JP2005510366A - 低温フラックスレスろう付けのための合金組成物および方法 - Google Patents
低温フラックスレスろう付けのための合金組成物および方法 Download PDFInfo
- Publication number
- JP2005510366A JP2005510366A JP2003547105A JP2003547105A JP2005510366A JP 2005510366 A JP2005510366 A JP 2005510366A JP 2003547105 A JP2003547105 A JP 2003547105A JP 2003547105 A JP2003547105 A JP 2003547105A JP 2005510366 A JP2005510366 A JP 2005510366A
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- JP
- Japan
- Prior art keywords
- brazing
- layer
- aluminum
- zinc
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 265
- 239000000956 alloy Substances 0.000 title claims abstract description 58
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000000203 mixture Substances 0.000 title claims description 34
- 239000011701 zinc Substances 0.000 claims abstract description 128
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 127
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 125
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 110
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 108
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 107
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 63
- 239000000945 filler Substances 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 56
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 53
- 238000000576 coating method Methods 0.000 claims abstract description 44
- 239000011248 coating agent Substances 0.000 claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 15
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 15
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 6
- 239000010951 brass Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 183
- 239000010949 copper Substances 0.000 claims description 45
- 230000001737 promoting effect Effects 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 40
- 239000012792 core layer Substances 0.000 claims description 36
- 230000004888 barrier function Effects 0.000 claims description 31
- 239000011777 magnesium Substances 0.000 claims description 29
- 229910052749 magnesium Inorganic materials 0.000 claims description 27
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 26
- 239000003607 modifier Substances 0.000 claims description 22
- 150000002739 metals Chemical class 0.000 claims description 21
- 229910000838 Al alloy Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- HEPLMSKRHVKCAQ-UHFFFAOYSA-N lead nickel Chemical compound [Ni].[Pb] HEPLMSKRHVKCAQ-UHFFFAOYSA-N 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 229910052787 antimony Inorganic materials 0.000 claims description 9
- LGRDPUAPARTXMG-UHFFFAOYSA-N bismuth nickel Chemical compound [Ni].[Bi] LGRDPUAPARTXMG-UHFFFAOYSA-N 0.000 claims description 9
