TW571445B/zh not_active IP Right Cessation
- 2002-05-22 WO PCT/US2002/016096 patent/WO2002095812A1/en active Application Filing
- 2002-05-22 CN CNB028105702A patent/CN1314082C/zh not_active Expired - Lifetime
- 2002-05-22 KR KR1020037015131A patent/KR100884078B1/ko active IP Right Grant
- 2002-05-22 JP JP2002592178A patent/JP4382360B2/ja not_active Expired - Lifetime
- 2002-05-22 EP EP02739322A patent/EP1396015A4/en not_active Withdrawn
Patent Citations (3)
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JPH08512430A (ja) * | 1993-07-06 | 1996-12-24 | ノース カロライナ ステート ユニバーシティ | Mosトレンチを有するショットキー障壁整流装置 |
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JP2002050773A (ja) * | 2000-07-31 | 2002-02-15 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
Cited By (1)
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JP2017503353A (ja) * | 2014-01-10 | 2017-01-26 | ヴィシェイ ジェネラル セミコンダクター,エルエルシーVishay General Semiconductor,Llc | 複数電界緩和トレンチを備えた終端構造を有する高電圧用トレンチ型mosデバイス |
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WO2002095812A1 (en) | 2002-11-28 |
KR20040000483A (ko) | 2004-01-03 |
KR100884078B1 (ko) | 2009-02-19 |
CN1620715A (zh) | 2005-05-25 |
TW571445B (en) | 2004-01-11 |
US6740951B2 (en) | 2004-05-25 |
CN1314082C (zh) | 2007-05-02 |
JP4382360B2 (ja) | 2009-12-09 |
US20020175342A1 (en) | 2002-11-28 |
EP1396015A1 (en) | 2004-03-10 |
EP1396015A4 (en) | 2004-12-15 |
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