- 239000011247 coating layer Substances 0.000 claims description 9
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 8
- 229910017052 cobalt Inorganic materials 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- 229910052744 lithium Inorganic materials 0.000 claims description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 229910052716 thallium Inorganic materials 0.000 claims description 5
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 5
- 238000007751 thermal spraying Methods 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 claims description 4
- WIKSRXFQIZQFEH-UHFFFAOYSA-N [Cu].[Pb] Chemical compound [Cu].[Pb] WIKSRXFQIZQFEH-UHFFFAOYSA-N 0.000 claims description 4
- 238000005056 compaction Methods 0.000 claims description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- ZOZLFBZFMZKVFW-UHFFFAOYSA-N aluminum;zinc Chemical compound [Al+3].[Zn+2] ZOZLFBZFMZKVFW-UHFFFAOYSA-N 0.000 claims 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 abstract description 7
- 239000007921 spray Substances 0.000 abstract description 2
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract 1
- 239000011133 lead Substances 0.000 description 40
- 238000007747 plating Methods 0.000 description 32
- 238000012360 testing method Methods 0.000 description 31
- 230000004907 flux Effects 0.000 description 25
- -1 zinc chloride Chemical class 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 239000011162 core material Substances 0.000 description 13
- 239000012925 reference material Substances 0.000 description 13
- 238000009736 wetting Methods 0.000 description 11
- 230000006872 improvement Effects 0.000 description 10
- 238000005304 joining Methods 0.000 description 10
- 230000005496 eutectics Effects 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 238000005266 casting Methods 0.000 description 7
- 238000004512 die casting Methods 0.000 description 7
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 6
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 6
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 239000000446 fuel Substances 0.000 description 6
- 229910001297 Zn alloy Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011135 tin Substances 0.000 description 5
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 229910000676 Si alloy Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- FJMNNXLGOUYVHO-UHFFFAOYSA-N aluminum zinc Chemical compound [Al].[Zn] FJMNNXLGOUYVHO-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 229940071182 stannate Drugs 0.000 description 4
- 125000005402 stannate group Chemical group 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- 229910018125 Al-Si Inorganic materials 0.000 description 3
- 229910018520 Al—Si Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010306 acid treatment Methods 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 235000017281 sodium acetate Nutrition 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005246 galvanizing Methods 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229940046892 lead acetate Drugs 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- 229910001250 2024 aluminium alloy Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910001340 Leaded brass Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- MUSRGMLMSNQRCM-UHFFFAOYSA-N [Co].[Ni].[Bi] Chemical compound [Co].[Ni].[Bi] MUSRGMLMSNQRCM-UHFFFAOYSA-N 0.000 description 1
- IGHYBPMXKIHDRI-UHFFFAOYSA-N [Co].[Pb].[Ni] Chemical compound [Co].[Pb].[Ni] IGHYBPMXKIHDRI-UHFFFAOYSA-N 0.000 description 1
- QISKFQVQJXHBKE-UHFFFAOYSA-N [Pb].[Bi].[Ni] Chemical compound [Pb].[Bi].[Ni] QISKFQVQJXHBKE-UHFFFAOYSA-N 0.000 description 1
- PYPDMIQMPWEFHX-UHFFFAOYSA-N [Pb].[Co] Chemical compound [Pb].[Co] PYPDMIQMPWEFHX-UHFFFAOYSA-N 0.000 description 1
- ONVGHWLOUOITNL-UHFFFAOYSA-N [Zn].[Bi] Chemical compound [Zn].[Bi] ONVGHWLOUOITNL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- KQNKJJBFUFKYFX-UHFFFAOYSA-N acetic acid;trihydrate Chemical compound O.O.O.CC(O)=O KQNKJJBFUFKYFX-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- CZJCMXPZSYNVLP-UHFFFAOYSA-N antimony zinc Chemical compound [Zn].[Sb] CZJCMXPZSYNVLP-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004210 cathodic protection Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 230000003750 conditioning effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005328 electron beam physical vapour deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 230000003628 erosive effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010338 mechanical breakdown Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- LGERWORIZMAZTA-UHFFFAOYSA-N silicon zinc Chemical compound [Si].[Zn] LGERWORIZMAZTA-UHFFFAOYSA-N 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 229960000999 sodium citrate dihydrate Drugs 0.000 description 1
- 235000011083 sodium citrates Nutrition 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract
Description
米国特許第5422191号では、真空ろう付けまたはCABろう付け方法のいずれかに使用することができるアルミニウムろう付け合金が記述される。ろう付け合金は、リチウム0.01〜0.30重量%と、ケイ素4〜18重量%とを含有するアルミニウム合金で被覆される。
したがって、フラックスの不在における低温ろう付けのために有用なろう付け方法およびろう付け製品への継続した必要性が存在する。
本発明は、ここに、例のみとして添付する図面を参照して記述される。
ろう付けプリフォーム
図1は、本発明によるろう付けプリフォーム(予備形成体)10の好ましい構造を構成する層を例示する概略図を含む。プリフォーム10は、中心の温度調節剤層12と、温度調節剤層12の両側にある、場合による接合層14と、接合層14の上側にあるろう付け促進層16とを備える。プリフォーム10は、シート、箔、シム、ワイヤ、またはロッドの形態にあることが好ましく、同種もしくは異種金属構成部品の間において組立体を形成させる。範囲約730〜1130°Fにある温度まで十分な時間、組立体を加熱すると、プリフォーム全体が溶融して溶加材を形成し、それが部品を一緒にろう付けする。したがって、ろう付け工程中にプリフォーム10が消費される。あまり好ましくないが、温度調節剤12の一方の側だけに接合層14とろう付け促進層16を施すことが可能である。
(溶融めっき、アーク噴霧、溶射、低温運動エネルギー金属化、またはHVLP(高速低圧)被覆方法により施している、温度調節剤層を有するろう付けシート)
図3は、コア層22(鋳造により作っておくことができる)上に直接施したロール接合された被覆層26を有する、ろう付けシート24の好ましい構造を例示しており、被覆層26は温度改質剤から構成される。上述のろう付け促進層16を、被覆層26の上面に施す。ろう付けシート24は、シートまたは形成された物体のいずれかの形態で、組立体内に組み込まれ、かつ、組立体内の1つまたは複数の他の部品にろう付けされ、他の部品は同種もしくは異種金属を含むことが好ましい。約730〜1130°Fの範囲にある温度まで十分な時間、組立体を加熱すると、低温溶融被覆層26とろう付け促進層16とが溶融して溶加材中に組み込まれ、それにより部品を一緒にろう付けする。あまり好ましくはないが、コア層20の一方の側だけに被覆層26と、ろう付け促進層16とを施すことが可能である。
ろう付け促進層16は、プリフォームに関して上述したものであり、またコア20は、溶融めっきなどにより温度調節剤層を施したろう付けシートに関して上述したものである。
この型のろう付けシート28の好ましい構造は、図4に概略的に例示しており、図2に示す構造に類似している。ろう付けシート28は、中心のコア層20と、コア層20の両側にある、任意選択的な接合層14と、接合層14の上面に電気めっきされた温度調節剤層30と、接合層14の上面のろう付け促進層16とを備えることができるのが好ましい。ろう付けシート28は、シートまたは形成された物体のいずれかの形態で、組立体内に組み込まれ、かつ、組立体内の1つまたは複数の他の部品にろう付けされ、他の部品は同種もしくは異種金属を含むことが好ましい。約730〜1130°Fの範囲内にある温度まで十分な時間、組立体を加熱すると、接合層14と、温度調節剤層30と、ろう付け促進層16とが溶融して、またコアの接触される表面、または層間材料、が溶融して、溶加材中に組み込まれ、その溶加材が部品を一緒にろう付けする。あまり好ましくないが、コア層20の一方の側だけに接合層14と、温度調節剤層30と、ろう付け促進層16とを施すことが可能である。
この型のろう付けシート32の好ましい構造は、図5に概略的に例示しており、中心のコア層20と、コア20の両側にある、任意の接合層14と、接合層14の上面にCVDもしくはPVD蒸着された温度調節剤層34と、温度調節剤層34の上面のろう付け促進層16とを含む。ろう付けシートは、シートまたは形成された物体のいずれかの形態で、組立体内に組み込まれ、かつ、組立体内の1つまたは複数の他の部品にろう付けされ、他の部品は同種もしくは異種金属を含むことが好ましい。約730〜1130°Fの範囲内にある温度まで十分な時間、組立体を加熱すると、接合層14と、温度調節剤層34と、ろう付け促進層16とが溶融して、溶加材中に組み込まれ、その溶加材が部品を一緒にろう付けする。あまり好ましくないが、コア層20の一方の側だけに接合層14と、温度調節剤層34と、ろう付け促進層16とを施すことが可能である。
本発明のさらなる実施形態では、亜鉛、アルミニウム、ケイ素、ニッケル、およびろう付け改質剤を含む粉末金属組成物の使用を開拓する。例えば、本組成物は、上述のろう付け改質剤を有する、または上述のろう付け改質剤を有しない、ニッケル粉末と組み合せた亜鉛、亜鉛−アルミニウム、亜鉛−ケイ素、亜鉛−アルミニウム−ケイ素を含むことができる。ニッケルおよびろう付け改質剤は、ニッケル−鉛、またはニッケル−ビスマス粉末として一緒に添加することが好ましい。
実施例および表
亜鉛−アルミニウム−ケイ素合金のろう付け接合のさらなる試験結果を表5に掲げる。
亜鉛およびニッケル粉末金属を使用して、ニッケル3〜4%および亜鉛96〜97%の粉末金属組成で最良のろう付け品質が得られた。内径ろう付け接合部は、外径部と比較して優れたフィレット形成を示した。亜鉛なしで、アルミニウム、ケイ素およびニッケル粉末の混合物を使用する場合、良好なろう付け接合を得るには温度および時間を増加させることが必要であることを見出した。アルミニウム50〜70%、ケイ素11〜17%、およびニッケル13〜33%の粉末組成で最良のろう付け接合が得られた。アルミニウム−ケイ素−ニッケル混合物からケイ素粉末を省いた場合、ろう付けが起らなかった。
−850°F以上の温度では、窒素中で亜鉛単独で銅をろう付けすることができる。
−この特定の場合(すなわち純亜鉛、および銅基材)、Ni皮膜を加えることは顕著な助けにはならないように見える。
−亜鉛合金溶加材、例えばZn2%アルミニウムについて、かつC260黄銅などの銅合金基材について、Ni−Pb皮膜を加えると、試験した低温に置ける濡れおよびろう付け品質を顕著に改良する。
−黄銅基材の場合、亜鉛単独は、銅に対し幾分劣ったろう付け品質を有する;黄銅中の亜鉛含量を増加させると、強度の低下または増加した脆性の原因になる;特にC260の場合、また次いでC360鉛化黄銅取付部品(示されない)の場合。NiまたはNi−Pb皮膜と組み合せてCu障壁皮膜を使用すると、850°Fでろう付けした場合、顕著に強度を増加させると思われる。おそらく、これはCuめっきが、Zn富化金属間化合物の形成を遅延させる障壁として作用するからである。本実施例では、ピロリン酸銅めっき浴から銅を電気めっきすることにより亜鉛シム溶加材に銅障壁皮膜を施した;また、いくつかの試験では、その後銅の上面にNi−Pb電気めっきを施した。
参考資料:
[P1]−Ni−Pbめっき浴
NiSO4・6H2O 70g/l
NiCl2・6H2O 30g/l
クエン酸ナトリウム・2水和物 120g/l
NH4Cl 50g/l
酢酸ナトリウム・3水和物 20g/l
NH4OH(29%溶液) 30ml
酢酸鉛・3水和物 1g/l
pH 〜8.2
温度 35℃
[P2]−亜鉛酸塩
NaOH 120g/l
ZnO 20g/l
ロッシェル塩 50g/l
FeCl3・6H2O 2g/l
NaNO3 1g/l
周囲温度
[P3]−硫酸亜鉛めっき浴
ZnSO4・6H2O 360g/l
NH4Cl 30g/l
酢酸ナトリウム・3水和物 15g/l
pH 〜5
周囲温度
[P4]−硫酸銅めっき浴
CuSO4・5H2O 200g/l
H2SO4 50g/l
Cl−、CuCl2として100ppm
周囲温度
亜鉛シムは、亜鉛100%、厚さ0.38mmとした
Claims (22)
- 低温フラックスレスろう付けのためのろう付け用製品であって、
(a)亜鉛、アルミニウム、および銅を含む群から選択される金属の少なくとも50%から構成される温度調節剤層と、
(b)ニッケルおよびコバルトを含む群から選択される1種または複数の金属を含むろう付け促進層とを備え、
ろう付けの間、温度調節剤層とろう付け促進層とが、約730〜1130°Fの範囲にある液相線温度を有する溶加材を形成する製品。 - 前記温度調節剤層が、ニッケル、ケイ素およびマグネシウムを含む群から選択される1種または複数の金属をさらに含む、請求項1に記載のろう付け用製品。
- 前記温度調節剤層が、亜鉛;亜鉛およびニッケル;亜鉛およびアルミニウム;亜鉛、アルミニウムおよびケイ素;アルミニウムおよびケイ素;アルミニウム、ケイ素およびマグネシウム;またはアルミニウム、亜鉛、ケイ素およびマグネシウムから構成される、請求項1に記載のろう付け用製品。
- 前記温度調節剤層が、約100パーセントまで、好ましくは90パーセントまでの量のアルミニウム;約100パーセントまでの量の亜鉛;および約18パーセントまでの量のケイ素を含む、請求項1に記載のろう付け用製品。
- 前記温度調節剤層が、約65パーセントまでの量のアルミニウム;約25〜100パーセントの量の亜鉛;および約18パーセントまでの量のケイ素を含む、請求項1に記載のろう付け用製品。
- 前記温度調節剤層が、約10パーセントまでの量のアルミニウム;約90〜100パーセントの量の亜鉛;および約14パーセントまでの量のケイ素を含む、請求項1に記載のろう付け用製品。
- 前記溶加材の前記液相線温度が約750〜1050°Fである、請求項1に記載のろう付け用製品。
- 前記溶加材の前記液相線温度が約790〜1050°Fである、請求項1に記載のろう付け用製品。
- 前記温度調節剤層がアルミニウムベースであり、かつ、前記製品が前記温度調節剤層と前記ろう付け促進剤層との間に接合層をさらに備える、請求項1に記載のろう付け用製品。
- 前記接合層が、亜鉛、スズ、鉛、ビスマス、ニッケル、アンチモン、マグネシウム、リチウム、およびタリウムを含む群から選択される1種または複数の金属から構成される、請求項9に記載のろう付け用製品。
- ろう付けプリフォームを含む、請求項1に記載のろう付け用製品。
- 前記温度調節剤層により被覆されるコア層をさらに備え、前記コアが1130°Fを超える溶融温度を有し、そのためろう付けの間、実質的に溶融しない、請求項1に記載のろう付け用製品。
- 前記コア層がアルミニウムまたはアルミニウム合金から構成される、請求項12に記載のろう付け用製品。
- 前記コア層が、AA3000、AA5000、AA6000、AA2000、AA8000、およびAA7000系列の合金を含む群から選択されるアルミニウム合金から構成される、請求項12に記載のろう付け用製品。
- 前記コア層が、チタン、チタン合金、青銅、黄銅、銅、高強度鋼、低炭素鋼、ステンレス鋼、ニッケル、ニッケル合金鋼、被覆されたチタン、被覆されたステンレス鋼、または被覆された鋼を含む群から選択される金属から構成される、請求項12に記載のろう付け用製品。
- 前記コア層と前記温度調節剤層との間に障壁皮膜をさらに備える、請求項12に記載のろう付け用製品。
- 前記障壁皮膜が、ニッケル、ニッケル−鉛、ニッケル−ビスマス、銅、銅−鉛、銅−ビスマス、アルミニウム、またはケイ素を含む、請求項16に記載のろう付け用製品。
- 前記コア層の上面に直接施された接合層をさらに備え、また、前記接合層と前記温度調節剤層との間に前記障壁皮膜を施している、請求項16に記載のろう付け用製品。
- ろう付けシートを含む、請求項12に記載のろう付け用製品。
- 前記温度調節剤層が、粉末金属混合物のロール接合、溶融めっき、アーク噴霧、溶射、低温運動エネルギー金属化、高速低圧被覆、電気めっき、物理蒸着、化学蒸着、およびロール圧密を含む群から選択される方法によって、または、適切な結合もしくは流動促進剤によるペースト、プリフォーム、もしくは皮膜として粉末混合物を施すことによって、コアに施される、請求項12に記載のろう付けシート。
- 障壁層が、コア層とコア上の被覆層との間に中間膜を含む、請求項16に記載のろう付け用製品。
- 低温フラックスレスろう付けのためのろう付け用製品であって、
(a)亜鉛、アルミニウム、および銅を含む群から選択される金属の少なくとも50%から構成される温度調節剤層と、
(b)ニッケル、コバルト、および鉄を含む群から選択される1種または複数の金属を含むろう付け促進層とを備え、
ろう付けの間、温度調節剤層と、ろう付け促進層と、おそらく基材とが相互作用して、溶加材を形成する製品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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PCT/CA2002/001763 WO2003045619A1 (en) | 2001-11-21 | 2002-11-21 | Alloy composition and method for low temperature fluxless brazing |
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